| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/16/2003 | US20030010999 Semiconductor device |
| 01/16/2003 | US20030010998 Apparatus and techniques for implementing wireless communication between integrated transmitters and integrated receivers |
| 01/16/2003 | US20030010995 Low-voltage punch-through bi-directional transient-voltage suppression devices having surface breakdown protection and methods of making the same |
| 01/16/2003 | US20030010990 Active matrix panel |
| 01/16/2003 | US20030010984 Integrated light source frequency adjustment, injection locking or modulation of dielectric resonator |
| 01/16/2003 | US20030010982 Semiconductor device and fabricating method thereof |
| 01/16/2003 | US20030010980 Semiconductor device and method for manufacturing same |
| 01/16/2003 | US20030010978 Semiconductor wafers with integrated heat spreading layer |
| 01/16/2003 | US20030010976 Method of manufacturing a probe card |
| 01/16/2003 | US20030010974 Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials |
| 01/16/2003 | US20030010972 Method of improving gate activation by employing atomic oxygen enhanced oxidation |
| 01/16/2003 | US20030010971 Methods of forming nano-scale electronic and optoelectronic devices using non-photolithographically defined nano-channel templates and devices formed thereby |
| 01/16/2003 | US20030010970 Active matrix substrate and method of manufacturing the same |
| 01/16/2003 | US20030010961 For the formation of an insulating film comprising a low dielectric constant polymeric material and a sublimating material(a silcone compound) which are dissolved in a solvent |
| 01/16/2003 | US20030010936 Optically detectable alignment marks producing an enhanced signal-amplitude change from scanning of a detection light over the alignment mark, and associated alighment-detection methods |
| 01/16/2003 | US20030010934 Lens array for electron beam lithography tool |
| 01/16/2003 | US20030010933 Mark-detection methods and charged-particle-beam microlithography methods and apparatus comprising same |
| 01/16/2003 | US20030010922 Switching device of an X-ray sensor and method for manufacturing the same |
| 01/16/2003 | US20030010914 Method for determining depression/protrusion of sample and charged particle beam apparatus therefor |
| 01/16/2003 | US20030010902 Optical system with a plurality of optical elements |
| 01/16/2003 | US20030010887 Method and apparatus for automatically loading a double-sided polishing machine with wafer crystals |
| 01/16/2003 | US20030010812 Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method |
| 01/16/2003 | US20030010810 Diebond strip |
| 01/16/2003 | US20030010807 Surface mounting to an irregular surface |
| 01/16/2003 | US20030010806 Wire bonding method and apparatus |
| 01/16/2003 | US20030010792 Chemical mix and delivery systems and methods thereof |
| 01/16/2003 | US20030010775 Methods and apparatuses for heat treatment of semiconductor films upon thermally susceptible non-conducting substrates |
| 01/16/2003 | US20030010765 Hot plate |
| 01/16/2003 | US20030010761 Method and apparatus for decapping integrated circuit packages |
| 01/16/2003 | US20030010759 Method of attaching a component to a connection support by welding without the addition of material |
| 01/16/2003 | US20030010751 Extrusion-free wet cleaning process for copper-dual damascene structures |
| 01/16/2003 | US20030010750 Method for determining the endpoint of etch process steps |
| 01/16/2003 | US20030010749 Mask for fabrication of semiconductor devices, process for production of the same, and process for fabrication of semiconductor devices |
| 01/16/2003 | US20030010748 Positive photosensitive compositions |
| 01/16/2003 | US20030010730 Single cast vertical wafer boat with a y shaped column rack |
| 01/16/2003 | US20030010673 Horizontal cassette |
| 01/16/2003 | US20030010672 Thin wafer carrier |
| 01/16/2003 | US20030010671 Substrate processing apparatus |
| 01/16/2003 | US20030010657 Protective shipper |
| 01/16/2003 | US20030010646 Comprising enhanced brightener concentrations which accelerate the plating rate in recesses and microvias as carrier molecules become incorporated into the plating deposit; computer printed circuits; semiconductors |
| 01/16/2003 | US20030010645 Barrier enhancement process for copper interconnects |
| 01/16/2003 | US20030010643 Transporting an article-mounted carrier into a process cell horizontally through an inlet opening, performing a process on said planar article and transporting said carrier horizontally out; automatic processing and plating system |
| 01/16/2003 | US20030010641 An annular conductive support of the substrate having a pin receiving pocket for an electrical contact pin having the part in the pocket brazed; the contact pin adapted to bias electrically the substrate; filling integrated circuits |
| 01/16/2003 | US20030010640 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 01/16/2003 | US20030010632 Method for manufacturing a semiconductor device and a plating apparatus and a sputtering apparatus therefor |
| 01/16/2003 | US20030010626 System for plating planar articles |
| 01/16/2003 | US20030010625 Processing cells for wafers and other planar articles |
| 01/16/2003 | US20030010624 System and method for forming base coat and thin film layers by sequential sputter depositing |
| 01/16/2003 | US20030010623 Method and apparatus for forming deposition film, and method for treating substrate |
| 01/16/2003 | US20030010615 Microspring with conductive coating deposited on tip after release |
| 01/16/2003 | US20030010452 Shower head of a wafer treatment apparatus having a gap controller |
| 01/16/2003 | US20030010451 Lid assembly for a processing system to facilitate sequential deposition techniques |
| 01/16/2003 | US20030010450 Input/output valve switching apparatus of semiconductor manufacturing system |
| 01/16/2003 | US20030010449 Automatic wafer processing and plating system |
| 01/16/2003 | US20030010448 Exhaust ring of dry etching device |
| 01/16/2003 | US20030010447 Aperture for linear control of vacuum chamber pressure |
| 01/16/2003 | US20030010446 Method of manufacturing a processing apparatus |
| 01/16/2003 | US20030010445 Method and apparatus for separating member |
| 01/16/2003 | US20030010444 Removal of masking tape from lead frames |
| 01/16/2003 | US20030010430 Method of detaching a film of material from a substrate |
| 01/16/2003 | US20030010425 Method for integrating image sensors with optical components |
| 01/16/2003 | US20030010395 Cylinder cabinet and method of purging remaining gas in the pipe thereof |
| 01/16/2003 | US20030010364 Apparatus for fluid control with a substrate processing tank |
| 01/16/2003 | US20030010362 Interface, process section, a process robot moveable to carry a workpiece, a drain and a chamber driver to pivot |
| 01/16/2003 | US20030010361 Applying a cleaning chemistry containing corrosion inhibitors to a surface of a wafer for a period of time, refreshing a concentration gradient, and applying rinsing and drying agents |
| 01/16/2003 | US20030010358 Clean method and apparatus for vacuum holding of substrates |
| 01/16/2003 | US20030010357 Wafer cleaning |
| 01/16/2003 | US20030010356 Single wafer megasonic cleaner method, system, and apparatus |
| 01/16/2003 | US20030010354 Fluorine process for cleaning semiconductor process chamber |
| 01/16/2003 | US20030010353 Ultrasonic cleaning method for semiconductor manufacturing equipment |
| 01/16/2003 | US20030010292 Electrostatic chuck with dielectric coating |
| 01/16/2003 | US20030010291 Hig molecular weight polymer forms effective entanglements or associations with neighboring starch molecules; melt spinning |
| 01/16/2003 | US20030010289 Environment exchange control for material on a wafer surface |
| 01/16/2003 | US20030010286 Conveyorized vacuum injection system |
| 01/16/2003 | US20030010283 Printing device and method of manufacturing a light emitting device |
| 01/16/2003 | US20030010281 Semiconductor substrate |
| 01/16/2003 | US20030010280 Epitaxial semiconductor wafer and a manufacturing method thereof |
| 01/16/2003 | US20030010276 Method and apparatus for growing single crystal |
| 01/16/2003 | US20030010275 Method for fabricating ultra thin single-crystal metal oxide wave retarder plates and waveguide polarization mode converter using the same |
| 01/16/2003 | US20030010091 System and method for detecting occlusions in a semiconductor manufacturing device |
| 01/16/2003 | US20030009904 Wafer carrier, wafer conveying system, stocker, and method of replacing gas |
| 01/16/2003 | US20030009901 Wafer drying apparatus |
| 01/16/2003 | US20030009878 Method for attaching an electronic component to a substrate |
| 01/16/2003 | US20030009876 Method and device for chip mounting |
| 01/16/2003 | US20030009866 Capacitor manufacturing method |
| 01/16/2003 | DE10145468C1 Process for fixing a semiconductor device on a switching device, used in flip-chip technology, comprises preparing a semiconductor device with bond pads on one surface |
| 01/16/2003 | DE10140661C1 Production of a flip-chip module, comprises placing chip on a continuously moving support using an adhesive, and applying a pressure to the chips on the support until the adhesive is hardened |
| 01/16/2003 | CA2447728A1 Nanoscale wires and related devices |
| 01/15/2003 | EP1276220A2 Power supply with pyroelectric capacitor |
| 01/15/2003 | EP1276152A2 Passive devices and modules for transceiver and manufacturing method thereof |
| 01/15/2003 | EP1276148A2 Semiconductor device and method of manufacturing the same |
| 01/15/2003 | EP1276147A2 Dual hardmask process for the formation of copper/low-K interconnects |
| 01/15/2003 | EP1276146A2 Damascene cap layer process for integrated circuit interconnects |
| 01/15/2003 | EP1276145A2 Sample chuck with compound construction |
| 01/15/2003 | EP1276144A2 A method and apparatus for detecting breakdown in ultra thin dielectric layers. |
| 01/15/2003 | EP1276143A2 A mold |
| 01/15/2003 | EP1276142A2 Method and apparatus for decapping integrated circuit packages |
| 01/15/2003 | EP1276141A1 Method for manufacturing annealed wafer and annealed wafer |
| 01/15/2003 | EP1276140A2 Substrate including wide low-defect region for use in semiconductor element |
| 01/15/2003 | EP1276139A2 Capacitor and method of manufacturing the same |