Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/15/2003US6548342 Method of producing oxide dielectric element, and memory and semiconductor device using the element
04/15/2003US6548341 Process for producing a first electrode and a second electrode, electronic component and electronic memory element
04/15/2003US6548340 Method of fabricating a DRAM transistor with a dual gate oxide technique
04/15/2003US6548339 Methods of forming memory circuitry, and method of forming dynamic random access memory (DRAM) circuitry
04/15/2003US6548338 Integrated high-performance decoupling capacitor and heat sink
04/15/2003US6548337 Method of manufacturing a high gain bipolar junction transistor with counterdoped base in CMOS technology
04/15/2003US6548336 Planarization of a polysilicon layer surface by chemical mechanical polish to improve lithography and silicide formation
04/15/2003US6548335 Selective epitaxy to reduce gate/gate dielectric interface roughness
04/15/2003US6548334 Capping layer
04/15/2003US6548333 Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
04/15/2003US6548332 Thermal treatment process for forming thin film transistors without the use of plasma treatment to further improve the output property of the thin film transistor
04/15/2003US6548331 Method for fabricating thin film transistor including crystalline silicon active layer
04/15/2003US6548330 Semiconductor apparatus and method of fabricating semiconductor apparatus
04/15/2003US6548328 Circuit device and manufacturing method of circuit device
04/15/2003US6548327 Low cost electroless plating process for single chips and wafer parts and products obtained thereof
04/15/2003US6548326 Semiconductor device and process of producing same
04/15/2003US6548325 Wafer thickness compensation for interchip planarity
04/15/2003US6548323 Method of preparing light-sensitive integrated circuits for packaging
04/15/2003US6548321 Method of anodically bonding a multilayer device with a free mass
04/15/2003US6548319 Method for manufacturing semiconductor laser diode
04/15/2003US6548315 Manufacture method for semiconductor inspection apparatus
04/15/2003US6548314 Method for enabling access to micro-sections of integrated circuits on a wafer
04/15/2003US6548313 Amorphous carbon insulation and carbon nanotube wires
04/15/2003US6548312 Manufacturing method of semiconductor integrated circuit devices and mask manufacturing methods
04/15/2003US6548231 First passivation at 100-140 degrees c, at 150-250 watts using a 2:1 oxygen to water ration, second passivation at 200-250 degrees c
04/15/2003US6548230 Method for in-situ removal of photoresist and sidewall polymer
04/15/2003US6548229 Positive-working chemical-amplification photoresist composition and method for forming a resist pattern using the same
04/15/2003US6548228 Method of and apparatus for developing exposed photoresist to prevent impurity from being attached to wafer surface
04/15/2003US6548214 Method of lithography utilizing orthogonal experiment to improve profile
04/15/2003US6548213 Controlling transmission light
04/15/2003US6548189 Epoxidized cashew nutshell liquid, a catalyst, and bisphenol a diglycidyl ether
04/15/2003US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
04/15/2003US6548115 Modular coating apparatus adapted to couple to host system, such as a cluster or in-line type coating system, as well as to operate in stand-alone fashion; uses rotatable chuck
04/15/2003US6548113 Placing substrate in reactor with high-thermal capacity filament, alternately charging reactor with vapor-phase dehydroxylating agent and vacuum, heating filament to energize dehydroxylating agent, inducing reaction with porous film
04/15/2003US6548111 Transferring heat at first rate to or from first portion of substrate spaced apart from rotation axis by first distance and transferring heat at second rate different from first rate to or from second portion of substrate
04/15/2003US6548110 Process liquid dispense method and apparatus
04/15/2003US6548107 Methods of forming an insulating material proximate a substrate, and methods of forming an insulating material between components of an integrated circuit
04/15/2003US6548035 Silicon single crystal wafer for epitaxial wafer, epitaxial wafer, and methods for producing the same and evaluating the same
04/15/2003US6547979 Methods of enhancing selectivity of etching silicon dioxide relative to one or more organic substances; and plasma reaction chambers
04/15/2003US6547978 Method of heating a semiconductor substrate
04/15/2003US6547977 Method for etching low k dielectrics
04/15/2003US6547961 Grinding slurry recycling apparatus
04/15/2003US6547953 Sealing covering
04/15/2003US6547938 Anodizing apparatus, utilizing a perforated negative electrode
04/15/2003US6547937 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
04/15/2003US6547934 Reduction of metal oxide in a dual frequency etch chamber
04/15/2003US6547922 Vacuum-processing apparatus using a movable cooling plate during processing
04/15/2003US6547921 Method and apparatus for processing semiconductor substrates
04/15/2003US6547902 Die bonding method and apparatus
04/15/2003US6547875 Epitaxial wafer and a method for manufacturing the same
04/15/2003US6547863 Having stability and concentration fit for solution chemical vapor deposition by utilizing cyclohexane based compounds which disolve said metal compound
04/15/2003US6547843 For polishing metal layer formed of copper and a thin film formed of tantalum or tantalum nitride for large scale integration device
04/15/2003US6547660 Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method
04/15/2003US6547652 Linear CMP tool design using in-situ slurry distribution and concurrent pad conditioning
04/15/2003US6547650 Polishing apparatus
04/15/2003US6547647 Method of wafer reclaim
04/15/2003US6547644 Metathesis ring-opening polymerization; polishing glass sheet
04/15/2003US6547641 Carrier head with a substrate sensor
04/15/2003US6547639 Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
04/15/2003US6547638 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
04/15/2003US6547559 Compression springs; narrow gap; hermetic sealing
04/15/2003US6547510 Substrate transport apparatus with coaxial drive shafts and dual independent scara arms
04/15/2003US6547504 Wafer carrying system and carrying method thereof
04/15/2003US6547473 Fastening device for conveying cart
04/15/2003US6547458 Optical monitoring integrated circuits
04/15/2003US6547452 Alignment systems for subassemblies of overmolded optoelectronic modules
04/15/2003US6547409 Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
04/15/2003US6547249 Monolithic series/parallel led arrays formed on highly resistive substrates
04/15/2003US6547168 Coating head
04/15/2003US6547124 Method for forming a micro column grid array (CGA)
04/15/2003US6547121 Mechanical clamper for heated substrates at die attach
04/15/2003US6546985 Die bonder
04/15/2003US6546961 Integrated gas control device
04/15/2003US6546941 Wafer cleaning device, wafer cleaning method and chemical mechanical polishing machine
04/15/2003US6546939 Removal residues from copper or aluminum surfaces; polishing with aqueous acidity solution containing buffers
04/15/2003US6546938 Holding and rotating a chuck as pressure plasma jet rinses predetermined areas; another nozzle dries with nitrogen gas; integrated circuits; semiconductors
04/15/2003US6546623 Structure equipped with electrical contacts formed through the substrate of this structure and process for obtaining such a structure
04/15/2003US6546620 Flip chip integrated circuit and passive chip component package fabrication method
04/10/2003WO2003030611A1 Optimalization apparatus, mounting apparatus, and electronic part mounting system
04/10/2003WO2003030601A1 Electronic circuit comprising conductive bridges and method for making such bridges
04/10/2003WO2003030600A1 Printed wiring board and production method for printed wiring board
04/10/2003WO2003030294A1 Matching device and plasma processing apparatus
04/10/2003WO2003030278A2 Composition, method and electronic device
04/10/2003WO2003030273A1 Light emitting element and method for manufacture thereof
04/10/2003WO2003030268A1 Flash memory cell with entrenched floating gate and method for operating said flash memory cell
04/10/2003WO2003030267A2 Umosfet device and method of making the same
04/10/2003WO2003030266A1 Transistor with an electron and a vertical channel and the production methods thereof
04/10/2003WO2003030264A1 Non volatile memory cell structure using multilevel trapping dielectric
04/10/2003WO2003030263A1 Single step chemical mechanical polish process to improve the surface roughness in mram technology
04/10/2003WO2003030261A1 Semiconductor memory device and corresponding manufacturing method
04/10/2003WO2003030260A1 Semiconductor device and semiconductor device manufacturing method
04/10/2003WO2003030259A1 Semiconductor device and method of manufacturing the device
04/10/2003WO2003030258A1 Plural semiconductor devices in monolithic flip chip
04/10/2003WO2003030254A2 Process for assembling systems and structure thus obtained
04/10/2003WO2003030253A2 Salicided gate for virtual ground arrays
04/10/2003WO2003030252A2 Process for producing interconnects
04/10/2003WO2003030251A1 Silicon monocrystal wafer processing device, and method of manufacturing silicon monocrystal wafer and silicon epitaxial wafer
04/10/2003WO2003030249A2 Method of characterising an implantation step in a substrate of material
04/10/2003WO2003030248A2 Method of mounting an electronic device on a substrate by a laser beam
04/10/2003WO2003030246A2 Device for soldering contacts on semiconductor chips