| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2003 | WO2003007398A1 Progressive aligned deposition |
| 01/23/2003 | WO2003007397A2 Solution influenced alignment |
| 01/23/2003 | WO2003007396A2 Lamellar polymer architecture |
| 01/23/2003 | WO2003007393A2 Semiconductor structures comprising a piezoelectric material and corresponding processes and systems |
| 01/23/2003 | WO2003007383A2 Algan/gan hemts having a gate contact on a gan based cap segment and methods of fabricating same |
| 01/23/2003 | WO2003007382A1 Method for producing semiconductor substrate and semiconductor substrate |
| 01/23/2003 | WO2003007381A2 Low voltage threshold dynamic biasing |
| 01/23/2003 | WO2003007380A1 Semiconductor apparatus with improved esd withstanding voltage |
| 01/23/2003 | WO2003007373A1 Lead frame and its manufacturing method |
| 01/23/2003 | WO2003007370A1 Wiring glass substrate and method of manufacturing the wiring glass substrate, conductive paste and semiconductor module used for wiring glass substrate, and method of forming wiring substrate and conductor |
| 01/23/2003 | WO2003007368A2 Method of forming nitride capped cu lines with reduced electromigration along the cu/nitride interface |
| 01/23/2003 | WO2003007367A1 Locally increasing sidewall density by ion implantation |
| 01/23/2003 | WO2003007366A1 Method of forming via metal layer and via metal layer- formed substrate |
| 01/23/2003 | WO2003007365A2 Semiconductor processing module with integrated feedback/feed forward metrology |
| 01/23/2003 | WO2003007364A2 Method for producing a packing for semiconductor chips |
| 01/23/2003 | WO2003007363A1 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrier |
| 01/23/2003 | WO2003007362A1 Use of diverse materials in air-cavity packaging of electronic devices |
| 01/23/2003 | WO2003007361A2 Method for producing a bipolar transistor comprising a polysilicon emitter |
| 01/23/2003 | WO2003007360A1 Method for chemical mechanical polishing (cmp) with altering the concentration of oxidizing agent in slurry |
| 01/23/2003 | WO2003007359A1 Method of improving gate activation by employing atomic oxygen oxidation |
| 01/23/2003 | WO2003007358A1 Plasma reactor for manufacturing electronic components |
| 01/23/2003 | WO2003007357A1 Dry etching method |
| 01/23/2003 | WO2003007356A1 Manufacturing of a low-noise mos device |
| 01/23/2003 | WO2003007355A2 Method for the production of contacts for integrated circuits and semiconductor component with said contacts |
| 01/23/2003 | WO2003007354A1 Double-sided semiconductor structure |
| 01/23/2003 | WO2003007353A1 Semiconductor structures comprising an oxygen-doped compound semiconductor layer |
| 01/23/2003 | WO2003007352A1 Apparatus for pellicle remove |
| 01/23/2003 | WO2003007351A1 Wafer processing apparatus and transfer device adjustment system |
| 01/23/2003 | WO2003007350A2 Wafer jar loader method, system and apparatus |
| 01/23/2003 | WO2003007349A2 High temperature substrate transfer robot |
| 01/23/2003 | WO2003007348A2 Apparatus and method for controlling galvanic corrosion effects on a single-wafer cleaning system |
| 01/23/2003 | WO2003007347A2 Smif load port interface including smart port door |
| 01/23/2003 | WO2003007346A2 Clean method and apparatus for vacuum holding of substrates |
| 01/23/2003 | WO2003007345A1 Article holders with sensors detecting a type of article held by the holder |
| 01/23/2003 | WO2003007344A2 Etch pattern definition using a cvd organic layer as an anti-reflection coating and hardmask |
| 01/23/2003 | WO2003007343A2 Device for performing surface treatment on semiconductor wafers |
| 01/23/2003 | WO2003007342A2 Alignment of semiconductor wafers and other articles |
| 01/23/2003 | WO2003007341A2 Tunable radiation source providing a planar irradiation pattern for processing semiconductor wafers |
| 01/23/2003 | WO2003007340A2 Wafer transport apparatus |
| 01/23/2003 | WO2003007338A2 Method for attaching an electronic component to a substrate |
| 01/23/2003 | WO2003007337A2 Low dielectric constant organic dielectrics based on cage-like structures |
| 01/23/2003 | WO2003007336A2 Wafer boat with arcuate wafer support arms |
| 01/23/2003 | WO2003007335A2 Single cast vertical wafer boat with a y shaped column rack |
| 01/23/2003 | WO2003007334A2 Semiconductor structures and devices for detecting chemical reactant |
| 01/23/2003 | WO2003007327A2 Shallow-angle interference process and apparatus for determining real-time etching rate |
| 01/23/2003 | WO2003007326A2 Method and apparatus for micro-jet enabled, low energy ion generation and transport in plasma processing |
| 01/23/2003 | WO2003007305A1 Semiconductor storage, mobile electronic device, and detachable storage |
| 01/23/2003 | WO2003007304A2 Magnetic memory unit and magnetic memory array |
| 01/23/2003 | WO2003007129A2 Trajectory planning and motion control strategies for a planar three-degree-of-freedom robotic arm |
| 01/23/2003 | WO2003007095A1 Method for determining a position of a robot |
| 01/23/2003 | WO2003007085A1 Sulfoxide pyrolid(in)one alkanolamine stripping and cleaning composition |
| 01/23/2003 | WO2003007081A1 Methods using topcoat for photoresist |
| 01/23/2003 | WO2003007080A1 Method for forming fine pattern |
| 01/23/2003 | WO2003007061A2 A method of forming a reflective electrode and a liquid crystal display device |
| 01/23/2003 | WO2003007007A1 Electronic parts handling device, and electronic parts temperature control method |
| 01/23/2003 | WO2003007006A1 Heater-equipped pusher, electronic parts handling device, and electronic parts temperature control method |
| 01/23/2003 | WO2003007003A1 Method of manufacturing a probe card |
| 01/23/2003 | WO2003006933A2 System and method for detecting occlusions in a semiconductor manufacturing device |
| 01/23/2003 | WO2003006719A1 METHOD FOR ACHIEVING LOW DEFECT DENSITY AIGaN SINGLE CRYSTAL BOULES |
| 01/23/2003 | WO2003006718A1 Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| 01/23/2003 | WO2003006707A1 Method for bst deposition by cvd |
| 01/23/2003 | WO2003006705A2 Wafer fabrication buffer station |
| 01/23/2003 | WO2003006703A1 A method for reactive sputtering deposition |
| 01/23/2003 | WO2003006702A1 Hafnium silicide target for gate oxide film formation and its production method |
| 01/23/2003 | WO2003006599A1 Microelectronic cleaning compositions containing ammonia-free fluoride salts |
| 01/23/2003 | WO2003006598A1 Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| 01/23/2003 | WO2003006597A1 Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| 01/23/2003 | WO2003006396A1 Bonding method and product |
| 01/23/2003 | WO2003006374A1 Production and use of tetrafluorosilane |
| 01/23/2003 | WO2003006344A1 Thin wafer carrier |
| 01/23/2003 | WO2003006343A1 Horizontal cassette |
| 01/23/2003 | WO2003006230A1 Method and apparatus for underfilling electronic components using vacuum assist |
| 01/23/2003 | WO2003006216A1 Substrate transport apparatus with multiple independent end effectors |
| 01/23/2003 | WO2003006206A1 Substrate polishing machine |
| 01/23/2003 | WO2003006205A2 Barrier removal at low polish pressure |
| 01/23/2003 | WO2003006183A2 Method and apparatus for cleaning semiconductor wafers and other flat media |
| 01/23/2003 | WO2002095805A3 Laser parrering of devices |
| 01/23/2003 | WO2002089200A3 Method of manufacturing interconnections in a semiconductor device |
| 01/23/2003 | WO2002063665A3 RELAXED InXGa1-xAs LAYERS INTEGRATED WITH Si |
| 01/23/2003 | WO2002058158A3 Field effect transistor with redued gate delay and method of fabricating the same |
| 01/23/2003 | WO2002056364A3 Conductor reservoir volume for integrated circuit interconnects |
| 01/23/2003 | WO2002049395A3 Rapid thermal processing lamp and method for manufacturing the same |
| 01/23/2003 | WO2002049035A3 Memory device and method for the operation of the same |
| 01/23/2003 | WO2002048796A3 Projection system for euv lithography |
| 01/23/2003 | WO2002045156A3 Cmos fabrication process utilizing special transistor orientation |
| 01/23/2003 | WO2002041365A3 Single crystalline oxide on a semiconductor substrate |
| 01/23/2003 | WO2002041362A3 Laser separated die with tapered sidewalls for improved light extraction |
| 01/23/2003 | WO2002035597A3 Multilayer devices having frequency agile materials |
| 01/23/2003 | WO2002029878A3 Chemical mechanical polishing of dielectric materials |
| 01/23/2003 | WO2002029862A3 Integrated semiconductor substrate bevel cleaning apparatus and method |
| 01/23/2003 | WO2002029861A3 System architecture of semiconductor manufacturing equipment |
| 01/23/2003 | WO2002019386A3 High density mram cell array |
| 01/23/2003 | WO2002018101A3 Chemical mechanical polishing (cmp) head, apparatus, and method and planarized semiconductor wafer produced thereby |
| 01/23/2003 | WO2002017367A3 Semiconductor device having passive elements and method of making same |
| 01/23/2003 | WO2002011202A3 Method and device for producing connection substrates for electronic components |
| 01/23/2003 | WO2002008835A3 High-resolution overlay alignment methods and systems for imprint lithography |
| 01/23/2003 | WO2002007211A3 Multi-layer registration control for photolithography processes |
| 01/23/2003 | WO2001097270A3 Substrate cleaning apparatus and method |
| 01/23/2003 | WO2001081976A3 Apparatus, system, and method for active compensation of aberrations in an optical system |
| 01/23/2003 | WO2001054203A3 Direct printing of thin-film conductors using metal-chelate inks |