Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2013
09/03/2013US8524558 Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
09/03/2013US8524557 Integration technique using thermal oxide select gate dielectric for select gate and replacement gate for logic
09/03/2013US8524556 Resistor and manufacturing method thereof
09/03/2013US8524555 Susceptor with backside area of constant emissivity
09/03/2013US8524554 Semiconductor device and method for fabricating the same
09/03/2013US8524553 Integrated circuit modification using well implants
09/03/2013US8524552 Normally-off power JFET and manufacturing method thereof
09/03/2013US8524551 Method of manufacturing heterojunction bipolar transistor and heterojunction bipolar transistor
09/03/2013US8524550 Method of manufacturing semiconductor device and semiconductor device
09/03/2013US8524549 Method of fabricating thin-film transistor substrate
09/03/2013US8524546 Formation of multi-height MUGFET
09/03/2013US8524545 Simultaneous formation of FinFET and MUGFET
09/03/2013US8524544 MOSFET with a nanowire channel and fully silicided (FUSI) wrapped around gate
09/03/2013US8524543 Thyristor-based memory cells, devices and systems including the same and methods for forming the same
09/03/2013US8524542 Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
09/03/2013US8524540 Adhesion promoting composition for metal leadframes
09/03/2013US8524539 Method of manufacturing semiconductor package
09/03/2013US8524538 Integrated circuit packaging system with film assistance mold and method of manufacture thereof
09/03/2013US8524537 Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
09/03/2013US8524536 Optical film cutting method and apparatus using the same
09/03/2013US8524535 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
09/03/2013US8524534 Semiconductor device and manufacturing method thereof
09/03/2013US8524533 Room temperature metal direct bonding
09/03/2013US8524532 Integrated circuit package including an embedded power stage wherein a first field effect transistor (FET) and a second FET are electrically coupled therein
09/03/2013US8524531 System and method for improving solder joint reliability in an integrated circuit package
09/03/2013US8524529 Brace for wire bond
09/03/2013US8524528 Methods for forming resistive-switching metal oxides for nonvolatile memory elements
09/03/2013US8524527 High-performance single-crystalline N-type dopant-doped metal oxide nanowires for transparent thin film transistors and active matrix organic light-emitting diode displays
09/03/2013US8524524 Methods for forming back contact electrodes for cadmium telluride photovoltaic cells
09/03/2013US8524523 Square pillar-shaped switching element for memory device and method of manufacturing the same
09/03/2013US8524522 Microelectronic device, in particular back side illuminated image sensor, and production process
09/03/2013US8524521 Method for making wafer level image module
09/03/2013US8524520 Method for producing a structure comprising a mobile element by means of a heterogeneous sacrificial layer
09/03/2013US8524519 MEMS microphone device and method for making same
09/03/2013US8524518 Epitaxial formation support structures and associated methods
09/03/2013US8524517 Copper blend I-VII compound semiconductor light-emitting devices
09/03/2013US8524516 Liquid crystal display device and fabricating and driving method thereof
09/03/2013US8524515 Semiconductor light emitting diodes including multiple bond pads on a single semiconductor die
09/03/2013US8524514 Method for producing a non-plane element
09/03/2013US8524512 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method
09/03/2013US8524511 Method to connect a magnetic device to a CMOS transistor
09/03/2013US8524510 Method for manufacturing magnetic memory chip device
09/03/2013US8524509 Method for forming polarization reversal
09/03/2013US8524395 Nonaqueous electrolyte secondary battery anode material with a uniform metal-semiconductor alloy layer
09/03/2013US8524111 CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method
09/03/2013US8524101 Method and apparatus for manufacturing semiconductor device, and storage medium
09/03/2013US8524094 Masking material for dry etching
09/03/2013US8524093 Method for forming a deep trench
09/03/2013US8524012 Technique for the growth of planar semi-polar gallium nitride
09/03/2013US8524005 Heat-transfer structure and substrate processing apparatus
09/03/2013US8524002 Silicon wafer and method for producing the same
09/03/2013US8523636 Working object grinding method
09/03/2013US8523163 Insert for carrier board of test handler
09/03/2013US8522715 Methods and apparatus for a wide conductance kit
09/03/2013US8522430 Clustered stacked vias for reliable electronic substrates
08/2013
08/29/2013WO2013126927A2 Systems and methods for laser splitting and device layer transfer
08/29/2013WO2013126771A1 Methods and materials for anchoring gapfill metals
08/29/2013WO2013126685A1 Fluid delivery system and method
08/29/2013WO2013126600A1 Low profile, space efficient circuit shields
08/29/2013WO2013126458A1 Improved structures, devices and methods releated to copper interconnects for compound semiconductors
08/29/2013WO2013126439A1 Semiconductor wafer adapted to support transparency in partial wafer processing
08/29/2013WO2013126349A1 Systems and methods for flexible components, flexible cards, multi-layer boards, multiple sensor detectors, non-time smearing detection mechanisms and electromagnetic field generators for powered cards and devices
08/29/2013WO2013126324A1 Heating lamp having base to facilitate reduced air flow about the heating lamp
08/29/2013WO2013126306A1 Resistive switching devices and methods of formation thereof
08/29/2013WO2013126269A1 Method for package-on-package assembly with wire bonds to encapsulation surface
08/29/2013WO2013126175A1 Atomic layer deposition lithography
08/29/2013WO2013126033A2 Apparatus and methods for uniformly forming porous semiconductor on a substrate
08/29/2013WO2013126018A1 A method for plating a component
08/29/2013WO2013125733A1 Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device
08/29/2013WO2013124719A1 Methods of providing thin layers of crystalline semiconductor material, and related structures and devices
08/29/2013WO2013123970A1 Cooling system and method for cooling a heat generating unit
08/29/2013WO2013123605A1 Solution-processable tungsten oxide buffer layers and electronics comprising same
08/29/2013WO2013095712A3 Sacrificial etch protection layers for reuse of wafers after epitaxial lift off
08/29/2013WO2013087101A8 Substrate-supported circuit parts with free-standing three-dimensional structures
08/29/2013WO2013045364A3 Layered composite of a substrate film and of a layer assembly comprising a sinterable layer made of at least one metal powder and a solder layer
08/29/2013US20130227212 Refresh request queuing circuitry
08/29/2013US20130226335 Automated Cassette-To-Cassette Substrate Handling System
08/29/2013US20130226334 Multiple-points measurement
08/29/2013US20130224967 Heat treatment apparatus heating substrate by irradiation with light
08/29/2013US20130224966 Composite dielectric material doped with rare earth metal oxide and manufacturing method thereof
08/29/2013US20130224965 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
08/29/2013US20130224964 Method for Forming Dielectric Film Containing Si-C bonds by Atomic Layer Deposition Using Precursor Containing Si-C-Si bond
08/29/2013US20130224963 Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
08/29/2013US20130224962 Non-contact substrate processing
08/29/2013US20130224961 Plasma tuning rods in microwave resonator plasma sources
08/29/2013US20130224960 Methods for etching oxide layers using process gas pulsing
08/29/2013US20130224959 Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
08/29/2013US20130224958 Through hole forming method
08/29/2013US20130224957 Silicon-containing resist underlayer film forming composition having fluorine-based additive
08/29/2013US20130224956 Substrate treatment apparatus and substrate treatment method
08/29/2013US20130224955 Method for polishing aluminum/copper and titanium in damascene structures
08/29/2013US20130224954 Silicon carbide single crystal substrate
08/29/2013US20130224953 Abatement and strip process chamber in a load lock configuration
08/29/2013US20130224952 Curved Wafer Processing on Method and Apparatus
08/29/2013US20130224951 Template and substrate processing method
08/29/2013US20130224950 Method to alter silicide properties using gcib treatment
08/29/2013US20130224949 Fabrication method for improving surface planarity after tungsten chemical mechanical polishing
08/29/2013US20130224948 Methods for deposition of tungsten in the fabrication of an integrated circuit
08/29/2013US20130224947 Semiconductor device and manufacturing method thereof
08/29/2013US20130224946 Passivated Copper Chip Pads
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