Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/08/2003US6544898 Method for improved die release of a semiconductor device from a wafer
04/08/2003US6544897 Method for forming a vertical edge submicron through-hole and a thin film sample with this kind of through-hole
04/08/2003US6544896 Method for enhancing etching of TiSix
04/08/2003US6544895 Methods for use of pulsed voltage in a plasma reactor
04/08/2003US6544894 Method of producing chromium mask
04/08/2003US6544892 In preference to silicon nitride; includes abrasives and amino acids; semiconductors
04/08/2003US6544891 Method to eliminate post-CMP copper flake defect
04/08/2003US6544890 Process for fabricating semiconductor device having silicide layer with low resistance and uniform profile and sputtering system used therein
04/08/2003US6544889 Method for tungsten chemical vapor deposition on a semiconductor substrate
04/08/2003US6544888 Advanced contact integration scheme for deep-sub-150 nm devices
04/08/2003US6544887 Polycide etch process
04/08/2003US6544886 Process for isolating an exposed conducting surface
04/08/2003US6544885 Polished hard mask process for conductor layer patterning
04/08/2003US6544884 Semiconductor device and method of fabricating same
04/08/2003US6544883 Method of manufacturing semiconductor device
04/08/2003US6544882 Method to improve reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and aluminum-copper-TiN layers in integrated circuits
04/08/2003US6544881 Stacked local interconnect structure and method of fabricating same
04/08/2003US6544880 Method of improving copper interconnects of semiconductor devices for bonding
04/08/2003US6544878 Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
04/08/2003US6544877 Method of producing thin film of zinc oxide, process for manufacturing photovoltaic element using its method, and photovoltaic element
04/08/2003US6544876 Titanium boride gate electrode and interconnect and methods regarding same
04/08/2003US6544875 Chemical vapor deposition of silicate high dielectric constant materials
04/08/2003US6544874 Method for forming junction on insulator (JOI) structure
04/08/2003US6544873 Methods of fabricating integrated circuit field effect transistors including multilayer gate electrodes having narrow and wide conductive layers
04/08/2003US6544872 Dopant implantation processing for improved source/drain interface with metal silicides
04/08/2003US6544871 Method of suppressing void formation in a metal line
04/08/2003US6544868 Method of manufacturing light emitting diode with low-receptivity p-type impurity layers formed by microwave treatment
04/08/2003US6544867 Molecular beam epitaxy (MBE) growth of semi-insulating C-doped GaN
04/08/2003US6544866 Semiconductor device fabricated on multiple substrate
04/08/2003US6544865 Metal film interrupting process
04/08/2003US6544864 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
04/08/2003US6544863 Method of fabricating semiconductor wafers having multiple height subsurface layers
04/08/2003US6544862 Particle distribution method and resulting structure for a layer transfer process
04/08/2003US6544861 Method for forming isolation trench
04/08/2003US6544860 Shallow trench isolation method for forming rounded bottom trench corners
04/08/2003US6544858 Method for treating silicon-containing polymer layers with plasma or electromagnetic radiation
04/08/2003US6544857 Dielectric capacitor manufacturing method and semiconductor storage device manufacturing method
04/08/2003US6544856 Method for increasing the trench capacitance
04/08/2003US6544855 Process flow for sacrificial collar with polysilicon void
04/08/2003US6544854 Silicon germanium CMOS channel
04/08/2003US6544853 Reduction of negative bias temperature instability using fluorine implantation
04/08/2003US6544852 Method of fabricating semiconductor device
04/08/2003US6544851 Method of manufacturing a semiconductor device having a pocket implant in channel region
04/08/2003US6544850 Dynamic random access memory
04/08/2003US6544849 Method of fabricating semiconductor device for preventing polysilicon line being damaged during removal of photoresist
04/08/2003US6544848 Method to form an asymmetrical non-volatile memory device using small in-situ doped polysilicon spacers
04/08/2003US6544847 Single poly non-volatile memory structure and its fabricating method
04/08/2003US6544845 Methods of fabricating nonvolatile memory devices including bird's beak oxide
04/08/2003US6544844 Method for forming a flash memory cell having contoured floating gate surface
04/08/2003US6544843 Process for manufacturing semiconductor device
04/08/2003US6544842 Method of forming hemisphere grained silicon on a template on a semiconductor work object
04/08/2003US6544841 Capacitor integration
04/08/2003US6544840 Semiconductor memory device and manufacturing method and mask data preparing method for the same
04/08/2003US6544839 Semiconductor integrated circuit device and a method of manufacturing the same
04/08/2003US6544838 Method of deep trench formation with improved profile control and surface area
04/08/2003US6544837 SOI stacked DRAM logic
04/08/2003US6544836 Memory cell, memory device and method of fabricating the same
04/08/2003US6544835 Method of forming a ruthenium film by CVD
04/08/2003US6544834 Method of forming a semiconductor device including a capacitor with tantalum oxide (Ta2O5)
04/08/2003US6544833 Semiconductor memory device and manufacturing method thereof
04/08/2003US6544832 Method of fabricating a stack capacitor DRAM
04/08/2003US6544831 Semiconductor device and method for manufacturing the same
04/08/2003US6544830 Method of manufacturing a semiconductor device with multiple emitter contact plugs
04/08/2003US6544829 Polysilicon gate salicidation
04/08/2003US6544828 Adding a poly-strip on isolation's edge to improve endurance of high voltage NMOS on EEPROM
04/08/2003US6544827 Metal-gate field effect transistor and method for manufacturing the same
04/08/2003US6544826 Method for producing semiconductor device
04/08/2003US6544825 Method of fabricating a MIS transistor
04/08/2003US6544824 Method to form a vertical transistor by first forming a gate/spacer stack, then using selective epitaxy to form source, drain and channel
04/08/2003US6544823 Method of manufacturing semiconductor device
04/08/2003US6544822 Method for fabricating MOSFET device
04/08/2003US6544821 Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed
04/08/2003US6544820 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
04/08/2003US6544819 Method and apparatus for separating semiconductor elements, and mounting method of semiconductor elements
04/08/2003US6544818 Method of manufacturing semiconductor device
04/08/2003US6544817 Method for sawing a moulded leadframe package
04/08/2003US6544816 Method of encapsulating thin semiconductor chip-scale packages
04/08/2003US6544814 Method of manufacturing a packaged semiconductor device, and a semiconductor device manufactured thereby
04/08/2003US6544813 Method of making a semiconductor chip assembly with a conductive trace subtractively formed before and after chip attachment
04/08/2003US6544811 Micromachined device having electrically isolated components and a method for making the same
04/08/2003US6544806 Fast computation of truth tables
04/08/2003US6544804 Semiconductor wafer having identification indication and method of manufacturing the same
04/08/2003US6544803 Method for determining the concentration of contamination on a component
04/08/2003US6544802 Wafer inspection system and method for selectively inspecting conductive pattern defects
04/08/2003US6544801 Method of fabricating thermally stable MTJ cell and apparatus
04/08/2003US6544715 Positive photoresist composition for far ultraviolet ray exposure
04/08/2003US6544712 Negative working resist composition
04/08/2003US6544700 Charged particle beam exposure method
04/08/2003US6544694 Projecting radiation; configurating substrate
04/08/2003US6544674 Stable electrical contact for silicon carbide devices
04/08/2003US6544656 Production method for silicon wafer and silicon wafer
04/08/2003US6544655 Semiconductors reduced; silicon wafer having reduced out-of-plane curvature
04/08/2003US6544638 Electronic chip package
04/08/2003US6544590 Liquid coating method, apparatus and film-forming method for producing the same employing excess coating removing unit having absorbent fabric on porous structure
04/08/2003US6544585 Immersing substrate in liquid held in a plating chamber; heating liquid in plating chamber so as to heat substrate and remove residual bubbles from the micro-cavities; plating substrate in plating chamber so as to produce a metal deposits
04/08/2003US6544490 Silicon wafer and production method thereof and evaluation method for silicon wafer
04/08/2003US6544488 Gas, which differs from a cleaning gas and is not required to be decomposed for evacuation, is introduced upstream
04/08/2003US6544483 Controlling gas flow for semiconductors
04/08/2003US6544482 Reducing effluents; cleaning gases
04/08/2003US6544466 Surface modification method for molds used during semiconductor device fabrication
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