| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/16/2003 | WO2003005435A1 Substrate treating device and substrate treating method, substrate flattening method |
| 01/16/2003 | WO2003005434A2 Method for reducing surface rugosity of a semiconductor slice |
| 01/16/2003 | WO2003005433A2 Integrated circuit device including a layered superlattice material with an interface buffer layer |
| 01/16/2003 | WO2003005432A1 Method and apparatus for forming film having low dielectric constant, and electronic device using the film |
| 01/16/2003 | WO2003005431A1 Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit |
| 01/16/2003 | WO2003005430A2 Method and apparatus for controlling a plating process |
| 01/16/2003 | WO2003005429A1 Method for preparing low dielectric films |
| 01/16/2003 | WO2003005427A1 Processing system and cleaning method |
| 01/16/2003 | WO2003005426A1 Semiconductor structure with temperature control device |
| 01/16/2003 | WO2003005425A1 Semiconductor layer formation utilizing laser irradiation |
| 01/16/2003 | WO2003005424A1 Coating device and coating method |
| 01/16/2003 | WO2003005423A1 Substrate processing apparatus |
| 01/16/2003 | WO2003005422A2 Datum plate for use in installations of substrate handling systems |
| 01/16/2003 | WO2003005421A2 Fabricating structures using chemo-mechanical polishing and chemically-selective endpoint detection |
| 01/16/2003 | WO2003005420A2 Method and apparatus for fabricating structures using chemically selective endpoint detection |
| 01/16/2003 | WO2003005418A2 Assembly for manipulating and/or storing a mask and/or a substrate |
| 01/16/2003 | WO2003005416A2 Trench structure for semiconductor devices |
| 01/16/2003 | WO2003005414A2 Power mosfet with deep implanted junctions |
| 01/16/2003 | WO2003005413A2 Fast swap dual substrate transport for load lock |
| 01/16/2003 | WO2003005412A2 Method and apparatus for production line screening |
| 01/16/2003 | WO2003005411A2 Method for producing a stepped structure on a substrate |
| 01/16/2003 | WO2003005396A2 Method and apparatus for scanned instrument calibration |
| 01/16/2003 | WO2003005385A1 Capacitor having improved electrodes |
| 01/16/2003 | WO2003005377A2 Passivating overcoat bilayer |
| 01/16/2003 | WO2003005296A1 An injection moulded product and a method for its manufacture |
| 01/16/2003 | WO2003005128A1 Sensor for determining radiated energy and use thereof |
| 01/16/2003 | WO2003005124A1 A stamp having an antisticking layer and a method of forming of repairing such a stamp |
| 01/16/2003 | WO2003005115A1 An etchant for a wire, a method for manufacturing the wire and a method for manufacturing a thin film transistor array panel including the method |
| 01/16/2003 | WO2003005097A1 Projection optical system and exposure device having the projection optical system |
| 01/16/2003 | WO2003004967A1 Position detection apparatus, position detection method, and electr5onic part convey apparatus |
| 01/16/2003 | WO2003004966A1 Interferometry system and method employing an angular difference in propagation between orthogonally polarized input beam components |
| 01/16/2003 | WO2003004722A1 Method for cleaning reaction container and film deposition system |
| 01/16/2003 | WO2003004719A1 Mask and substrate holder arrangement |
| 01/16/2003 | WO2003004386A1 System and method for manufacturing flat display panel |
| 01/16/2003 | WO2003004180A1 Substrate handling end effector |
| 01/16/2003 | WO2003003982A2 Light-emitting nanoparticles and method of making same |
| 01/16/2003 | WO2002089188A3 Semiconductor structures utilizing binary metal oxide layers |
| 01/16/2003 | WO2002086959A3 Post-planarization clean-up |
| 01/16/2003 | WO2002074445A8 Atomizer |
| 01/16/2003 | WO2002061797A3 Icp window heater integrated with faraday shield or floating electrode between the source power coil and the icp window |
| 01/16/2003 | WO2002056348A3 Method for incorporating silicon into cvd metal films |
| 01/16/2003 | WO2002054470A3 Method for contacting a doping area on a semiconductor element |
| 01/16/2003 | WO2002054407A3 Mram write apparatus and method |
| 01/16/2003 | WO2002048434A3 Gallium nitride materials and methods for forming layers thereof |
| 01/16/2003 | WO2002043104A3 Hybrid scanning system and methods for ion implantation |
| 01/16/2003 | WO2002041080A3 Process for reducing edge roughness in patterned photoresist |
| 01/16/2003 | WO2002035300A3 Method and apparatus for embedded process control framework in tool systems |
| 01/16/2003 | WO2002029819A3 An analog functional module using magnetoresistive memory technology |
| 01/16/2003 | WO2002027805A3 A theory of the charge multiplication process in avalanche photodiodes |
| 01/16/2003 | WO2002027404A3 Mitigation of multilayer defects on a reticle |
| 01/16/2003 | WO2002009151A3 Magnetoresistive structure |
| 01/16/2003 | WO2001083844A3 Method for depositing metal and metal oxide films and patterned films |
| 01/16/2003 | WO2001073836A9 Method for modifying the surface of a fluorocarbon |
| 01/16/2003 | WO2001054176A9 Wafer bonding techniques to minimize built-in stress of silicon microstructures and micro-mirrors |
| 01/16/2003 | US20030014730 Transfer mask blank, transfer mask and exposure method |
| 01/16/2003 | US20030014729 Database for designing integrated circuit device and method for designing integrated circuit device |
| 01/16/2003 | US20030014726 Method of wiring semiconductor integrated circuit, semiconductor integrated circuit, and computer product |
| 01/16/2003 | US20030014725 Electronic circuit designing method and apparatus, and storage medium |
| 01/16/2003 | US20030014724 Method for distributing clock signals to flip-flop circuits |
| 01/16/2003 | US20030014722 Automatic layout design method of wirings in semiconductor integrated circuit |
| 01/16/2003 | US20030014720 Timing budget designing method |
| 01/16/2003 | US20030014719 Method of designing hierarchical layout of semiconductor integrated circuit, and computer product |
| 01/16/2003 | US20030014704 Test apparatus for semiconductor devices having bult-in self-test function |
| 01/16/2003 | US20030014689 Flash EEprom system |
| 01/16/2003 | US20030014205 Methods and apparatus for semiconductor testing |
| 01/16/2003 | US20030014197 Method and apparatus for wafer analysis |
| 01/16/2003 | US20030014158 Alignment of semiconductor wafers and other articles |
| 01/16/2003 | US20030014157 Method for determining a position of a robot |
| 01/16/2003 | US20030014155 High temperature substrate transfer robot |
| 01/16/2003 | US20030014145 Integration of fault detection with run-to-run control |
| 01/16/2003 | US20030014144 Feed-forward control of tci doping for improving mass-production-wise, statistical distribution of critical performance parameters in semiconductor devices |
| 01/16/2003 | US20030013416 Radio architecture |
| 01/16/2003 | US20030013394 Polishing pad conditioner for semiconductor polishing apparatus and method of monitoring the same |
| 01/16/2003 | US20030013391 Polishing apparatus |
| 01/16/2003 | US20030013387 Barrier removal at low polish pressure |
| 01/16/2003 | US20030013386 Chemical mechanical polishing compositions and methods relating thereto |
| 01/16/2003 | US20030013385 Nitride CMP slurry having selectivity to nitride |
| 01/16/2003 | US20030013380 Semiconductor wafer dividing method |
| 01/16/2003 | US20030013328 Connection assembly for integrated circuit sensors |
| 01/16/2003 | US20030013323 Method of selective removal of SiGe alloys |
| 01/16/2003 | US20030013322 High speed pick and place apparatus |
| 01/16/2003 | US20030013321 Anneal wafer manufacturing mehtod and anneal wafer |
| 01/16/2003 | US20030013320 Method of forming a thin film using atomic layer deposition |
| 01/16/2003 | US20030013319 Semiconductor structure with selective doping and process for fabrication |
| 01/16/2003 | US20030013318 Apparatus and method for forming a combined substrate structure |
| 01/16/2003 | US20030013317 Method and apparatus for etching a semiconductor die |
| 01/16/2003 | US20030013316 Method of forming wiring using a dual damascene process |
| 01/16/2003 | US20030013315 Process chamber used in manufacture of semiconductor device, capable of reducing contamination by particulates |
| 01/16/2003 | US20030013314 Method of reducing particulates in a plasma etch chamber during a metal etch process |
| 01/16/2003 | US20030013313 Process for fabricating semiconductor device |
| 01/16/2003 | US20030013312 Method of reducing particle density in a cool down chamber |
| 01/16/2003 | US20030013311 Method of avoiding dielectric layer deterioation with a low dielectric constant during a stripping process |
| 01/16/2003 | US20030013310 Method of washing a semiconductor wafer |
| 01/16/2003 | US20030013309 Dual depth trench isolation |
| 01/16/2003 | US20030013308 Method for minimizing variation in etch rate of semiconductor wafer caused by variation in mask pattern density |
| 01/16/2003 | US20030013307 Method of fabricating a self-aligned landing via |
| 01/16/2003 | US20030013306 Barrier to prevent copper diffusion; polishing using reducing agent |
| 01/16/2003 | US20030013305 Method of producing semiconductor device and semiconductor substrate |
| 01/16/2003 | US20030013303 Full image exposure of field with alignment marks |
| 01/16/2003 | US20030013302 Multilayered copper structure for improving adhesion property |