Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/03/2002US20020142153 Resin sealing method for semiconductors and release film used therefor
10/03/2002US20020142144 Single c-axis PGO thin film electrodes having good surface smoothness and uniformity and methods for making the same
10/03/2002US20020142104 Computers
10/03/2002US20020142095 Method of forming a film by vacuum ultraviolet irradiation
10/03/2002US20020142058 Apparatus for making semiconductor device
10/03/2002US20020141850 Semiconductor fabrication apparatus, pod carry apparatus, pod carry method, and semiconductor device production method
10/03/2002US20020141831 Sputter pallet loader
10/03/2002US20020141634 Pattern defect inspection apparatus and method
10/03/2002US20020141633 Pattern data converting method and apparatus
10/03/2002US20020141536 EUV, XUV, and X-ray wavelength sources created from laser plasma produced from liquid metal solutions, and nano-size particles in solutions
10/03/2002US20020141533 X-ray exposure apparatus
10/03/2002US20020141477 Thin film thickness monitoring method and substrate temperature measuring method
10/03/2002US20020141473 Controlling laser polarization
10/03/2002US20020141257 Layout method for semiconductor integrated circuit
10/03/2002US20020141242 Data writing method for semiconductor memory device and semiconductor memory device
10/03/2002US20020141240 Semiconductor device and a integrated circuit card
10/03/2002US20020141237 Semiconductor memory
10/03/2002US20020141234 Structure for reducing leakage current in submicron IC devices
10/03/2002US20020141233 Semiconductor memory device including memory cell portion and peripheral circuit portion
10/03/2002US20020141231 Magnetic random-access memory
10/03/2002US20020141228 Low power consumption semiconductor memory
10/03/2002US20020141227 Semiconductor device in which storage electrode of capacitor is connected to gate electrode of fet and inspection method thereof
10/03/2002US20020141226 Semiconductor memory device and control method thereof
10/03/2002US20020141223 FeRAM having adjacent memory cells sharing cell plate and driving method for the same
10/03/2002US20020141220 Bi-level digit line architecture for high density DRAMS
10/03/2002US20020141168 High-frequency circuit board and semiconductor device using the high-frequency circuit board
10/03/2002US20020141160 Adjusting fillet geometry to couple a heat spreader to a chip carrier
10/03/2002US20020141134 Electrostatic wafer clamp
10/03/2002US20020141133 Semiconductor wafer lifting device and methods for implementing the same
10/03/2002US20020141132 Electrostatic chuck apparatus and method for efficiently dechucking a substrate therefrom
10/03/2002US20020141071 Illumination system with reduced heat load
10/03/2002US20020140920 System and method for printing semiconductor patterns using an optimized illumination and reticle
10/03/2002US20020140916 Multiple chamber fluid mount
10/03/2002US20020140915 Exposure method and apparatus, and device manufacturing method
10/03/2002US20020140877 Thin film transistor for liquid crystal display and method of forming the same
10/03/2002US20020140609 High-frequency semiconductor device
10/03/2002US20020140565 Monitoring apparatus and method for tape automated bonding process
10/03/2002US20020140468 Semiconductor integrated circuit and method for generating internal supply voltage in semiconductor integrated circuit
10/03/2002US20020140459 Semiconductor integrated circuit device and pulse width changing circuit
10/03/2002US20020140454 Semiconductor device having a plurality of macros
10/03/2002US20020140450 Methods of engaging electrically conductive test pads on a semiconductor substrate removable electrical interconnect apparatuses, engagement probes and removable engagement probes
10/03/2002US20020140448 Inspection apparatus and sensor
10/03/2002US20020140447 On-chip temperature detection device
10/03/2002US20020140445 Tester and holder for tester
10/03/2002US20020140444 Device testing contactor, method of producing the same, and device testing carrier
10/03/2002US20020140437 Structure and method for electrical method of determining film conformality
10/03/2002US20020140416 Probe for electro-optic sampling oscilloscope
10/03/2002US20020140383 Charged particle beam exposing apparatus
10/03/2002US20020140359 Stacked RF excitation coil for inductive plasma processor
10/03/2002US20020140298 Electromagnetic actuator and exposure apparatus having the same
10/03/2002US20020140148 Holding means
10/03/2002US20020140135 Multilayered ceramic substrate production method
10/03/2002US20020140130 Method and apparatus for reconditioning a shipping container
10/03/2002US20020140115 Semiconductor device
10/03/2002US20020140114 Sealing apparatus for semiconductor wafer, mold of sealing apparatus, semiconductor wafer and method for manufacturing semiconductor device by using sealing apparatus
10/03/2002US20020140113 Encapsulated semiconductor die package, and method for making same
10/03/2002US20020140109 Decoupling capacitors for thin gate oxides
10/03/2002US20020140108 Molded body for pbga and chip-scale packages
10/03/2002US20020140107 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
10/03/2002US20020140106 Twisted wordline strapping arrangement
10/03/2002US20020140104 Method of making a semiconductor device having a dual damascene interconnect spaced from a support structure
10/03/2002US20020140103 Structure in a microelectronic device including a bi-layer for a diffusion barrier and an etch-stop layer
10/03/2002US20020140102 Multi-layered barrier metal thin films for Cu interconnect by ALCVD
10/03/2002US20020140101 Stabilizing fluorine etching of low-k materials
10/03/2002US20020140100 Semiconductor device and method for fabricating the same
10/03/2002US20020140099 Semiconductor device and method for manufacturing the same
10/03/2002US20020140098 Semiconductor device and method of manufacturing the same
10/03/2002US20020140097 Semiconductor device
10/03/2002US20020140096 Method and structure for ex-situ polymer stud grid array contact formation
10/03/2002US20020140095 Semiconductor package and method of manufacturing the same
10/03/2002US20020140094 Fluxless flip chip interconnection
10/03/2002US20020140093 Conductor bodies attached adhesive sheet, process for producing semiconductor device and semiconductor device
10/03/2002US20020140089 High frequency semiconductor device
10/03/2002US20020140088 Semiconductor integrated circuit having three-dimensional interconnection lines
10/03/2002US20020140087 High frequency semiconductor device
10/03/2002US20020140086 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
10/03/2002US20020140085 Semiconductor package including passive elements and method of manufacture
10/03/2002US20020140083 Semiconductor device haivng resin-sealed area on circuit board thereof
10/03/2002US20020140076 Multi-layer wiring circuit board and method for producing the same
10/03/2002US20020140070 Packaging system for die-up connection of a die-down oriented integrated circuit
10/03/2002US20020140069 Structure and manufactruing method of chip scale package
10/03/2002US20020140066 Semiconductor device having flat electrodes of a first semiconductor pellet and protruded electrodes of a second semiconductor pellet directly contacted with the flat electrodes
10/03/2002US20020140063 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
10/03/2002US20020140062 Semiconductor package
10/03/2002US20020140060 Semiconductor memory device using magneto resistive effect element
10/03/2002US20020140058 IC chip
10/03/2002US20020140057 High frequency semiconductor device
10/03/2002US20020140056 Treatment for film surface to reduce photo footing
10/03/2002US20020140053 Thin-film resistor and method of fabrication
10/03/2002US20020140052 High frequency semiconductor device
10/03/2002US20020140051 Three-dimensional memory array and method of fabrication
10/03/2002US20020140050 Semiconductor device having an inductor with low loss
10/03/2002US20020140049 High frequency integrated devices
10/03/2002US20020140048 Semiconductor integrated circuit device, and method of manufacturing the same
10/03/2002US20020140047 Process for integrating in a same chip a non-volatile memory and a high-performance logic circuitry
10/03/2002US20020140044 Semiconductor device and its manufacturing method
10/03/2002US20020140043 Semiconductor device and method of manufacturing the same
10/03/2002US20020140042 Ultra low QGD power MOSFET
10/03/2002US20020140041 Semiconductor device and method for fabricating the same
10/03/2002US20020140039 Double gate trench transistor
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