Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/14/2013CN103250255A Semiconductor device, TFT substrate, and method for manufacturing semiconductor device and TFT substrate
08/14/2013CN103250254A Trench gate power semiconductor device and method for manufacturing same
08/14/2013CN103250251A Ferroelectric capacitor encapsulated with hydrogen barrier
08/14/2013CN103250250A 半导体器件 Semiconductor devices
08/14/2013CN103250239A Semiconductor device
08/14/2013CN103250238A Transportation robot, substrate transportation method therefor, and substrate transportation relay apparatus
08/14/2013CN103250237A Front opening wafer container with door deflection minimization
08/14/2013CN103250236A Binding material, binding body, and binding method
08/14/2013CN103250235A Semiconductor wafer with adhesive layer, method for manufacturing semiconductor device, and semiconductor device
08/14/2013CN103250234A Process for annealing semiconductor wafers with flat dopant depth profiles
08/14/2013CN103250233A Microcrystalline semiconductor thin film production process
08/14/2013CN103250232A Surface inspection device and method therefor
08/14/2013CN103250231A Exposure device
08/14/2013CN103250230A Dopant applicator system and method of applying vaporized doping compositions to PV solar wafers
08/14/2013CN103250122A Display device with light diffusive glass panel
08/14/2013CN103250100A Radiation-sensitive resin composition, method for forming pattern using same, polymer, and compound
08/14/2013CN103249790A Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
08/14/2013CN103249789A Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low- K dielectric layers
08/14/2013CN103249693A Zinc oxide sintered compact, sputtering target, and zinc oxide thin film
08/14/2013CN103249562A Fine-structure laminate, method for preparing fine-tructure laminate, and production method for fine-structure laminate
08/14/2013CN103249559A Film-like resin composition for sealing and filling semiconductor, method for manufacturing semiconductor device, and semiconductor device
08/14/2013CN103248354A 半导体集成电路 The semiconductor integrated circuit
08/14/2013CN103247725A Semiconductor structure and forming method thereof
08/14/2013CN103247723A 定位系统 Positioning Systems
08/14/2013CN103247716A Method for manufacturing a solar cell and apparatus for manufacturing the same
08/14/2013CN103247714A Apparatus and method for producing solar cells
08/14/2013CN103247711A Ejector rod component for lifting substrate
08/14/2013CN103247698A Capacitor structure and method of forming the same
08/14/2013CN103247696A Tunneling diode rectification device and manufacturing method thereof
08/14/2013CN103247695A Nitride based heterojunction semiconductor device and manufacturing method thereof
08/14/2013CN103247694A Groove Schottky semiconductor device and manufacturing method thereof
08/14/2013CN103247687A Self-aligned contact to III-V material and producing method thereof, FET device and producing method thereof
08/14/2013CN103247686A HVMOS transistor structure having offset distance and method for fabricating the same
08/14/2013CN103247685A Replacement-gate finfet structure and process
08/14/2013CN103247684A Insulated gate bipolar transistor structure having low substrate leakage
08/14/2013CN103247683A Semiconductor device and a method for manufacturing a semiconductor device
08/14/2013CN103247681A nano mosfet with trench bottom oxide shielded and third dimensional p-body contact
08/14/2013CN103247680A Silicon carbide semiconductor device and method for manufacturing silicon carbide semiconductor device
08/14/2013CN103247679A Bilayer gate dielectric with low equivalent oxide thickness for graphene devices
08/14/2013CN103247678A FINFET structure with novel edge fins
08/14/2013CN103247677A Double-groove MOS (metal oxide semiconductor) device and preparation method thereof
08/14/2013CN103247676A Lateral diffused metal oxide semiconductor field effect transistor and manufacturing method thereof
08/14/2013CN103247674A PNP pipe parasitized in Sige BiCMOS technique and manufacturing method thereof
08/14/2013CN103247672A Semiconductor device and manufacturing method thereof
08/14/2013CN103247671A Silicon carbide SBD device with blocky floating knot and preparation method thereof
08/14/2013CN103247670A Enclosed and grooved type power semiconductor component and manufacturing method thereof
08/14/2013CN103247669A Double-grid electric charge capturing memory and manufacture method thereof
08/14/2013CN103247662A Semiconductor unit, method of manufacturing the same, and electronic apparatus
08/14/2013CN103247653A Three-dimensional storage array for connecting adjacent channel walls and manufacturing method thereof
08/14/2013CN103247648A Semiconductor device and method of manufacturing the same, and electronic apparatus
08/14/2013CN103247641A Method and apparatus for reducing stripe patterns
08/14/2013CN103247633A Circuit substrate, method for manufacturing the same, and electro-optical device
08/14/2013CN103247632A Semiconductor device and method of manufacturing the same
08/14/2013CN103247631A Semiconductor device and method of manufacturing the same
08/14/2013CN103247630A Split-gate device and method of fabricating the same
08/14/2013CN103247629A Nonvolatile memory and manufacturing method thereof
08/14/2013CN103247628A SRAM (Static RAM) device and manufacturing method thereof
08/14/2013CN103247627A Semiconductor memory device and access method thereof
08/14/2013CN103247626A Semi-floating gate device and manufacturing method thereof
08/14/2013CN103247624A Semiconductor structure and manufacturing method thereof
08/14/2013CN103247623A Semiconductor devices and methods of manufacturing the same
08/14/2013CN103247620A Semiconductor device and a method for manufacturing a semiconductor device
08/14/2013CN103247618A Meander line resistor structure
08/14/2013CN103247613A Enhanced Flash multi-chip packaged chip, and communication method and packaging method thereof
08/14/2013CN103247612A Enhanced FLASH chip and method for encapsulating chip
08/14/2013CN103247611A Enhanced FLASH chip and method for encapsulating chip
08/14/2013CN103247604A Electronic module and method of manufacturing same
08/14/2013CN103247603A Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus
08/14/2013CN103247602A Semiconductor device and method of forming the same
08/14/2013CN103247601A Copper interconnection structure and manufacture method thereof
08/14/2013CN103247600A Via connection structure, semiconductor devices having the same, and methods of fabricating the structures and devices
08/14/2013CN103247599A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
08/14/2013CN103247598A Metal line and via formation using hard masks
08/14/2013CN103247597A Semiconductor device and method of manufacturing the same
08/14/2013CN103247596A On-chip ferrite bead inductor
08/14/2013CN103247594A Stress reduction apparatus
08/14/2013CN103247593A Post-passivation interconnect structure and method of forming same
08/14/2013CN103247592A MOM (metal oxide metal) capacitor and manufacturing method thereof
08/14/2013CN103247590A Semiconductor chip, method for manufacturing a semiconductor chip, device and method for manufacturing a device
08/14/2013CN103247589A Semiconductor packages and methods of manufacturing the same
08/14/2013CN103247588A Microelectronics device including anisotropic conductive layer and method of forming thereof
08/14/2013CN103247587A Interconnect crack arrestor structure and methods
08/14/2013CN103247586A Chip bonding structure and bonding method
08/14/2013CN103247584A Microgroove group flat plate heat pipe heat radiation fin module and production method of module
08/14/2013CN103247583A Compliant pin fin heat sink and methods
08/14/2013CN103247580A Electronic component module and method for producing same
08/14/2013CN103247579A Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
08/14/2013CN103247578A Semiconductor bearing member, namely packaging member, and method for manufacturing same
08/14/2013CN103247577A Methods for fabricating semiconductor device with fine pattenrs
08/14/2013CN103247576A Preparation method of P-layer silicon epitaxial wafer on P++ substrate
08/14/2013CN103247575A Patterning process for fin-like field effect transistor (Finfet) device
08/14/2013CN103247574A Cut-mask patterning process for fin-like field effect transistor (Finfet) device
08/14/2013CN103247573A Method for dividing workpiece
08/14/2013CN103247572A Method for manufacturing active array substrate
08/14/2013CN103247571A Manufacturing method of pixel structure for organic light emitting display
08/14/2013CN103247570A Manufacturing method for silicon through holes and silicon through hole interconnection
08/14/2013CN103247569A Preparation and structure of TSV (through silicon via)
08/14/2013CN103247568A Manufacturing method for substrate with graphical insulating buried layer
08/14/2013CN103247567A Hollow channel isolation region preparation method
08/14/2013CN103247566A Silicon-on-insulator substrate and method of forming
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