Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/15/2013US20130207116 Semiconductor device and method of manufacturing the same
08/15/2013US20130207108 Critical Dimension and Pattern Recognition Structures for Devices Manufactured Using Double Patterning Techniques
08/15/2013US20130207107 Methods of of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocation
08/15/2013US20130207080 Bilayer gate dielectric with low equivalent oxide thickness for graphene devices
08/15/2013US20130207079 Tapered Nanowire Structure With Reduced Off Current
08/15/2013US20130207078 InGaN-Based Double Heterostructure Field Effect Transistor and Method of Forming the Same
08/15/2013US20130207070 Nanocomposite Material And Its Use In Optoelectronics
08/15/2013US20130207068 Memory cells and memory cell formation methods using sealing material
08/15/2013US20130207067 Vertical selection transistor, memory cell, and three-dimensional memory array structure and method for fabricating the same
08/15/2013US20130206843 Integrated circuit package
08/15/2013US20130206726 Liquid processing apparatus, liquid processing method and storage medium
08/15/2013US20130206466 Multilayer printed wiring board
08/15/2013US20130206233 Checking the stoichiometry of i-iii-vi layers for use in photovoltaic using improved electrolysis conditions
08/15/2013US20130206182 Substrate cleaning technique employing multi-phase solution
08/15/2013US20130206176 Cleaning system and cleaning method
08/15/2013US20130206067 Film deposition apparatus
08/15/2013US20130206066 Thin film deposition apparatus
08/15/2013US20130205908 Mems pressure sensor device and manufacturing method thereof
08/15/2013US20130205901 Suspended masses in micro-mechanical devices
08/14/2013EP2626908A1 Solar cell element and method for manufacturing same
08/14/2013EP2626906A2 Semiconductor device
08/14/2013EP2626898A2 Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
08/14/2013EP2626895A1 Method and device for singulating in parallel a workpiece into several segments
08/14/2013EP2626894A1 Buffering film for multichip mounting
08/14/2013EP2626893A1 Noble metal paste for bonding of semiconductor element
08/14/2013EP2626892A1 Method for producing dielectric thin film
08/14/2013EP2626891A2 Activation process to improve metal adhesion
08/14/2013EP2626890A1 Epitaxial wafer, light-receiving element, optical sensor device, and method for manufacturing epitaxial wafer and light-receiving element
08/14/2013EP2626367A1 Method for obtaining three-dimensional actin structures and uses thereof
08/14/2013EP2626319A1 Carrier and carrying system
08/14/2013EP2626140A1 A method for non-drip dispensing of a liquid and a nozzle therefore
08/14/2013EP2625713A1 Electronic module and method for producing same
08/14/2013EP2625711A1 Method for manufacturing a circuit
08/14/2013EP2625710A1 Heat-sink device intended for at least one electronic component and corresponding method
08/14/2013EP2625709A1 Sintered device
08/14/2013EP2625708A1 Discrete component backward traceability and semiconductor device forward traceability
08/14/2013EP2625308A2 Mechanically fluidized reactor systems and methods, suitable for production of silicon
08/14/2013EP2625241A1 Chemical mechanical polishing (cmp) composition comprising a specific heteropolyacid
08/14/2013EP2625237A1 Chemical mechanical polishing (cmp) composition
08/14/2013EP2625236A1 Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
08/14/2013EP2359395B1 Methods for protecting a die surface with photocurable materials
08/14/2013EP2093794B1 Conductive ball mounting apparatus and conductive ball mounting method
08/14/2013DE19831550B4 Bondverfahren Bonding method
08/14/2013DE112011103809T5 Graphen-Einheiten mit lokalen Dual-Gates Graphs, units of local dual-gate
08/14/2013DE112011103790T5 Verfahren zum Reinigen von Halbleiterwafern A method of cleaning semiconductor wafers
08/14/2013DE112011103385T5 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
08/14/2013DE112011103249T5 Halbleitereinheit mit Gate-Stapel Semiconductor device with gate stack
08/14/2013DE112010005980T5 Halbleiterelement Semiconductor element
08/14/2013DE112010004081B4 Rezeptur für die Rotationsbeschichtung und Verfahren zum Ablösen eines ionenimplantierten Fotolacks Formulation for the spin coating method and ion-implanted photoresist to remove a
08/14/2013DE112007000997B4 Verfahren zum Verkleinern des minimalen Teilungsmaßes in einer Struktur A method for reducing the minimum pitch of a structure
08/14/2013DE112004002466B4 Vorrichtung und Verfahren zur verbesserten Energieführung Apparatus and method for improved energy management
08/14/2013DE102013202355A1 Halbleiterchip, verfahren zur herstellung eines halbleiterchips, bauelement und verfahren zur herstellung eines bauelements Semiconductor chip process for producing a semiconductor chip, device and method for manufacturing a device
08/14/2013DE102013202094A1 Laserbearbeitungsvorrichtung, die zur Ausbildung von mittels Laser bearbeiteten Öffnungen geeignet ist A laser machining apparatus, which is suitable for the formation of machined by laser openings
08/14/2013DE102013200332A1 Verfahren zum Herstellen einer Siliziumkarbid-Halbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device
08/14/2013DE102012223039A1 Surface mount device LED module e.g. electrically EPROM for fastening on circuit board in spotlight or retrofit LED lamp, has metallic layer applied on carrier with high reflection degree, and oxide layer provided over metallic layer
08/14/2013DE102012222116A1 Doppelschicht-Gate-Dielektrikum mit geringer äquivalenter Oxiddicke für Graphen-Bauelemente The double layer gate dielectric having a low equivalent oxide thickness for devices graphs
08/14/2013DE102012202099A1 Verfahren zum Abkühlen von Scheiben aus Halbleitermaterial A method for cooling of slices of semiconductor material
08/14/2013DE102012202071A1 Leitpaste und Verfahren zur Herstellung einer Halbleitereinrichtung Conductive paste and method of manufacturing a semiconductor device
08/14/2013DE102012202067A1 Halbleiterbauelemente mit steilem Phosphor-Profil in einer Germaniumschicht Semiconductor components with steep phosphorus-profile in a germanium layer
08/14/2013DE102012201976A1 Bauelement mit einer Durchkontaktierung Component with a via
08/14/2013DE102012201938A1 Vorrichtung und Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück Apparatus and method for simultaneously separating a plurality of wafers from a workpiece
08/14/2013DE102012201935A1 Verbindungsanordnung eines elektrischen und/oder elektronischen Bauelements Connecting arrangement of an electric and / or electronic component
08/14/2013DE102012105304A1 Vorrichtung zur Spannungsreduzierung Apparatus for voltage reduction
08/14/2013DE102012104730A1 Nachpassivierung-Zusammenschaltungsstruktur und Verfahren zu ihrer Bildung Post-passivation interconnection structure and process for their education
08/14/2013DE102012101170A1 Receiving unit for handling thin substrate, has receiving surface for receiving substrate placed at effective contact area of receiving surface, and effective contact surface that is contacted with substrate with low adhesiveness
08/14/2013DE102012002754A1 Joining component with substrate, comprises e.g. placing component on terminal contact of substrate, and connecting terminal of component with terminal contact of substrate by solder, where component is fixed after placing on substrate
08/14/2013DE102012002646A1 Electrostatic holding element for processing items e.g. wafer, has base portion made of carbon fibers arranged and/or oriented in plane parallel to support plane for items, which comprises isotropic thermal expansion characteristics
08/14/2013DE102012002606A1 Method for producing electrically conductive pattern on and/or in layer or material or substrate, involves increasing electrical conductivity of irradiated portions of conductive pattern with respect to that of surrounding layer
08/14/2013DE102008061068B4 Elektronikbauelement und Verfahren zur Herstellung eines Elektronikbauelements An electronics device and method for producing an electronic device
08/14/2013DE102005009163B4 Halbleiterbauteil mit einem Halbleiterchip, der Signalkontaktflächen und Versorgungskontaktflächen aufweist, sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor component comprising a semiconductor chip, the signal pads and supply pads, and methods for producing the semiconductor device
08/14/2013DE102004021151B4 Verfahren zum Reduzieren von Ungleichförmigkeit und Bildverkürzung in einem auf ein Substrat belichteten Bild unter Verwendung einer photolithographischen Maske, und photolithographische Maske A method for reducing non-uniformity and image shortening in an exposed image on a substrate using a photolithographic mask, and photolithographic mask
08/14/2013CN203136344U Plug-in element furnace passing tool jig
08/14/2013CN203136340U Etching and film removing production line system with cleaning and drying devices
08/14/2013CN203134847U Turnover vehicle for solar cell module to be pressed
08/14/2013CN203134846U Combined type turnover vehicle for solar cell module finished product
08/14/2013CN203134845U A turnover vehicle of solar battery sheets to be welded in series
08/14/2013CN203134844U A solar battery welding operation device
08/14/2013CN203134802U Semiconductor structure
08/14/2013CN203134773U Testing jig
08/14/2013CN203134772U Base plate support device
08/14/2013CN203134771U Lifting pin device for chip sorting device
08/14/2013CN203134770U Wafer stage with decontamination effect
08/14/2013CN203134769U Clamping device for LED chip holder
08/14/2013CN203134768U Vacuum clamping device of semiconductor epitaxial wafer
08/14/2013CN203134767U Full-automatic crystal grain sorting device
08/14/2013CN203134766U Dynamic isolation module used in semiconductor integrated manufacturing production line
08/14/2013CN203134765U Treatment device with quantitative feeding devices
08/14/2013CN203134764U Modularized silicon chip cleaning system
08/14/2013CN203134763U Real-time cassette wafer detection device
08/14/2013CN203134762U Die bonder
08/14/2013CN203134761U Dynamic sealing module used in semiconductor integrated manufacturing production line
08/14/2013CN203134760U Diode packaging equipment
08/14/2013CN203134759U Glass-bulb sealing tube loading mold board
08/14/2013CN203134758U A source bottle constant-temperature well
08/14/2013CN203132293U Continuous drying module used in integrated manufacturing production line of semiconductor
08/14/2013CN203128651U Miniature PVD (Physical Vapor Deposition) module for semiconductor integrated manufacturing production line
08/14/2013CN203127758U Silicon slice feeding module and corresponding cleaning equipment
08/14/2013CN1987662B Lithographic apparatus and device manufacturing method
08/14/2013CN1702022B Rolling wheel type transporter
08/14/2013CN103250256A Oxide material and semiconductor device
1 ... 514 515 516 517 518 519 520 521 522 523 524 525 526 527 528 529 530 531 532 533 534 ... 6590