Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/10/2003WO2003030245A2 Method for assembly of complementary-shaped receptacle site and device microstructures
04/10/2003WO2003030244A1 Method for fabricating a power semiconductor device having a floating island voltage sustaining layer
04/10/2003WO2003030243A1 Incorporation of nitrogen into high k dielectric film
04/10/2003WO2003030242A1 Method of forming dielectric films
04/10/2003WO2003030241A1 Plasma processing apparatus
04/10/2003WO2003030240A2 Etching method and apparatus
04/10/2003WO2003030239A1 Silicon substrate etching method and etching apparatus
04/10/2003WO2003030238A1 Processing method
04/10/2003WO2003030237A1 Etching method
04/10/2003WO2003030235A1 Plasma processor and plasma processing method
04/10/2003WO2003030234A1 Method for forming a cavity structure on soi substrate and cavity structure formed on soi substrate
04/10/2003WO2003030233A1 Method and device for simulation, method and device for polishing, method and device for preparing control parameter or control program, polishing system, recording medium, and method of manufacturing semiconductor device
04/10/2003WO2003030231A1 Method and device for thinning an integrated circuit board
04/10/2003WO2003030230A1 Manufacture of semiconductor device with spacing narrower than lithography limit
04/10/2003WO2003030228A2 Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
04/10/2003WO2003030227A2 Method of semiconductor nanoparticle synthesis
04/10/2003WO2003030226A2 End effector assembly
04/10/2003WO2003030225A2 Semiconductor chip with multiple rows of bond pads
04/10/2003WO2003030224A2 Barrier formation using novel sputter-deposition method
04/10/2003WO2003030223A2 Substrate processing apparatus and method
04/10/2003WO2003030222A2 Tool for handling wafers and epitaxial growth station
04/10/2003WO2003030220A2 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands
04/10/2003WO2003030219A2 High pressure processing chamber for multiple semiconductor substrates
04/10/2003WO2003030217A2 Metal-to-metal antifuse employing carbon-containing antifuse material
04/10/2003WO2003030214A2 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method
04/10/2003WO2003030207A1 Method and device for producing a plasma
04/10/2003WO2003030206A1 Methods and apparatus for defect localization
04/10/2003WO2003030081A2 Semiconductor wafer identification
04/10/2003WO2003030009A2 Programmable gate array having interconnecting logic to support embedded fixed logic circuitry
04/10/2003WO2003029901A1 Chemical-amplification-type positive radiation-sensitive resin composition
04/10/2003WO2003029900A1 Negative-acting aqueous photoresist composition
04/10/2003WO2003029799A1 Methods and apparatus for void characterization
04/10/2003WO2003029531A2 Electrolytic processing apparatus and method
04/10/2003WO2003029517A1 Process for controlling thin film uniformity and products produced thereby
04/10/2003WO2003029516A1 Apparatus for inverted cvd
04/10/2003WO2003029515A2 Formation of composite tungsten films
04/10/2003WO2003029514A2 Method of depositing cvd and ald films onto low-dielectric-constant dielectrics
04/10/2003WO2003029510A1 Aluminum alloy thin film and wiring circuit having the thin film and target material for forming the tin film
04/10/2003WO2003029431A2 Nanoscaling ordering of hybrid materials using genetically engineered mesoscale virus
04/10/2003WO2003029354A1 Organic semiconductor material and organic semiconductor element employing the same
04/10/2003WO2003029133A1 Fluid dispensing apparatus
04/10/2003WO2003029113A2 System for cushioning wafer in wafer carrier
04/10/2003WO2003028954A2 Vacuum holding device and method for handling fragile objects, and manufacturing method thereof
04/10/2003WO2003028951A1 Apparatus and process for producing polished semiconductor wafers
04/10/2003WO2003028950A1 Multizone carrier with process monitoring system for chemical-mechanical planarization tool
04/10/2003WO2003028949A2 Method of machining substrates
04/10/2003WO2003028553A1 Fingerprint sensor
04/10/2003WO2003019671A3 Vertical dual gate field effect transistor
04/10/2003WO2003019624A3 Dielectric barrier discharge process for depositing silicon nitride film on substrates
04/10/2003WO2003014979A9 Method for selection of parameters for implant anneal of patterned semiconductor substrates and specification of a laser system
04/10/2003WO2003009344A3 Iii-v arsenide nitride semiconductor substrate
04/10/2003WO2003009335A3 Ultra fine pitch capillary
04/10/2003WO2003009318A8 Support with getter-material for microelectronic, microoptoelectronic or micromechanical device
04/10/2003WO2003006933A3 System and method for detecting occlusions in a semiconductor manufacturing device
04/10/2003WO2003005396A3 Method and apparatus for scanned instrument calibration
04/10/2003WO2003003439A9 Method of making thin films dielectrics using a process for room temperature wet chemical growth of sio based oxides on a substrate
04/10/2003WO2002101818A3 Method for isolating semiconductor devices
04/10/2003WO2002097870A3 Diffuser and rapid cycle chamber
04/10/2003WO2002089195A3 Method of manufacturing a trench-gate semiconductor device
04/10/2003WO2002084729A3 Method for producing a chalcogenide-semiconductor layer of the abc2 type with optical process monitoring
04/10/2003WO2002084727A3 Method of fabricating an oxide layer on a silicon carbide layer utilizing an anneal in a hydrogen environment
04/10/2003WO2002078900A3 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface for chemical mechanical polishing
04/10/2003WO2002073689A3 Integrated barrier layer structure for copper contact level metallization
04/10/2003WO2002071460A3 Method for producing structures on the nanometric scale
04/10/2003WO2002071447A3 Ruthenium silicide wet etch
04/10/2003WO2002061800A3 A method and system for electrostatic bonding
04/10/2003WO2002059973A3 Serial mram device
04/10/2003WO2002058135A3 Interconnect structures and a method of electroless introduction of interconnect structures
04/10/2003WO2002045159A3 Method for fabricating electronics
04/10/2003WO2002041388A3 Method of inspecting an anisotropic etch in a microstructure
04/10/2003WO2002029865A3 Method of manufacturing a semiconductor component and semiconductor component thereof
04/10/2003WO2002027784A3 Making of fuses and antifuses with a vertical dram process
04/10/2003WO2002005352A3 Partially transparent photovoltaic modules
04/10/2003US20030070154 Computer readable medium with definition of interface recorded thereon, verification method for feasibility to connect given circuit and method of generating signal pattern
04/10/2003US20030070151 Delay analysis method and design assist apparatus of semiconductor circuit
04/10/2003US20030070149 Semiconductor integrated circuit having a plurality of circuit regions where different power supply voltages are used and method of manufacturing the same
04/10/2003US20030070128 Scan path circuit for test of logic circuit
04/10/2003US20030070118 Semiconductor integrated circuit with built-in test function
04/10/2003US20030069715 Systems and methods for forming data storage devices
04/10/2003US20030069706 Latent defect classification system
04/10/2003US20030069705 Range recognizer employing a single range internally partitioned by monotonically increasing boundary values
04/10/2003US20030069664 Method and device for sorting wafers
04/10/2003US20030069660 Process error prevention method in semiconductor fabricating equipment
04/10/2003US20030069659 Product development management system, product development management method, product reliability decision system and product reliability decision method
04/10/2003US20030069349 Liquid epoxy resin composition and semiconductor device
04/10/2003US20030069151 Method for obtaining clean silicon surfaces for semiconductor manufacturing
04/10/2003US20030069150 One or more cleaning stations, each comprising; one or more sponges having a surface charge and configured for cleaning said workpieces, a fluid delivery system, a workpiece cleaning fluid, and a sponge cleaning fluid.
04/10/2003US20030068966 Vibration damping in a carrier head
04/10/2003US20030068962 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/10/2003US20030068961 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
04/10/2003US20030068960 Polymeric polishing pad having continuously regenerated work surface
04/10/2003US20030068959 Slurry distributor for chemical mechanical polishing apparatus and method of using the same
04/10/2003US20030068903 Heat treatment device of the light irradiation type and heat treatment process of the irradiation type
04/10/2003US20030068902 Method for depositing silicon oxide incorporating an outgassing step
04/10/2003US20030068901 Method for forming dual oxide layers at bottom of trench
04/10/2003US20030068899 Process for etching a metal layer system
04/10/2003US20030068898 Dry etching method for manufacturing processes of semiconductor devices
04/10/2003US20030068897 Methods of making magnetoresistive memory devices
04/10/2003US20030068896 Etch aided by electrically shorting upper and lower sidewall portions during the formation of a semiconductor device
04/10/2003US20030068895 Method for cleaning the contact area of a metal line
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