Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2003
04/08/2003US6544429 Using hexafluorobutylene etchant and inert gas diluents
04/08/2003US6544428 Method for producing a multi-layer circuit board using anisotropic electro-conductive adhesive layer
04/08/2003US6544399 Electrodeposition chemistry for filling apertures with reflective metal
04/08/2003US6544379 Method of holding substrate and substrate holding system
04/08/2003US6544377 Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
04/08/2003US6544371 Method of using a transfer tape
04/08/2003US6544345 Etching, removal deposits
04/08/2003US6544343 Washers used for scrubbing the surfaces of substrates used in the production of recording media
04/08/2003US6544340 Heater with detachable ceramic top plate
04/08/2003US6544339 Rectilinear wedge geometry for optimal process control in chemical vapor deposition and rapid thermal processing
04/08/2003US6544338 Inverted hot plate cure module
04/08/2003US6544307 Polishing composition and manufacturing and polishing methods
04/08/2003US6544035 Semiconductor manufacturing apparatus
04/08/2003US6544034 Heat treatment equipment for object to be treated and its exhausting method
04/08/2003US6544033 Wafer carrier
04/08/2003US6543988 Apparatus for clamping and transporting a semiconductor wafer
04/08/2003US6543982 For semiconductors; adjustment spacing of wafers
04/08/2003US6543981 Apparatus and method for creating an ultra-clean mini-environment through localized air flow augmentation
04/08/2003US6543980 Teaching tool for a robot arm for wafer reaction ovens
04/08/2003US6543676 Pin attachment by a surface mounting method for fabricating organic pin grid array packages
04/08/2003US6543674 Multilayer interconnection and method
04/08/2003US6543669 Bonding apparatus and bonding tool for component
04/08/2003US6543668 Mounting method and mounting apparatus for electronic part
04/08/2003US6543617 Packaged radiation sensitive coated workpiece process for making and method of storing same
04/08/2003US6543522 Arrayed fin cooler
04/08/2003US6543513 Wafer table for die bonding apparatus
04/08/2003US6543512 Carrier, method and system for handling semiconductor components
04/08/2003US6543510 Apparatus and methods for coverlay removal and adhesive application
04/08/2003US6543462 Apparatus for cleaning surfaces substantially free of contaminants
04/08/2003US6543461 Buffer system for a wafer handling system field of the invention
04/08/2003US6543459 Vapor deposition; cleaning; measuring capacitance; calibration
04/08/2003US6543306 Conveying device
04/08/2003US6543267 Apparatus and methods for substantial planarization of solder bumps
04/08/2003US6543156 Method and apparatus for high-pressure wafer processing and drying
04/08/2003US6543131 Connecting; removal support; semiconductors
04/08/2003US6543127 Coplanarity inspection at the singulation process
04/08/2003US6543107 Cyclic multistage process by sol, gel process
04/08/2003US6543084 Wafer scrubbing brush core
04/08/2003US6543080 Apparatus and method for cleaning semiconductor substrate
04/08/2003US6543079 Wafer cleaning apparatus
04/08/2003CA2264317C Susceptor for semiconductor manufacturing equipment and process for producing the same
04/03/2003WO2003028423A1 Method for manufacturing a heat sink
04/03/2003WO2003028118A1 Iii group nitride quantum dot and production method therefor
04/03/2003WO2003028113A1 Semiconductor device and its manufacturing method
04/03/2003WO2003028112A1 Semiconductor integrated circuit device and its manufacturing method
04/03/2003WO2003028111A1 Nonvolatile semiconductor memory device and its manufacturing method
04/03/2003WO2003028110A1 Semiconductor device
04/03/2003WO2003028109A1 Silicon carbide lateral metal oxide semiconductor field-effect transistor having a self-aligned dirft region and method for forming the same
04/03/2003WO2003028108A1 Semiconductor device and method for fabricating the same
04/03/2003WO2003028107A1 Semiconductor memory element arrangement
04/03/2003WO2003028104A2 Semiconductor memory with memory cells comprising a vertical selection transistor and method for production thereof
04/03/2003WO2003028101A2 Method of producing a contact system on the rear face of a component with stacked substrates
04/03/2003WO2003028100A2 Encapsulation of pin solder for maintaining accuracy in pin position
04/03/2003WO2003028098A2 Programmable chip-to-substrate interconnect structure and device and method of forming same
04/03/2003WO2003028097A1 Production method for semiconductor device
04/03/2003WO2003028094A2 Method of self-assembly of electronic or optical components using an adhesive
04/03/2003WO2003028093A2 Method for the generation of a soi substrate, vertical transistor and memory cell with vertical transistor
04/03/2003WO2003028092A2 Dual-damascene interconnects without an etch stop layer by alternating ilds
04/03/2003WO2003028091A2 Copper interconnect barrier layer structure and formation method
04/03/2003WO2003028090A2 Integration of barrier layer and seed layer
04/03/2003WO2003028087A2 Manufacturing process of integrated circuits in flip-chip technology
04/03/2003WO2003028086A1 Method for encapsulating a chip and/or other article
04/03/2003WO2003028085A2 Method for producing a ceramic substrate
04/03/2003WO2003028084A1 Method for forming a contact window in a semiconductor device
04/03/2003WO2003028083A1 Method of processing quartz member for plasma processing device, quartz member for plasma processing device, and plasma processing device having quartz member for plasma processing device mounted thereon
04/03/2003WO2003028082A1 Etching method
04/03/2003WO2003028081A2 Method for etching structures in an etching body by means of a plasma
04/03/2003WO2003028080A1 Processing device, processing method, and method of manufacturing semiconductor device
04/03/2003WO2003028079A1 Polishing head and semiconductor wafer end face polishing machine
04/03/2003WO2003028078A1 Plasma processing device
04/03/2003WO2003028077A1 Method for thinning a silicon wafer
04/03/2003WO2003028076A1 Method of manufacturing semiconductor device having composite buffer layer
04/03/2003WO2003028075A1 Method of improving a surface of a substrate for wafer bonding
04/03/2003WO2003028072A1 Method for manufacturing semiconductor device
04/03/2003WO2003028071A2 Wafer cassette transport cart with self correcting fault alignment block and method
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003WO2003027767A2 Means and method for structuring a substrate with a mask
04/03/2003WO2003027747A1 Catadioptric reduction lens
04/03/2003WO2003027690A1 Test structures for estimating dishing and erosion effects in copper damascene technology
04/03/2003WO2003027651A1 Defect detection with enhanced dynamic range
04/03/2003WO2003027647A1 Method and apparatus for real-time dynamic chemical analysis
04/03/2003WO2003027643A1 Armor coated mems devices
04/03/2003WO2003027609A1 In-situ film thickness measurement using spectral interference at grazing incidence
04/03/2003WO2003027351A1 Method and apparatus for sputter deposition of epilayers with high deposition rate
04/03/2003WO2003027201A1 Rare earth salt/oxidizer-based cmp method
04/03/2003WO2003027178A2 Polyimide copolymer and methods for preparing the same
04/03/2003WO2003027043A1 Brazeable matallizations for diamond components
04/03/2003WO2003027003A2 Methods of nanotube films and articles
04/03/2003WO2003026870A1 A method of potting a component
04/03/2003WO2003026856A1 Production method of laminated ceramic electronic component and electronic apparatus
04/03/2003WO2003026838A1 Decoupled planar positioning system
04/03/2003WO2003026833A1 Ball bumping machine and techniques
04/03/2003WO2003026774A1 System and method for determining and controlling contamination
04/03/2003WO2003026590A2 Biological control of nanoparticles
04/03/2003WO2003017362A8 Integrated circuit with dram memory cell
04/03/2003WO2003017357A8 Method for obtaining a self-supported semiconductor thin film for electronic circuits
04/03/2003WO2003009404A3 Transistor and method for making a transistor on a sige/soi substrate
04/03/2003WO2003001576A3 Assisted rinsing in a single wafer cleaning process
04/03/2003WO2002103755A3 Semiconductor die including conductive columns
04/03/2003WO2002101332A3 Method and apparatus for predicting sporting success conditions
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