Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2003
06/19/2003US20030113977 Method of isolating semiconductor laser diode
06/19/2003US20030113976 Wafer-bonding using solder and method of making the same
06/19/2003US20030113975 Methods for use in forming a capacitor and structures resulting from same
06/19/2003US20030113974 Stacked metal-insulator-metal capacitor structures in between interconnection layers
06/19/2003US20030113973 Method for fabricating local interconnects
06/19/2003US20030113972 Semiconductor device manufacturing method
06/19/2003US20030113971 Method of manufacturing semiconductor device
06/19/2003US20030113970 Implanted asymmetric doped polysilicon gate FinFET
06/19/2003US20030113969 Method of forming flash memory
06/19/2003US20030113968 Methods to form electronic devices and methods to form a material over a semiconductive substrate
06/19/2003US20030113967 Metal-insulator-metal capacitor formed by damascene processes between metal interconnect layers and method of forming same
06/19/2003US20030113966 Method of manufacturing a semiconductor device
06/19/2003US20030113965 Method of manufacturing a semiconductor device
06/19/2003US20030113964 Method for forming a storage node
06/19/2003US20030113963 Method for fabricating an integrated semiconductor circuit
06/19/2003US20030113962 Non-volatile memory device with improved data retention and method therefor
06/19/2003US20030113961 Semiconductor device and manufacturing method thereof
06/19/2003US20030113960 Method of fabricating a MOS transistor with low gate depletion
06/19/2003US20030113959 Body-tied silicon on insulator semiconductor device and method therefor
06/19/2003US20030113958 Method of manufacturing semiconductor device having thin film SOI structure
06/19/2003US20030113957 Thin film transistor with multiple gates using metal induced lateral crystallization and method of fabricating the same
06/19/2003US20030113955 Method for fabricating semiconductor package and semiconductor package
06/19/2003US20030113952 Underfill materials dispensed in a flip chip package by way of a through hole
06/19/2003US20030113951 Method for manufacturing multi-layer package substrates
06/19/2003US20030113948 Low threading dislocation density relaxed mismatched epilayers without high temperature growth
06/19/2003US20030113947 Electrical/optical integration scheme using direct copper bonding
06/19/2003US20030113946 Characteristic evaluation apparatus for insulated gate type transistors
06/19/2003US20030113945 Disturbance-free, recipe-controlled plasma processing system and method
06/19/2003US20030113944 Semiconductor device and a manufacturing method thereof
06/19/2003US20030113943 System and method for determining and controlling contamination
06/19/2003US20030113941 Method of manufacturing semiconductor device for evaluation capable of evaluating crystal defect using in-line test by avoiding using preferential etching process
06/19/2003US20030113724 Packaged microarray apparatus and a method of bonding a microarray into a package
06/19/2003US20030113714 Binding peptides to polycrystalline semiconductors; detection of bacteriophages; high density magnetic storage; medical imaging; forensics; antitumor agents; anticarcinogenic agents
06/19/2003US20030113673 Photoresist stripper compositions
06/19/2003US20030113672 Used to flow photoresist under the high pressure in the sealed oven during a resist flow process
06/19/2003US20030113663 Negative photosensitive resin composition and display device using the same
06/19/2003US20030113662 Photo-curable resin composition, patterning process, and substrate protecting film
06/19/2003US20030113661 Chemical amplification type positive resist composition
06/19/2003US20030113578 Heat-dissipating substrate, method for making the same, and semiconductor device including the same
06/19/2003US20030113509 Abrasive article for the deposition and polishing of a conductive material
06/19/2003US20030113480 Method for forming high dielectric layers using atomic layer deposition
06/19/2003US20030113451 Extending the residence time of reactant gases in the reaction region; preferentially depositing species deposit faster on one surface than on the other
06/19/2003US20030113440 Coating method and apparatus
06/19/2003US20030113197 Apparatus for transferring semiconductor device in handler
06/19/2003US20030113190 Compact apparatus and method for storing and loading semiconductor wafer carriers
06/19/2003US20030113189 System and method of producing wafer
06/19/2003US20030113188 Mechanism for providing a continuous supply of wafers and cassettes to semiconductor fabrication tool
06/19/2003US20030113187 Dual robot processing system
06/19/2003US20030113106 Apparatus for heating and cooling semiconductor device in handler for testing semiconductor device
06/19/2003US20030112695 Dynamic ram-and semiconductor device
06/19/2003US20030112682 Dynamic RAM and semiconductor device
06/19/2003US20030112673 Semiconductor integrated circuit having logic circuit comprising transistors with lower threshold voltage values and improved pattern layout
06/19/2003US20030112659 Semiconductor memory device
06/19/2003US20030112656 Nonvolatile storage device and operating method thereof
06/19/2003US20030112655 Magnetic memory device and manufacturing method thereof
06/19/2003US20030112654 Segmented write line architecture
06/19/2003US20030112653 Semiconductor memory
06/19/2003US20030112652 Semiconductor integrated circuit
06/19/2003US20030112649 Simplified bottom electrode-barrier structure for making a ferroelectric capacitor stacked on a contact plug
06/19/2003US20030112610 Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another
06/19/2003US20030112578 Tuneable ferroelectric decoupling capacitor
06/19/2003US20030112565 Polarity reversal tolerant electrical circuit for ESD protection
06/19/2003US20030112501 Optical member for photolithography and method for evaluating the same
06/19/2003US20030112421 Apparatus and method of image enhancement through spatial filtering
06/19/2003US20030112402 Display panel
06/19/2003US20030112383 Liquid crystal display, thin film transistor array panel for liquid crystal display and method of manufacturing the same
06/19/2003US20030112382 Liquid crystal display device
06/19/2003US20030112323 Laser drawing apparatus and laser drawing method
06/19/2003US20030112322 Laser beam irradiating apparatus, laser beam irradiating method, and method of manufacturing a semiconductor device
06/19/2003US20030112298 Lattice array-structured piezoelectric actuator and method for producing the same
06/19/2003US20030112167 Digital-to-analog converter with linear amplification rate
06/19/2003US20030112057 Semiconductor device
06/19/2003US20030112056 Boosted voltage generating circuit and semiconductor memory device having the same
06/19/2003US20030112052 Integrated circuit with closely coupled high voltage output and offline transistor pair
06/19/2003US20030112031 High speed interface for a programmable interconnect circuit
06/19/2003US20030112002 Probe system
06/19/2003US20030112001 Probe card covering system and method
06/19/2003US20030111970 Aligning apparatus in semiconductor device test handler
06/19/2003US20030111963 Inductively coupled plasma system
06/19/2003US20030111912 Following stage planar motor
06/19/2003US20030111742 Semiconductor device
06/19/2003US20030111741 Semiconductor device capable of narrowing down failed point
06/19/2003US20030111739 Semiconductor device and package thereof
06/19/2003US20030111737 Chip smaller in the ratio is mounted by the wire bonding, while the chip larger in the ratio is mounted by flip-chip method
06/19/2003US20030111735 Semiconductor devices and methods for fabricating the same
06/19/2003US20030111734 Semiconductor device, its manufacturing method, and electronic apparatus
06/19/2003US20030111733 Chip and wafer integration process using vertical connections
06/19/2003US20030111732 Superconductor device and method of manufacturing the same
06/19/2003US20030111731 Semiconductor device and method for producing the same
06/19/2003US20030111730 First insulative diffusion barrier layer is formed by using a gas mixture at least containing an alkoxy silane compound and an oxidative gas by chemical vapor deposition and covering atleast a portion of metal wiring (copper as main ingredient)
06/19/2003US20030111729 Method of making semiconductor device using an interconnect
06/19/2003US20030111728 Mounting material, semiconductor device and method of manufacturing semiconductor device
06/19/2003US20030111727 Semiconductor integrated circuit device and printed wired board for mounting the same
06/19/2003US20030111725 Semiconductor device and method for manufacturing the same
06/19/2003US20030111722 Semiconductor device and method of fabricating the same
06/19/2003US20030111721 Semiconductor device, stacked type semiconductor device, and manufacturing method of semiconductor device
06/19/2003US20030111717 Semiconductor device and method of manufacturing the same
06/19/2003US20030111713 Manufacturing method of tape carrier package and the system thereof
06/19/2003US20030111712 Low-dielectric constant structure with a multilayer stack of thin films with pores
06/19/2003US20030111711 Chip structure and process for forming the same
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