Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/13/2013US8507925 Optoelectronic device and method for manufacturing the same
08/13/2013US8507917 Thin film transistor, method for manufacturing the same, and display device using the same
08/13/2013US8507916 Thin film transistor substrate, LCD device including the same, and method for manufacturing thin film transistor substrate
08/13/2013US8507906 CMOS image sensor and method of manufacturing the same
08/13/2013US8507899 Electric transport component, method of manufacturing the same, as well as electro-optical device and opto-electrical device
08/13/2013US8507887 Resistance change memory and method of manufacturing the same
08/13/2013US8507828 Method for producing a contact structure of a semiconductor component
08/13/2013US8507805 Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard
08/13/2013US8507787 Solar cell having a discontinuously graded doping concentration
08/13/2013US8507390 Methods and devices for forming nanostructure monolayers and devices including such monolayers
08/13/2013US8507389 Methods for forming dielectric layers
08/13/2013US8507388 Prevention of oxidation of substrate surfaces in process chambers
08/13/2013US8507387 Methods of removing noble metal-containing nanoparticles
08/13/2013US8507386 Lateral uniformity in silicon recess etch
08/13/2013US8507385 Method for processing a thin film micro device on a substrate
08/13/2013US8507384 Method for selectively modifying spacing between pitch multiplied structures
08/13/2013US8507383 Fabrication of replacement metal gate devices
08/13/2013US8507382 Systems and methods for delivery of fluid-containing process material combinations
08/13/2013US8507381 Method for fabricating silicon and/or germanium nanowires
08/13/2013US8507380 Methods of forming contact openings and methods of increasing contact area in only one of X and Y axes in the fabrication of integrated circuitry
08/13/2013US8507379 Semiconductor device and manufacturing method thereof
08/13/2013US8507378 Method and structure for self aligned contact for integrated circuits
08/13/2013US8507377 Semiconductor device, method of manufacturing the same, and phase shift mask
08/13/2013US8507376 Method to form solder deposits on substrates
08/13/2013US8507375 Alignment tolerant semiconductor contact and method
08/13/2013US8507374 Semiconductor device with vertical gate and method for manufacturing the same
08/13/2013US8507373 Semiconductor device including transistors of different junction depth, and method of manufacturing the same
08/13/2013US8507372 Method for processing a substrate having a non-planar substrate surface
08/13/2013US8507371 Method of forming epitaxial semiconductor structure
08/13/2013US8507370 Method of transferring epitaxial film
08/13/2013US8507369 Method for producing silicon nanowire devices
08/13/2013US8507368 Single-shot semiconductor processing system and method having various irradiation patterns
08/13/2013US8507367 Separation of semiconductor devices
08/13/2013US8507366 Rapid thermal processing system and sulfidation method thereof
08/13/2013US8507365 Growth of coincident site lattice matched semiconductor layers and devices on crystalline substrates
08/13/2013US8507364 N-type group III nitride-based compound semiconductor and production method therefor
08/13/2013US8507363 Laser and plasma etch wafer dicing using water-soluble die attach film
08/13/2013US8507362 Process of forming ultra thin wafers having an edge support ring
08/13/2013US8507361 Fabrication of substrates with a useful layer of monocrystalline semiconductor material
08/13/2013US8507360 Transfer method of functional region, LED array, LED printer head, and LED printer
08/13/2013US8507359 Semiconductor device, process for producing same, and display device
08/13/2013US8507358 Composite wafer semiconductor
08/13/2013US8507357 Method for lift-off of light-emitting diode substrate
08/13/2013US8507356 Formation of wells utilizing masks in manufacturing semiconductor device
08/13/2013US8507355 Manufacturing method of a high performance metal-oxide-metal
08/13/2013US8507354 On-chip capacitors in combination with CMOS devices on extremely thin semiconductor on insulator (ETSOI) substrates
08/13/2013US8507353 Method of forming semiconductor device having self-aligned plug
08/13/2013US8507352 Method of manufacturing semiconductor device including insulated gate bipolar transistor and diode
08/13/2013US8507351 Dopant profile tuning for MOS devices by adapting a spacer width prior to implantation
08/13/2013US8507350 Fabricating method of semiconductor elements
08/13/2013US8507349 Semiconductor device employing fin-type gate and method for manufacturing the same
08/13/2013US8507348 Field effect transistors for a flash memory comprising a self-aligned charge storage region
08/13/2013US8507347 Semiconductor devices and methods of manufacture thereof
08/13/2013US8507346 Method of forming a semiconductor device having a cut-way hole to expose a portion of a hardmask layer
08/13/2013US8507345 Semiconductor device and manufacturing method thereof
08/13/2013US8507344 Semiconductor device having a buried gate and method for manufacturing the same
08/13/2013US8507343 Variable resistance memory device and method of manufacturing the same
08/13/2013US8507342 Semiconductor device with buried bit lines and method for fabricating the same
08/13/2013US8507341 Integrated circuit fabrication
08/13/2013US8507339 BiCMOS device
08/13/2013US8507338 Semiconductor structure and fabricating method thereof
08/13/2013US8507337 Method for doping semiconductor structures and the semiconductor device thereof
08/13/2013US8507336 Method for forming metal gate and MOS transistor
08/13/2013US8507335 Semiconductor devices with non-punch-through semiconductor channels having enhanced conduction and methods of making
08/13/2013US8507334 Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device
08/13/2013US8507333 Integrated circuit device with series-connected field effect transistors and integrated voltage equalization and method of forming the device
08/13/2013US8507332 Method for manufacturing components
08/13/2013US8507331 Method of adjusting gap between bumps in pixel region and method of manufacturing display device using the method
08/13/2013US8507330 Thin film transistor
08/13/2013US8507329 Compound semiconductor device and method of manufacturing the same
08/13/2013US8507328 Systems and methods providing semiconductor light emitters
08/13/2013US8507327 Semiconductor device manufacturing method thereof
08/13/2013US8507326 BEOL anti-fuse structures for gate last semiconductor devices
08/13/2013US8507325 Co-axial restraint for connectors within flip-chip packages
08/13/2013US8507324 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
08/13/2013US8507323 Method of producing semiconductor device with patterned photosensitive adhesive
08/13/2013US8507322 Semiconductor substrate and method for manufacturing semiconductor device
08/13/2013US8507321 Chip package and method for forming the same
08/13/2013US8507320 Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
08/13/2013US8507319 Integrated circuit package system with shield
08/13/2013US8507318 Method for manufacturing microelectronic devices
08/13/2013US8507317 Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
08/13/2013US8507316 Protecting T-contacts of chip scale packages from moisture
08/13/2013US8507313 Method of manufacturing photoelectric conversion device
08/13/2013US8507312 Photoelectric-conversion-device fabrication method
08/13/2013US8507311 Method for forming an image sensing device
08/13/2013US8507310 Method for manufacturing thin-film photoelectric conversion device
08/13/2013US8507309 Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same
08/13/2013US8507306 Reduced stiction MEMS device with exposed silicon carbide
08/13/2013US8507305 Group-III nitride semiconductor laser device, method of fabricating group-III nitride semiconductor laser device, and epitaxial substrate
08/13/2013US8507304 Method of forming a group III-nitride crystalline film on a patterned substrate by hydride vapor phase epitaxy (HVPE)
08/13/2013US8507303 Thin film transistor array panel and method for manufacturing the same
08/13/2013US8507302 Wall structures for a semiconductor wafer
08/13/2013US8507301 TFT array substrate and the fabrication method thereof
08/13/2013US8507300 Light-emitting diode with light-conversion layer
08/13/2013US8507298 Patterned implant of a dielectric layer
08/13/2013US8507297 Packaging and testing of multiple MEMS devices on a wafer
08/13/2013US8507296 Substrate processing method and film forming method
08/13/2013US8507156 Laser mask and sequential lateral solidification crystallization method using the same
08/13/2013US8507111 Thin film transistor, thin film transistor substrate, processes for producing the same, liquid crystal display using the same, and related devices and processes; and sputtering target, transparent electroconductive film formed by use of this, transparent electrode, and related devices and processes