Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2002
10/03/2002WO2002078054A2 Integrated circuit package with a capacitor
10/03/2002WO2002078045A2 Methods and apparatus for scanned beam uniformity adjustment in ion implanters
10/03/2002WO2002078044A2 Method of processing a surface of a workpiece
10/03/2002WO2002078043A2 Beam processing apparatus
10/03/2002WO2002078042A2 Neutral particle beam processing apparatus
10/03/2002WO2002078041A2 Neutral particle beam processing apparatus
10/03/2002WO2002078040A2 Neutral particle beam processing apparatus
10/03/2002WO2002078024A1 Thin film capacitor and thin film electronic component and method for fabricating the same
10/03/2002WO2002077922A1 Image detection method, image detection apparatus, and wafer treatment apparatus
10/03/2002WO2002077716A2 Scanning probe based lithographic alignment
10/03/2002WO2002077712A2 Photoresist composition
10/03/2002WO2002077710A2 Photoresist compositions for short wavelength imaging
10/03/2002WO2002077709A2 Photoresist composition
10/03/2002WO2002077692A1 Optical system manufacturing method and exposure device having an optical system manufactured by the manufacturing method
10/03/2002WO2002077654A1 Method of detecting carrier dose of a semiconductor wafer
10/03/2002WO2002077628A1 Data collection methods and apparatus
10/03/2002WO2002077621A1 Detection and classification of micro-defects in semi-conductors
10/03/2002WO2002077589A2 Method and apparatus for endpoint detection using partial least squares
10/03/2002WO2002077485A1 Multiple chamber fluid mount
10/03/2002WO2002077484A2 Method and device for vibration control
10/03/2002WO2002077327A2 Mask plate design
10/03/2002WO2002077321A1 Method for forming metal pattern
10/03/2002WO2002077320A1 Method for producing hydrogenated silicon oxycarbide films
10/03/2002WO2002077303A1 Method for manufacturing radiating member for electronic equipment
10/03/2002WO2002077120A1 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
10/03/2002WO2002076735A1 Compliant pre-form interconnect
10/03/2002WO2002076699A1 Laser scribing of wafers
10/03/2002WO2002076666A2 A laser machining system and method
10/03/2002WO2002076641A2 Cleaning apparatus and cleaning method
10/03/2002WO2002076640A1 Vertical process reactor
10/03/2002WO2002076581A1 Trap apparatus and method for condensable by-products of deposition reactions
10/03/2002WO2002076511A2 Plasma surface treatment method and device for carrying out said method
10/03/2002WO2002060643A3 Spherical drive assembly for chemical mechanical planarization
10/03/2002WO2002054449A3 Silicon carbide and related wide-bandgap transistors on semi-insulating epitaxy for high-speed, high-power applications
10/03/2002WO2002031217A3 Sputter targets
10/03/2002WO2002025292A3 Manipulator for a test head with active compliance
10/03/2002WO2002015238A3 Device and method for optical inspection of semiconductor wafer
10/03/2002WO2002006902A3 Method and system of automatic fluid dispensing for imprint lithography processes
10/03/2002WO2002003462A3 Self retained pressure connection
10/03/2002WO2001088960A3 Method of molecular-scale pattern imprinting at surfaces
10/03/2002WO2001086703A3 Method and apparatus for sorting semiconductor devices
10/03/2002WO2001052321A3 Uniform recess depth of recessed resist layers in trench structures
10/03/2002WO2001017692A9 Improved apparatus and method for growth of a thin film
10/03/2002WO2001004226A3 Cmp composition containing silane modified abrasive particles
10/03/2002WO2000026609A3 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
10/03/2002WO2000024549A3 Stiffly bonded thin abrasive wheel
10/03/2002WO2000007191A3 Method to write/read mram arrays
10/03/2002WO2000001010A3 Method for producing semiconductor components
10/03/2002WO1999062113A3 Method for producing schottky diodes
10/03/2002US20020144232 Alleviating line end shortening in transistor endcaps by extending phase shifters
10/03/2002US20020144223 Logic circuit design equipment and method for designing logic circuit for reducing leakage current
10/03/2002US20020144221 Manufacturing process evaluation method for semiconductor device and pattern shape evaluation apparatus using the evaluation method
10/03/2002US20020144200 Scan test system for semiconductor device
10/03/2002US20020144125 Semiconductor integrated circuit with function to manage license information
10/03/2002US20020143517 Logical simulation system, logical simulation method and computer-readable recorded medium
10/03/2002US20020143483 Inspection system, inspection apparatus, inspection program, and production method of semiconductor devices
10/03/2002US20020143427 Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system
10/03/2002US20020143426 Inertial temperature control system and method
10/03/2002US20020143424 Device and method of selecting photomask manufacturer based on received data
10/03/2002US20020143422 Manufacturing apparatus, control method of manufacturing apparatus, control system of manufacturing apparatus, computer readable recording medium with control program of manufacturing apparatus recorded therein and control program of manufacturing apparatus
10/03/2002US20020143417 Characteristic adjusting method in process of manufacturing products
10/03/2002US20020143202 Method of depositing a high-adhesive copper thin film on a metal nitride substrate
10/03/2002US20020143200 Dissolving NbCl5 (niobium chloride) or TaCl5(tantalum chloride) in an alcohol containing ammonia; reacting in low temperature to form niobium(V) alkoxide or the tantalum(V) alkoxide
10/03/2002US20020143091 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
10/03/2002US20020142710 Adjustable force applying air platen and spindle system, and methods for using the same
10/03/2002US20020142706 Method and configuration for conditioning a polishing pad surface
10/03/2002US20020142661 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
10/03/2002US20020142624 Method of forming dielectric films
10/03/2002US20020142623 Method of forming insulating film and method of manufacturing semiconductor device
10/03/2002US20020142622 Method of manufacturing semiconductor device having buried metal wiring
10/03/2002US20020142619 Solution composition and process for etching silicon
10/03/2002US20020142617 Method for evaluating a wafer cleaning operation
10/03/2002US20020142616 Method for improved fabrication of salicide structures
10/03/2002US20020142615 Etching apparatus and etching method
10/03/2002US20020142614 Heat treatment redistributes Cu particles segregated in the Al-Cu alloy layer during the O2-plasma pretreatment, preventing occurrence of a short-circuit failure.
10/03/2002US20020142613 Method for controlling etching depth
10/03/2002US20020142611 Corrosion resistant component of semiconductor processing equipment such as a plasma chamber
10/03/2002US20020142610 Plasma etching of dielectric layer with selectivity to stop layer
10/03/2002US20020142609 Reverse reactive ion patterning of metal oxide films
10/03/2002US20020142608 Method of etching a substrate
10/03/2002US20020142607 Process for improving the etch stability of ultra-thin photoresist
10/03/2002US20020142606 Method for forming a borderless contact of a semiconductor device
10/03/2002US20020142605 Method for forming metal line of Al/Cu structure
10/03/2002US20020142604 Method for forming aluminum bumps by sputtering and chemical mechanical polishing
10/03/2002US20020142603 Method for forming square-shouldered sidewall spacers and devices fabricated
10/03/2002US20020142602 Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device
10/03/2002US20020142601 Method for planarizing a surface of a semiconductor wafer with a fixed abrasive material
10/03/2002US20020142600 Abrasive composition for the integrated circuits electronics industry
10/03/2002US20020142599 XeF2 source chamber having a tray or ampoule for XeF2 crystals, a reservoir coupled to the chamber via a valve that allows sublimation to XeF2 gas, a flow controller fed by the reservoir
10/03/2002US20020142598 Plasma dielectric etch process using a long fluorocarbon
10/03/2002US20020142597 Mask for a photolithography process and method of fabricating the same
10/03/2002US20020142596 Integrated circuit comprising a metal silicide layer etched within an environment that provides high selectivity to polysilicon, especially a Cl2/O2 atmosphere having an O2 concentration of greater than or equal to 25% by volume.
10/03/2002US20020142595 Method of rinsing residual etching reactants/products on a semiconductor wafer
10/03/2002US20020142594 Sacrificial films to provide structural integrity to critical dimension structures
10/03/2002US20020142593 Method and apparatus for plasma etching a wafer
10/03/2002US20020142592 Selectively depositing a first metallic passivation layer on the top copper surfaces to prevent Cu oxidation and/or Cu out-diffusion; depositing a final passivation layer; exposing the passivated Cu; selective immersion deposition of Au.
10/03/2002US20020142591 Method of synthesizing copper precursors
10/03/2002US20020142590 Method of barrier metal surface treatment prior to Cu deposition to improve adhesion and trench filling characteristics
10/03/2002US20020142589 Method of obtaining low temperature alpha-ta thin films using wafer bias
10/03/2002US20020142588 Mixed composition interface layer and method of forming
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