| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/25/2002 | WO2001098793A3 Systems for testing integraged circuits during burn-in |
| 07/25/2002 | WO2001089767A3 A chemical-mechanical polishing system for the manufacture of semiconductor devices |
| 07/25/2002 | WO2001087534A3 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site |
| 07/25/2002 | WO2001082362B1 Process for forming electrical/mechanical connections |
| 07/25/2002 | WO2001081970A3 Apparatus, system, and method for precision positioning and alignment of a lens in an optical system |
| 07/25/2002 | WO2001075938A3 Leadless semiconductor product packaging apparatus having a window lid and method for packaging |
| 07/25/2002 | WO2001073865A3 Continuous processing of thin-film batteries and like devices |
| 07/25/2002 | WO2001004926A9 Methods and apparatus for alignment of ion beam systems using beam current sensors |
| 07/25/2002 | WO2001004652A9 Apparatus for electrical testing of a substrate having a plurality of terminals |
| 07/25/2002 | WO2001002108A9 Fluid heating system for processing semiconductor materials |
| 07/25/2002 | US20020100013 Exposure processing method and exposure system for the same |
| 07/25/2002 | US20020100012 Focus monitoring method, exposure apparatus, and exposure mask |
| 07/25/2002 | US20020099995 Marking of and searching for initial defective blocks in semiconductor memory |
| 07/25/2002 | US20020099989 Automatic circuit generation system and automatic circuit generation method and automatic circuit generation program |
| 07/25/2002 | US20020099475 Method and device for vibration control |
| 07/25/2002 | US20020099470 Wafer handling system |
| 07/25/2002 | US20020099469 Vacuum processing apparatus and semiconductor manufacturing line using the same |
| 07/25/2002 | US20020098787 Polishing apparatus |
| 07/25/2002 | US20020098786 Retention plate for polishing semiconductor substrate |
| 07/25/2002 | US20020098784 Abrasive free polishing in copper damascene applications |
| 07/25/2002 | US20020098782 Polishing pads and methods relating thereto |
| 07/25/2002 | US20020098780 Apparatus for polishing a semiconductor wafer and method therefor |
| 07/25/2002 | US20020098779 Method and apparatus for enhanced CMP using metals having reductive properties |
| 07/25/2002 | US20020098778 Polishing pad, polishing apparatus and polishing method using the same |
| 07/25/2002 | US20020098777 Multizone carrier with process monitoring system for chemical-mechanical planarization tool |
| 07/25/2002 | US20020098716 Method of making vertical diode structures |
| 07/25/2002 | US20020098715 High-pressure anneal process for integrated circuits |
| 07/25/2002 | US20020098714 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device |
| 07/25/2002 | US20020098713 Clustertool system software using plasma immersion ion implantation |
| 07/25/2002 | US20020098712 Multi-thickness oxide growth with in-situ scanned laser heating |
| 07/25/2002 | US20020098711 Electroless deposition of doped noble metals and noble metal alloys |
| 07/25/2002 | US20020098710 Methods Of Forming Transistors |
| 07/25/2002 | US20020098709 Method for removing photoresist layer on wafer edge |
| 07/25/2002 | US20020098708 Method and apparatus for dry etching |
| 07/25/2002 | US20020098707 Design of lithography alignment and overlay measurement marks on CMP finished damascene surface |
| 07/25/2002 | US20020098706 Comprises simultaneous application of ultraviolet radiation and hydrogen peroxide and dissolved ozone |
| 07/25/2002 | US20020098705 Single step chemical mechanical polish process to improve the surface roughness in MRAM technology |
| 07/25/2002 | US20020098704 Method for fabrication of a contact plug in an embedded memory |
| 07/25/2002 | US20020098703 Method for fabricating a MOS transistor of an embedded memory |
| 07/25/2002 | US20020098702 Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 07/25/2002 | US20020098701 Polishing method |
| 07/25/2002 | US20020098699 Method of forming a bit line and a node contact hole |
| 07/25/2002 | US20020098698 Method for polishing semiconductor device |
| 07/25/2002 | US20020098697 Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same |
| 07/25/2002 | US20020098695 Method of manufaturing crystalline semiconductor material and method of manufaturing semiconductor device |
| 07/25/2002 | US20020098694 Method of making a local interconnect in an embedded memory |
| 07/25/2002 | US20020098693 Single step pendeo- and lateral epitaxial overgrowth of group III-nitride epitaxial layers with group III-nitride buffer layer and resulting structures |
| 07/25/2002 | US20020098692 Semiconductor device and method for manufacturing same |
| 07/25/2002 | US20020098691 Method of manufacturing a semiconductor device and the semiconductor device manufactured by the method |
| 07/25/2002 | US20020098690 Methods of forming semiconductor structures |
| 07/25/2002 | US20020098689 Formation of silicided shallow junctions using implant through metal technology and laser annealing process |
| 07/25/2002 | US20020098688 Semiconductor device having a self-aligned contact hole |
| 07/25/2002 | US20020098687 Method of automatically defining a landing via |
| 07/25/2002 | US20020098686 Semiconductor device and fabrication process therefor |
| 07/25/2002 | US20020098685 In situ reduction of copper oxide prior to silicon carbide deposition |
| 07/25/2002 | US20020098684 Low k interlevel dielectric layer fabrication methods |
| 07/25/2002 | US20020098683 Semiconductor device manufacturing method using metal silicide reaction after ion implantation in silicon wiring |
| 07/25/2002 | US20020098682 Semiconductor device fabrication method |
| 07/25/2002 | US20020098681 Reduced electromigration and stressed induced migration of Cu wires by surface coating |
| 07/25/2002 | US20020098680 Integrated circuit trenched features and method of producing same |
| 07/25/2002 | US20020098679 Method for producing an integrated circuit having at least one metalicized surface |
| 07/25/2002 | US20020098678 Method of forming conductive layers in the trenches or through holes made in an insulating film on a semiconductor substrate |
| 07/25/2002 | US20020098677 Multilevel copper interconnects with low-k dielectrics and air gaps |
| 07/25/2002 | US20020098676 Metal hard mask for ild rie processing of semiconductor memory devices to prevent oxidation of conductive lines |
| 07/25/2002 | US20020098675 Chemical mechanical polishing method for fabricating cooper damascene structure |
| 07/25/2002 | US20020098674 Method of manufacturing semicondutor device |
| 07/25/2002 | US20020098673 Method for fabricating metal interconnects |
| 07/25/2002 | US20020098672 Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device |
| 07/25/2002 | US20020098671 Method of forming silicon-germanium film |
| 07/25/2002 | US20020098670 Semiconductor integrated circuit device and fabrication method for semiconductor integrated circuit device |
| 07/25/2002 | US20020098669 Gate electrode having agglomeration prevention layer on metal silicide layer, and method for forming the same |
| 07/25/2002 | US20020098667 Technique to produce isolated junctions by forming an insulation layer |
| 07/25/2002 | US20020098666 Compound semiconductor device manufacturing method |
| 07/25/2002 | US20020098665 Method for manufacturing semiconductor circuit |
| 07/25/2002 | US20020098664 Method of producing SOI materials |
| 07/25/2002 | US20020098663 Manufacturing method of a semiconductor device |
| 07/25/2002 | US20020098662 Chemical treatment of semiconductor substrates |
| 07/25/2002 | US20020098661 Simplified method to reduce or eliminate sti oxide divots |
| 07/25/2002 | US20020098660 Method for forming trench isolation |
| 07/25/2002 | US20020098659 Method for forming steep spacer in a MOS device |
| 07/25/2002 | US20020098658 Metal-insulator-semiconductor field effect transistor having an oxidized aluminum nitride gate insulator formed on a gallium nitride or silicon substrate, and method of making the same |
| 07/25/2002 | US20020098657 Structure and process flow for fabrication of dual gate floating body integrated MOS transistors |
| 07/25/2002 | US20020098656 Method of fabricating semiconductor device |
| 07/25/2002 | US20020098655 Method to form very high mobility vertical channel transistor by selective deposition of SiGe or multi-quantum wells (MQWs) |
| 07/25/2002 | US20020098654 Method of forming a contact structure and a container capacitor structure |
| 07/25/2002 | US20020098653 Aerosol process for fabricating discontinuous floating gate microelectronic devices |
| 07/25/2002 | US20020098652 Semiconductor device having MISFETs |
| 07/25/2002 | US20020098651 Ggeneration of heat can be suppressed even if the substrate is provided on the base with the opposite side of the emitting portion of the substrate facing the base. |
| 07/25/2002 | US20020098650 Method for making an embedded memory MOS |
| 07/25/2002 | US20020098649 Method for fabricating a mos transistor of an embedded memory |
| 07/25/2002 | US20020098648 Method for fabricating a nonvolatile semiconductor memory cell |
| 07/25/2002 | US20020098647 Split gate field effect transistor (fet) device employing non-linear polysilicon floating gate electrode dopant profile |
| 07/25/2002 | US20020098646 Method of manufacturing semiconductor device |
| 07/25/2002 | US20020098645 Triple metal line 1T/1C ferroelectric memory device and method for fabrication thereof |
| 07/25/2002 | US20020098644 Semiconductor device and method for manufacturing the same |
| 07/25/2002 | US20020098643 Method of manufacturing SOI element having body contact |
| 07/25/2002 | US20020098642 Methods of fabricating a metal-oxide-metal capacitor and associated apparatuses |
| 07/25/2002 | US20020098641 Semiconductor substrate, light-emitting device, and method for producing the same |
| 07/25/2002 | US20020098640 Method for forming self aligned contacts |
| 07/25/2002 | US20020098639 Method of manufacturing semiconductor memory device and semiconductor memory device |