Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2002
09/12/2002US20020125497 Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
09/12/2002US20020125491 Semiconductor element
09/12/2002US20020125482 Semiconductor device made from silicon carbide with a schottky contact and an ohmic contact made from a nickel-aluminum material and process for producing the semiconductor device
09/12/2002US20020125480 Semiconductor device and method for manufacturing the same
09/12/2002US20020125479 MOSFET and method of its fabrication
09/12/2002US20020125477 Thin film transistors with dual layered source/drain electrodes and manufacturing method thereof, and active matrix display device and manufacturing method thereof
09/12/2002US20020125476 Novel CMOS circuit of GaAs/Ge on Si substrate
09/12/2002US20020125475 High speed composite p-channel Si/SiGe heterostructure for field effect devices
09/12/2002US20020125474 Semiconductor device and pattern layout method thereof
09/12/2002US20020125473 Semiconductor device and method of analyzing same
09/12/2002US20020125471 CMOS inverter circuits utilizing strained silicon surface channel MOSFETS
09/12/2002US20020125461 Ammonium oxalate-containing polishing system and method
09/12/2002US20020125460 Compositions for chemical mechanical planarization of tungsten
09/12/2002US20020125448 Multi-functioned wafer aligner
09/12/2002US20020125447 Devices and methods for monitoring respective operating temperatures of components in a microlithography apparatus
09/12/2002US20020125446 Substrate positioning system
09/12/2002US20020125444 Illumination-beam scanning configurations and methods for charged-particle-beam microlithography
09/12/2002US20020125443 Dual layer reticle blank and manufacturing process
09/12/2002US20020125441 Methods and apparatus for determining blur of an optical system
09/12/2002US20020125410 Active matrix display device and method of manufacturing the same
09/12/2002US20020125329 Electronic module for chip card
09/12/2002US20020125303 Bonding method and apparatus
09/12/2002US20020125240 Heating device, method for producing same and film forming apparatus
09/12/2002US20020125239 Multi-zone resistive heater
09/12/2002US20020125232 Laser cutting apparatus and method
09/12/2002US20020125231 Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
09/12/2002US20020125228 Energy-efficient method and system for processing target material using an amplified, wavelength-shifted pulse train
09/12/2002US20020125226 Toroidal low-field reactive gas source
09/12/2002US20020125225 Toroidal low-field reactive gas source
09/12/2002US20020125223 Radio frequency power source for generating an inductively coupled plasma
09/12/2002US20020125213 Dry etching apparatus, etching method, and method of forming a wiring
09/12/2002US20020125212 Method and apparatus for localized liquid treatment of the surface of a substrate
09/12/2002US20020125211 Method of reducing notching during reactive ion etching
09/12/2002US20020125209 Method of making upper conductive line in dual damascene having lower copper lines
09/12/2002US20020125207 Plasma processing method
09/12/2002US20020125206 Depositing metal film including an aluminum over a semiconductor substrate, and etching the metal film with a plasma of a gas mixture containing chlorine, boron trichloride and dichloromethane
09/12/2002US20020125192 Nanostructured devices for separation and analysis
09/12/2002US20020125170 Transport module
09/12/2002US20020125169 Wafer carrier having a low tolerance build-up
09/12/2002US20020125127 Magnetron sputtering system and photomask blank production method based on the same
09/12/2002US20020125124 Method for shorting pin grid array pins for plating
09/12/2002US20020125123 Titanium nitride film having a resistivity of less than about 75 mu Omega-cm; surface smoothness; made by controlling the gas phase deposition mixture, and controlling deposition rate
09/12/2002US20020125043 Semiconductor packaging structure, packaging board and inspection method of packaging conditions
09/12/2002US20020125040 Multi-layer circuit assembly and process for preparing the same
09/12/2002US20020124993 Apparatus with air-conditioning system, and device manufacturing method using the same
09/12/2002US20020124965 Method for fabricating a III-V nitride film and an apparatus for fabricating the same
09/12/2002US20020124964 Wafer support plate assembly having recessed upper pad and vacuum processing apparatus comprising the same
09/12/2002US20020124962 Atmospheric pressure plasma etching reactor
09/12/2002US20020124961 Manifolded fluid delivery system
09/12/2002US20020124960 Substrate processing apparatus
09/12/2002US20020124959 Plasma monitoring method and semiconductor production apparatus
09/12/2002US20020124958 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates
09/12/2002US20020124957 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
09/12/2002US20020124933 Thermocompression bonding device and bonding head thereof
09/12/2002US20020124906 Substrate transport apparatus, POD and method
09/12/2002US20020124878 Collapsible play structures
09/12/2002US20020124875 Apparatus and method for photoresist stripping
09/12/2002US20020124869 Water reclamation rate in semiconductor fabrication wet benches
09/12/2002US20020124867 Apparatus and method for surface cleaning using plasma
09/12/2002US20020124866 Plasma film-forming apparatus and cleaning method for the same
09/12/2002US20020124801 Processing apparatus with sensory subsystem for detecting the presence/absence of wafers or other workpieces
09/12/2002US20020124800 Apparatus for producing thin films
09/12/2002US20020124798 Film forming unit
09/12/2002US20020124797 Film forming unit
09/12/2002US20020124794 Nitride semiconductor chip and method for manufacturing nitride semiconductor chip
09/12/2002US20020124791 Silicon wafer and method for producing the same
09/12/2002US20020124646 Method and apparatus for detecting liquid level
09/12/2002US20020124641 Flow controller
09/12/2002US20020124475 CMP polishing slurry dewatering and reconstitution
09/12/2002US20020124474 Silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent
09/12/2002US20020124428 Apparatus to reduce contaminants from semiconductor wafers
09/12/2002US20020124399 Component holding head, component mounting apparatus using same, and component mounting method
09/12/2002US20020124398 Multi-layer circuit assembly and process for preparing the same
09/12/2002DE10208577A1 Flash-Speicher mit geteilter Gate-Elektrode und Verfahren zu seiner Herstellung Flash memory split-gate electrode and method for its preparation
09/12/2002DE10207297A1 Verfahren zum Herstellen einer Halbleiter-auf-Isolator-Struktur A method for fabricating a semiconductor-on-insulator structure
09/12/2002DE10206608A1 Temperature monitoring apparatus for microprocessors, has regulator circuit to adjust speed of fan based on sensed temperature and speed monitoring device to alert user when fan speed exceeds specified range
09/12/2002DE10162037A1 Retainer of active or passive electric components on flexible, insulating, miniaturized support foil
09/12/2002DE10152095A1 Blank-Chip-Träger und Verfahren zum Herstellen einer Halbleitervorrichtung unter Verwendung des Blank-Chip-Trägers Blank chip carrier and method for producing a semiconductor device using the chip carrier blank
09/12/2002DE10150370A1 Apparat und Verfahren zum Testen einer integrierten Halbleiterschaltung Apparatus and method for testing a semiconductor integrated circuit
09/12/2002DE10150369A1 Halbleitertestvorrichtung und Verfahren zum Testen von Halbleitervorrichtungen The semiconductor test apparatus and method for testing semiconductor devices
09/12/2002DE10143256A1 Integrierter SOI-Halbleiterschaltkreis und Herstellungsverfahren hierfür SOI semiconductor integrated circuit, and manufacturing method thereof
09/12/2002DE10137343C1 Semiconductor structure used as lateral diffused metal oxide semiconductor transistor comprises substrate with source and drain regions, channel region between source and drain regions, and field plate over transition between drain sections
09/12/2002DE10131349A1 Corrective post-forming of a thermoplastic product, in particular a transporting container for semi-conductor products, involves heating local surface areas and forming with a tool
09/12/2002DE10117754C1 Process for applying and/or inserting plastic compositions into cavities of chip cards involves passing a plastic composition conveyed from a storage vessel through a testing device to judge irregularities and removing defective components
09/12/2002DE10111471A1 Device for picking up and depositing substrates, has vacuum for vacuum-actuated device arranged in series with vacuum of vacuum suction unit
09/12/2002DE10109965A1 Teilchenoptische Linsenanordnung und Verfahren unter Einsatz einer solchen Linsenanordnung A particle-lens array and method using such a lens assembly
09/12/2002DE10109564A1 Grabenkondensator und Verfahren zu seiner Herstellung Grave capacitor and process for its preparation
09/12/2002DE10109542A1 Leiterplattenanordnung Printed circuit board assembly
09/12/2002DE10109368A1 Dimensioning transistors in integrated circuits by re-dimensioning transistors in path with propagation time below target, based on propagation time probability distribution
09/12/2002DE10109348A1 Anordnung mit einem eine integrierte Schaltung aufweisenden Chip und einem Träger beziehungsweise ein Trägerelement Arrangement with an integrated circuit chip having and a carrier or a carrier element
09/12/2002DE10109328A1 Verfahren zur Entfernung einer Maskenschicht von einem Halbleitersubstrat A method for removing a mask layer of a semiconductor substrate
09/12/2002DE10109327A1 Halbleiterchip und Herstellungsverfahren für ein Gehäuse Semiconductor chip and the manufacturing method of a housing
09/12/2002DE10108928A1 Verfahren zum Ermitteln von Fertigungs- und/oder Prozessierungsschwächen, Verfahren zum Ermitteln von Maschinentrends sowie zugehörige Komponenten Method for determining manufacturing and / or Prozessierungsschwächen, method for determining machine trends and associated components
09/12/2002DE10108913A1 Zeiterfassungsvorrichtung und Zeiterfassungsverfahren unter Verwendung eines Halbleiterelements Time detecting means and time recording method using a semiconductor element
09/12/2002DE10108290A1 Elektroanordnung zur Ladungsspeicherung Electric arrangement for storing charge
09/12/2002DE10108081A1 Anordnung eines Halbleiterchips auf einem Substrat Arrangement of a semiconductor chip on a substrate
09/12/2002DE10108067A1 Via etch post-clean process performing a dry clean process to remove polymer residues and form water-soluble compounds
09/12/2002DE10108066A1 Wafer baking method for semiconductor manufacture, involves mounting several spacers in wafer so as to separate hot plate from wafer edge
09/12/2002DE10107405A1 Semiconductor film which can be directly processed on conveyor belt production line comprises semiconductor tape formed by ion implantation
09/12/2002DE10107181A1 Trench capacitor used in dynamic random access memories comprises a substrate containing a trench having an upper region with a side wall, and an isolating collar arranged in the upper region of the trench and extending into the trench