Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/09/2003WO2002027791A3 Polymer stud grid array and method for production thereof
01/09/2003WO2002025709A3 Integrated thin film capacitor/inductor/interconnect system and method
01/09/2003WO2002017030A3 Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control
01/09/2003WO2002012115A3 Methods for reducing the curvature in boron-doped silicon micromachined structures
01/09/2003WO2002007210A3 Method and apparatus for modeling thickness profiles and controlling subsequent etch process
01/09/2003WO2001057927A9 Silicon nanoparticle field effect transistor and transistor memory device
01/09/2003US20030009739 Pattern data generation system, method and program for pattern data generation, reticle fabricating method, and semiconductor device manufacturing method using the pattern data
01/09/2003US20030009734 Method for generating design constraints for modules in a hierarchical integrated circuit design system
01/09/2003US20030009727 Circuit designing apparatus, circuit designing method and timing distribution apparatus
01/09/2003US20030009471 Semiconductor intellectual property distribution system and semiconductor intellectual property distribution method
01/09/2003US20030009311 Apparatus for predicting life of rotary machine, equipment using the same, method for predicting life and determining repair timing of the same
01/09/2003US20030009256 Apparatus and method for controlling semiconductor manufacturing system utilizing recycled wafers
01/09/2003US20030009251 Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
01/09/2003US20030009044 For producing ceramic protective layers
01/09/2003US20030008998 Interlayer dielectric film
01/09/2003US20030008968 Coating a patterned resist layer on a substrate surface with an aqueous coating solution comprising a water-soluble resin and a water-soluble amine compound; drying; heat treatment to effect thermal shrinkage of the coating layer; removing
01/09/2003US20030008602 Method and apparatus of sealing wafer backside for full-face electrochemical plating
01/09/2003US20030008600 Method and apparatus for chemical-mechanical polishing
01/09/2003US20030008599 Method for chemical mechanical polishing (CMP) with altering the concentration of oxidizing agent in slurry
01/09/2003US20030008598 Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
01/09/2003US20030008530 Method of manufacturing semiconductor laser element
01/09/2003US20030008529 System and method of laser sintering dies and dies sintered by laser sintering
01/09/2003US20030008528 Surface treatment of c-doped SiO2 film to enhance film stability during 02 ashing
01/09/2003US20030008527 Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant substrate and laser radiation for materials used to form the same
01/09/2003US20030008526 Method of forming variable oxide thicknesses across semiconductor chips
01/09/2003US20030008525 Ionic additives for extreme low dielectric constant chemical formulations
01/09/2003US20030008524 Method of forming a thin oxide layer having improved reliability on a semiconductor surface
01/09/2003US20030008523 Method for forming insulating film and for manufacturing integrated circuit
01/09/2003US20030008522 Applying composition that includes at least one silicon-based dielectric precursor to a substrate, gelling or aging the applied coating, separating coating, curing
01/09/2003US20030008521 Method of forming lattice-matched structure on silicon and structure formed thereby
01/09/2003US20030008520 Method of forming lattice-matched structure on silicon and structure formed thereby
01/09/2003US20030008519 Method and apparatus for fabricating structures using chemically selective endpoint detection
01/09/2003US20030008518 Method of avoiding dielectric layer deterioation with a low dielectric constant
01/09/2003US20030008517 Method of reducing particulates in a plasma etch chamber during a metal etch process
01/09/2003US20030008516 Method of reinforcing a low dielectric constant material layer against damage caused by a photoresist stripper
01/09/2003US20030008515 Method of fabricating a vertical MOS transistor
01/09/2003US20030008513 Structures formed by converting exposed portions of photo-definable layer to insulative material and using non-exposed portions in negative pattern scheme, or exposed portions in positive pattern scheme, to transfer pattern
01/09/2003US20030008512 Process for forming a dual damascene structure
01/09/2003US20030008511 Dual damascene structure employing nitrogenated silicon carbide and non-nitrogenated silicon carbide ETCH stop layers
01/09/2003US20030008510 Thin flip-chip method
01/09/2003US20030008509 Method and apparatus for fabricating semiconductor devices
01/09/2003US20030008508 Deadhesion method and mechanism for wafer processing
01/09/2003US20030008507 Method of monitoring a production process
01/09/2003US20030008506 Anti-stiction method and apparatus for drying wafer using centrifugal force
01/09/2003US20030008504 Etchant, etching method and semiconductor silicon waffer
01/09/2003US20030008503 Introducing organic gas comprising halogen into chamber, wherein organic gas forms adhesive polymers with particles and depositing polymers onto wall of chamber
01/09/2003US20030008502 Comprising imaging polymer and radiation sensitive acid generator, imaging polymer comprising cyano-modified acrylic monomer units comprising an acrylic moiety with a cyano group pendant therefrom
01/09/2003US20030008501 Tantalum nitride CVD deposition by tantalum oxide densification
01/09/2003US20030008500 Plasma semiconductor processing system and method
01/09/2003US20030008499 Method of manufacturing semiconductor device and semiconductor device
01/09/2003US20030008498 Semiconductor device and method of fabricating the same
01/09/2003US20030008497 Thermal annealing/hydrogen containing plasma method for forming structurally stable low contact resistance damascene conductor structure
01/09/2003US20030008496 Method for making an electronic component with self-aligned drain and gate, in damascene architecture
01/09/2003US20030008495 Selective barrier metal fabricated for interconnect structure manufacturing process
01/09/2003US20030008494 Multi-step planarizing method for forming a patterned thermally extrudable material layer
01/09/2003US20030008493 Interconnect structure manufacturing
01/09/2003US20030008492 Method for fabricating semiconductor device and forming interlayer dielectric film using high-density plasma
01/09/2003US20030008491 Integrated circuitry
01/09/2003US20030008490 Dual hardmask process for the formation of copper/low-k interconnects
01/09/2003US20030008489 Method of making bondable leads using positive photoresist and structures made therefrom
01/09/2003US20030008488 Method for manufacturing non-volatile semiconductor memory and non-volatile semiconductor memory manufactured thereby
01/09/2003US20030008487 MOS transistors and methods for manufacturing the same
01/09/2003US20030008486 Method of fabricating a MOS transistor with a drain extension and corresponding transistor
01/09/2003US20030008485 Apparatus for self-doping contacts to a semiconductor
01/09/2003US20030008484 Angled implant process
01/09/2003US20030008483 Distance between diode and well resistor of device is shortened to achieve high integration without degradation in insulating characteristics
01/09/2003US20030008482 Method of providing polysilicon spacer for implantation
01/09/2003US20030008481 Method for controlling dopant profiles and dopant activation by electron beam processing
01/09/2003US20030008480 Process for manufacturing silicon epitaxial wafer
01/09/2003US20030008479 Silicon substrate wafer fabrication method employing halogen gettering material and/or plasma annealing
01/09/2003US20030008478 Production method for silicon wafer and soi wafer, and soi wafer
01/09/2003US20030008477 Smoothing method for cleaved films made using a release layer
01/09/2003US20030008476 Method of fabricating a wafer level package
01/09/2003US20030008475 Method for fabricating multi-layered substrates
01/09/2003US20030008474 Method of forming shallow trench isolation
01/09/2003US20030008473 Anodizing method and apparatus and semiconductor substrate manufacturing method
01/09/2003US20030008472 Semiconductor device and fabrication process thereof
01/09/2003US20030008471 Control of buried oxide quality in low dose SIMOX
01/09/2003US20030008470 Method for manufacturing thin-film capacitor for performing temperature compensation of junction capacitance of semiconductor device
01/09/2003US20030008469 DRAM cell capacitor and manufacturing method thereof
01/09/2003US20030008468 Method of fabricating capacitor in semiconductor device and the capacitor
01/09/2003US20030008467 Darc layer for MIM process integration
01/09/2003US20030008466 Semiconductor device and method of fabricating the same
01/09/2003US20030008465 Method of fabricating a LDD with different resistance value
01/09/2003US20030008464 Method for forming shallow retrograde wells in semiconductor device and shallow retrograde wells formed thereby
01/09/2003US20030008463 Circuit protecting against electrostatic discharge
01/09/2003US20030008462 Insulated gate field effect transistor and manufacturing thereof
01/09/2003US20030008461 Flash memory with ultra thin vertical body transistors
01/09/2003US20030008460 Trench mosfet having implanted drain-drift region
01/09/2003US20030008459 Method of manufacturing semiconductor device and flash memory
01/09/2003US20030008458 Semiconductor integrated circuit device and method of producing the same
01/09/2003US20030008457 Semiconductor device and process for same
01/09/2003US20030008456 Capacitor of a semiconductor memory device and method of forming the same
01/09/2003US20030008455 Method for fabricating capacitor of semiconductor memory device
01/09/2003US20030008454 Fabricating capacitor of semiconductor device
01/09/2003US20030008453 Semiconductor device having a contact window and fabrication method thereof
01/09/2003US20030008452 Semiconductor device and its fabrication method
01/09/2003US20030008451 Contactless channel write/erase flash memory cell and its fabrication method
01/09/2003US20030008450 Self-aligned process for a stacked gate RF MOSFET device
01/09/2003US20030008445 MOSgated device with trench structure and remote contact and process for its manufacture