Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2003
01/09/2003US20030006461 Integrated circuit device
01/09/2003US20030006460 Semiconductor device formed on a single semiconductor substrate having semiconductor elements operated at a predetermined voltage and a voltage lower than that
01/09/2003US20030006459 Method of controlling floating body effects in an asymmetrical SOI device
01/09/2003US20030006457 MIS semiconductor device and method of fabricating the same
01/09/2003US20030006456 Semiconductor device and manufacturing method thereof
01/09/2003US20030006455 Semiconductor devices having group III-V compound layers
01/09/2003US20030006454 Trench MOSFET having implanted drain-drift region and process for manufacturing the same
01/09/2003US20030006453 Power MOSFET having enhanced breakdown voltage
01/09/2003US20030006452 Trench structure for semiconductor devices
01/09/2003US20030006451 Structure of flash memory
01/09/2003US20030006450 Two bit non-volatile electrically erasable and programmable memory structure, a process for producing said memory structure and methods for programming, reading and erasing said memory structure
01/09/2003US20030006449 Semiconductor device comprising a non-volatile memory
01/09/2003US20030006448 Flash memory array structure and method of forming
01/09/2003US20030006447 Capacitor having a tantalum lower electrode and method of forming the same
01/09/2003US20030006446 Memory address and decode circuits with ultra thin body transistors
01/09/2003US20030006445 Semiconductor memory reducing current consumption and narrow channel effect and method of manufacturing the same
01/09/2003US20030006444 Semiconductor device and method of manufacturing the same
01/09/2003US20030006443 Semiconductor device having a capacitor and method for the manufacture thereof
01/09/2003US20030006441 Semiconductor integrated circuit device and process for manufacturing
01/09/2003US20030006440 Integrated circuit device including a layered superlattice material with an interface buffer layer
01/09/2003US20030006439 Hydrogen barrier encapsulation techniques for the control of hydrogen induced degradation of ferroelectric capacitors in conjunction with multilevel metal processing for non-volatile integrated circuit memory devices
01/09/2003US20030006438 Semiconductor device with function of modulating gain coefficient and semiconductor integrated circuit including the same
01/09/2003US20030006437 Field effect transistor
01/09/2003US20030006436 Radio frequency modules and modules for moving target detection
01/09/2003US20030006433 Semiconductor integrated circuit device
01/09/2003US20030006431 Integrated semiconductor DRAM-type memory device and corresponding fabrication process
01/09/2003US20030006428 Memory cell, memory cell arrangement and fabrication method
01/09/2003US20030006427 Thin film crystal wafer with pn-junction and its manufacturing process
01/09/2003US20030006426 GaAs-based semiconductor field-effect transistor
01/09/2003US20030006425 Manufacturing process and termination structure for fast recovery diode
01/09/2003US20030006424 Light-emitting gallium nitride-based compound semiconductor device
01/09/2003US20030006414 Semiconductor device and method for forming the same
01/09/2003US20030006413 Semiconductor test system and associated methods for wafer level acceptance testing
01/09/2003US20030006410 Quantum wire gate device and method of making same
01/09/2003US20030006409 Nitride compound semiconductor element
01/09/2003US20030006406 Thin film device and its fabrication method
01/09/2003US20030006396 Polishing composition for CMP having abrasive particles
01/09/2003US20030006381 Method and apparatus for pyroelectric lithography using patterned emitter
01/09/2003US20030006372 Automatic focusing system for scanning electron microscope equipped with laser defect detection function
01/09/2003US20030006271 Room temperature gold wire bonding
01/09/2003US20030006267 Room temperature gold wire bonding
01/09/2003US20030006266 Bonding system
01/09/2003US20030006265 Resonator for ultrasonic wire bonding
01/09/2003US20030006221 Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
01/09/2003US20030006218 Deposited film forming method and deposited film forming apparatus
01/09/2003US20030006216 Etching apparatus
01/09/2003US20030006214 Method to repair localized amplitude defects in a EUV lithography mask blank
01/09/2003US20030006211 Substrate including wide low-defect region for use in semiconductor element
01/09/2003US20030006147 Method and apparatus for electro-chemical mechanical deposition
01/09/2003US20030006135 Plating apparatus and plating method, and method of manufacturing semiconductor device
01/09/2003US20030006062 Interconnect system and method of fabrication
01/09/2003US20030006019 Electrically controlled plasma uniformity in a high density plasma source
01/09/2003US20030006013 Die bonding device
01/09/2003US20030006010 Support apparatus for a wafer
01/09/2003US20030006009 Process chamber having a voltage distribution electrode
01/09/2003US20030005949 Such as for silicon wafers; adjusting the state of the solvent which contacts the workpiece to be cleaned by controlling a distance between the nozzle and the workpiece to be cleaned to a predetermined value
01/09/2003US20030005948 For semiconductor wafers; an openable and closable outer shell that a gas-tight space with an inner shell that contains a holder and dispenser, permits cleaning of the substrate within the gas-tight space
01/09/2003US20030005947 Substrate handling end effector
01/09/2003US20030005944 Stable, oxide-free silicon surface preparation
01/09/2003US20030005886 Horizontal reactor for compound semiconductor growth
01/09/2003US20030005885 Coating and curing system
01/09/2003US20030005881 Method for forming contact plug of semiconductor device
01/09/2003US20030005879 Method for producing coated workpieces, uses and installation for the method
01/09/2003US20030005707 Heat treatment unit, cooling unit and cooling treatment method
01/09/2003US20030005647 Reactive aqueous metal oxide sols as polishingslurries for low dielectric constant materials
01/09/2003US20030005596 Device for performing surface treatment on semiconductor wafers
01/09/2003US20030005582 Circuit board, method for manufacturing same, and high-output module
01/09/2003US20030005572 Integrated inductor
01/09/2003US20030005561 Light curtain system for establishing a protective light curtain, tool and system for processing objects and method for loading/unloading a tool
01/09/2003US20030005537 Cleaning sponge roller
01/09/2003DE10141988C1 Modular heat sink manufacturing method uses transverse pressure for clamping projection of one extruded profile in channel of adjacent extruded profile by plastic deformation of Al wire
01/09/2003CA2447369A1 Opto-electronic device integration
01/09/2003CA2447368A1 Opto-electronic device integration
01/09/2003CA2447365A1 Opto-electronic device integration
01/09/2003CA2447364A1 Topside active optical device apparatus and method
01/09/2003CA2447348A1 Optical chip packaging via through hole
01/09/2003CA2447345A1 Opto-electronic device integration
01/08/2003EP1274287A1 Debris removing system for use in X-ray source
01/08/2003EP1274280A1 Ceramic heater
01/08/2003EP1274167A2 Surface acoustic wave element and manufacturing method of the same
01/08/2003EP1274135A1 GaAs-based semiconductor field-effect transistor
01/08/2003EP1274134A2 MOS transistor and its fabrication method
01/08/2003EP1274133A2 Thin-film crystal wafer having a pn junction and its manufacturing method
01/08/2003EP1274132A2 Semiconductor non volatile memory device and method of producing the same
01/08/2003EP1274131A1 Antistatic contact for a line in polycrystalline silicon
01/08/2003EP1274129A2 Electronic arrangement and associated process
01/08/2003EP1274126A2 Circuit board, method for manufacturing same, and high-output module
01/08/2003EP1274125A2 Circuit board, method for manufacturing same, and high-output module
01/08/2003EP1274124A1 Ceramic substrate
01/08/2003EP1274123A1 Polishing compound for polishing semiconductor device and method for manufacturing semiconductor device using the same
01/08/2003EP1274122A1 Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method
01/08/2003EP1274121A1 Wafer chuck for supporting a semiconductor wafer
01/08/2003EP1274096A2 Control gate and word line voltage boosting scheme for twin MONOS memory cells
01/08/2003EP1274095A2 Twin MONOS cell array metal bitline organization and single cell operation
01/08/2003EP1274093A2 A control gate decoder for twin MONOS memory with two bit erase capability
01/08/2003EP1273974A2 Method for reducing a pattern dimension in a photoresist layer
01/08/2003EP1273973A1 Method for adjusting a temperature in a resist process
01/08/2003EP1273961A2 Method for producing a liquid-crystal display apparatus
01/08/2003EP1273684A2 Low defect density, vacancy dominated silicon
01/08/2003EP1273683A2 Atomic layer deposition method using a group IV metal precursor