Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/08/2002US6461737 Epitaxial compound structure and device comprising same
10/08/2002US6461717 Composition for protecting apertures in substrate during etching, comprising crosslinkable polymers containing hydroxyl groups and having specified molecular weight, thermal acid generator catalysts, crosslinking agents and solvents
10/08/2002US6461690 Laser marking techniques
10/08/2002US6461680 Simplified fabrication method of toroidal charged particle deflector vanes
10/08/2002US6461675 Electrodepositing noble metal (platinum, palladium, or iridium) seed layer on substrate, then depositing copper layer on seed layer via chemical vapor deposition; adhesion promotion
10/08/2002US6461558 Injection molding apparatus and method
10/08/2002US6461533 Etchant for silicon oxide and method
10/08/2002US6461529 Anisotropic nitride etch process with high selectivity to oxide and photoresist layers in a damascene etch scheme
10/08/2002US6461524 Method of filtering a fluid
10/08/2002US6461519 Process for producing ultra-pure water, and configuration for carrying out a process of this nature
10/08/2002US6461494 Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot
10/08/2002US6461485 Sputtering method for forming an aluminum or aluminum alloy fine wiring pattern
10/08/2002US6461483 Method and apparatus for performing high pressure physical vapor deposition
10/08/2002US6461470 Porous panel with jet holes a in first bath, the panel to jet etchant against the glass, a container for storing etchant, and a pump supplying etchant to panel, connected to the container and panel; for liquid crystal displays (lcd)
10/08/2002US6461447 Substrate for epitaxial growth
10/08/2002US6461444 Method and apparatus for manufacturing semiconductor device
10/08/2002US6461443 Method and apparatus for continuous cleaning of substrate surfaces using ozone
10/08/2002US6461441 Method of removing debris from cleaning pads in work piece cleaning equipment
10/08/2002US6461439 Apparatus for supporting a semiconductor wafer during processing
10/08/2002US6461438 Heat treatment unit, cooling unit and cooling treatment method
10/08/2002US6461437 Apparatus used for fabricating liquid crystal device and method of fabricating the same
10/08/2002US6461435 Showerhead with reduced contact area
10/08/2002US6461434 Quick-change flange
10/08/2002US6461428 Method and apparatus for controlling rise and fall of temperature in semiconductor substrates
10/08/2002US6461407 Liquid raw material is deaerated and supplied from a container to a liquid flow control section by the pressure of first inert gas, inside a gas permeable fluoropolymer tube, passing second inert gas with low permeability than first
10/08/2002US6461230 Chemical-mechanical polishing method
10/08/2002US6461228 Grinding and polishing machines
10/08/2002US6461226 Wafer is polished against an outer portion of a polishing pad; next, the wafer is polished against an inner portion of the polishing pad. the inner portion of the polishing pad has a second hardness that is less than the first hardness.
10/08/2002US6461225 Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)
10/08/2002US6461224 Off-diameter method for preparing semiconductor wafers
10/08/2002US6461222 Planarizing and polishing apparatus and planarizing and polishing method
10/08/2002US6461155 Method and apparatus for heating substrates in supercritical fluid reactor
10/08/2002US6461136 Apparatus for filling high aspect ratio via holes in electronic substrates
10/08/2002US6461094 Loading and unloading station for semiconductor processing installations
10/08/2002US6461085 Sputter pallet loader
10/08/2002US6461070 Document folder and method
10/08/2002US6461036 System and method for determining stray light in a thermal processing system
10/08/2002US6460756 Method of applying bonding paste
10/08/2002US6460755 Bump forming method and apparatus therefor
10/08/2002US6460751 Bondhead for a wire bonder
10/08/2002US6460692 Dual lane conveying apparatus
10/08/2002US6460598 Heat exchanger cast in metal matrix composite and method of making the same
10/08/2002US6460591 Ultrasonic bonding method and ultrasonic bonding apparatus
10/08/2002US6460554 Apparatus for rinsing and drying semiconductor wafers in a chamber with a movable side wall
10/08/2002US6460552 Method and apparatus for cleaning flat workpieces
10/08/2002US6460551 Megasonic resonator for disk cleaning and method for use thereof
10/08/2002US6460550 Apparatus for automatically performing cleaning processes in a semiconductor wafer processing system
10/08/2002US6460482 Gas shower unit for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
10/08/2002US6460414 Automated acoustic micro imaging system and method
10/08/2002US6460369 Consecutive deposition system
10/08/2002US6460270 Vacuum processing apparatus
10/08/2002US6460269 Wafer dryer comprising revolving spray nozzle and method for drying wafers using the same
10/08/2002US6460245 Method of fabricating semiconductor chip assemblies
10/08/2002CA2250795C Method for creating via hole in chip
10/08/2002CA2216818C Cathode mounting for ion source with indirectly heated cathode
10/03/2002WO2002078417A1 Heat sink and method for manufacturing the same
10/03/2002WO2002078407A2 Neutral particle beam processing apparatus
10/03/2002WO2002078187A1 Programmable logic arrays with ultra thin body transistors
10/03/2002WO2002078186A1 In service programmable logic arrays with ultra thin vertical body transistors
10/03/2002WO2002078163A2 Device for introducing electric components into continuous tapes
10/03/2002WO2002078144A1 Semiconductor device and method of crystal growth
10/03/2002WO2002078101A1 Method of creating an electroluminescent device
10/03/2002WO2002078100A1 A transpinnor-based switch and applications
10/03/2002WO2002078096A1 TREATING N-TYPE GaN WITH A C12-BASED INDUCTIVELY COUPLED PLASMA BEFORE FORMATION OF OHMIC CONTACTS
10/03/2002WO2002078095A2 Method of forming enhanced transistor gate using e-beam radiation and integrated circuit including this transistor gate
10/03/2002WO2002078094A1 Electronic devices comprising thin-film transistors, and their manufacture
10/03/2002WO2002078093A1 Reduced mask count process for manufacture of mosgated device
10/03/2002WO2002078092A1 Power semiconductor device having a trench gate electrode and method of making the same
10/03/2002WO2002078091A2 Field effect transistor structure and method of manufacture
10/03/2002WO2002078090A2 Field-effect transistor structure and method of manufacture
10/03/2002WO2002078087A2 Semiconductor chip having multiple conductive layers in an opening, and method for fabricating same
10/03/2002WO2002078084A2 Method for producing ferroelectric memory cells
10/03/2002WO2002078083A2 In-street integrated circuit wafer via
10/03/2002WO2002078082A2 Electronic structure
10/03/2002WO2002078081A1 Endpoint detection in the etching of dielectric layers
10/03/2002WO2002078080A1 Chip module with bond-wire connections with small loop height
10/03/2002WO2002078079A1 Package of semiconductor device and its manufacturing method
10/03/2002WO2002078078A2 Dispensing process for fabrication of microelectronic packages
10/03/2002WO2002078077A1 Method for encapsulating a chip having a sensitive surface
10/03/2002WO2002078076A2 Method for realizing wiring options in an integrated circuit and a corresponding integrated circuit
10/03/2002WO2002078075A1 Fabrication method of so1 semiconductor devices
10/03/2002WO2002078074A1 Apparatus and method for temperature control in rtp using an adaptative control
10/03/2002WO2002078073A1 Method of cleaning cvd device and cleaning device therefor
10/03/2002WO2002078072A1 Plasma processor and plasma processing method
10/03/2002WO2002078071A2 Method of shrinking an integrated circuit gate
10/03/2002WO2002078070A1 A device for epitaxially growing objects by cvd
10/03/2002WO2002078069A1 Nitride semiconductor element and production method thereof
10/03/2002WO2002078068A1 Method for growing crystal of compound semiconductor by movpe
10/03/2002WO2002078067A1 Method for growing crystal of gallium nitride compound semiconductor and electronic device having gallium nitride compound semiconductor
10/03/2002WO2002078066A1 Automatic continue wafer processing system and method for using the same
10/03/2002WO2002078065A1 Semiconductor production system, cluster tool, control method of semiconductor production system and maintenance method of cluster tool
10/03/2002WO2002078064A2 Electrochemical etching process
10/03/2002WO2002078063A1 Transfer chamber with side wall port
10/03/2002WO2002078062A2 Acoustic detection of dechucking and apparatus therefor
10/03/2002WO2002078061A2 RECESSED SILICON OXIDATION FOR DEVICES SUCH AS A CMOS SOI ICs
10/03/2002WO2002078060A2 Damascene processing using dielectric barrier films
10/03/2002WO2002078059A1 Methods for manufacture of self-aligned integrally gated nanofilament field emitter cells and array
10/03/2002WO2002078058A2 Method for the production of a mosfet with very small channel length
10/03/2002WO2002078057A2 A transpinnor-based sample-and-hold circuit and applications
10/03/2002WO2002078056A2 Passivation layer for molecular electronic device fabrication