Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2003
07/03/2003US20030122122 Metal oxide semiconductor thin film and method of producing the same
07/03/2003US20030122121 Semiconductor device equipped with semiconductor circuits composed of semiconductor elements and process for production thereof
07/03/2003US20030122119 Organic semiconductor and method
07/03/2003US20030122093 Optical measurement apparatus
07/03/2003US20030122091 Maskless photon-electron spot-grid array printer
07/03/2003US20030122090 Ion beam processing method and apparatus therefor
07/03/2003US20030122087 Exposure apparatus, control method thereof, and device manufacturing method
07/03/2003US20030121955 Method for mounting leadframes
07/03/2003US20030121906 Resistive heaters and uses thereof
07/03/2003US20030121902 Heat treatment unit and heat treatment method
07/03/2003US20030121901 Radiant heating apparatus and discharge current detecting circuit therefor
07/03/2003US20030121898 For semiconductor wafers; uniform temperature distribution
07/03/2003US20030121891 Ruthenium and ruthenium dioxide removal method and material
07/03/2003US20030121890 Wafer protection method
07/03/2003US20030121889 Thickness measuring apparatus, thickness measuring method, and wet etching apparatus and wet etching method utilizing them
07/03/2003US20030121888 Etching method
07/03/2003US20030121886 Method of adjusting the thickness of an electrode in a plasma processing system
07/03/2003US20030121885 Ionizing radiation detector
07/03/2003US20030121884 Method for etching dielectric films
07/03/2003US20030121882 Method of manufacturing Er-doped silicon nano-dot array and laser ablation apparatus used therein
07/03/2003US20030121870 Semiconductor cassette reducer
07/03/2003US20030121799 Process control; monitoring concentration of hydrogen peroxide, hydroxylamine
07/03/2003US20030121797 Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform
07/03/2003US20030121791 Methods of and apparatus for making high aspect ratio microelectromechanical structures
07/03/2003US20030121774 Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
07/03/2003US20030121773 Anodizing apparatus, anodizing system, substrate processing apparatus and method, and substrate manufacturing method
07/03/2003US20030121772 Method of forming metal line
07/03/2003US20030121757 Railing for a boat conveyor system
07/03/2003US20030121616 Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
07/03/2003US20030121608 Gas delivery apparatus for atomic layer deposition
07/03/2003US20030121599 Protective tape applying and separating method
07/03/2003US20030121584 Process for manufacturing semiconductor device
07/03/2003US20030121538 Apparatus for selective removal of material from wafer alignment marks
07/03/2003US20030121537 Pressurized liquid diffuser
07/03/2003US20030121536 Washing device and its work conveying method
07/03/2003US20030121535 Transferring module; robot; removal residues by plasma ashing; for semiconductors
07/03/2003US20030121534 Method and apparatus for supercritical processing of multiple workpieces
07/03/2003US20030121533 Transportating semiconductor wafers; reducing barriers in tank
07/03/2003US20030121528 Brushless multipass silicon wafer cleaning process for post chemical mechanical polishing using immersion
07/03/2003US20030121527 Using radio frequency; supplying gaseous aqueous hydrochloric acid solution
07/03/2003US20030121511 Method for dicing semiconductor wafer into chips
07/03/2003US20030121475 Wafer support and peripheral parts thereof
07/03/2003US20030121468 Methods of hyperdoping semiconductor materials and hyperdoped semiconductor materials and devices
07/03/2003US20030121417 Process facility having at least two physical units each having a reduced density of contaminating particles with respect to the surroundings
07/03/2003US20030121173 Wafer drying apparatus
07/03/2003US20030121170 Single wafer dryer and drying methods
07/03/2003US20030121145 Microelectronic device fabricating methods, and methods of forming a pair of field effect transistor gate lines of different base widths from a common deposited conductive layer
07/03/2003US20030121132 One-cylinder stack capacitor and method for fabricating the same
07/03/2003DE19937995C2 Verfahren zur Strukturierung einer organischen Antireflexionsschicht Method for structuring an organic anti-reflective layer
07/03/2003DE10205280C1 Aqueous dispersion used for chemical-mechanical polishing of oxide surface, preferably silica, contains pyrogenic silica powder doped with alumina from aerosol with specified particle size
07/03/2003DE10204471C1 Aqueous dispersion of cerium oxide-coated doped silica powder, used for chemical-mechanical polishing of semiconductor substrate or coating or in shallow trench insulation, is obtained by mixing doped silica core with cerium salt solution
07/03/2003DE10143722C2 Verfahren und Vorrichtung zur Sortierung von Wafern Method and apparatus for the sorting of wafers
07/03/2003CA2438214A1 Complementary mis device
07/02/2003EP1324399A2 Light-emitting device and method for manufacturing the same
07/02/2003EP1324398A2 Metal oxide semiconductor thin film and method of producing the same
07/02/2003EP1324393A1 Manufacturing process of a semiconductor non-volatile memory cell and corresponding memory-cell
07/02/2003EP1324392A1 Capacitor for semiconductor integrated devices
07/02/2003EP1324386A1 Semiconductor module and method of manufacturing a semiconductor module
07/02/2003EP1324385A2 Process for transfering semiconductor thin layers and process for forming a donor wafer for such a transfer process
07/02/2003EP1324384A2 Via filling method
07/02/2003EP1324383A2 Semiconductor device and method for manufacturing the same
07/02/2003EP1324382A1 Process for manufacturing an SOI wafer by annealing and oxidation of buried channels
07/02/2003EP1324381A1 Workpiece holding mechanism
07/02/2003EP1324380A2 Non-volatile memory device and method of fabrication
07/02/2003EP1324379A1 Multilayer structure and material with high permitivity
07/02/2003EP1324378A1 Mehrlagige Struktur, verwendet für Materialine mit hoher Permitivität
07/02/2003EP1324377A2 Method of forming shallow abrupt junctions in semiconductor devices
07/02/2003EP1324376A1 Electronic component comprising an integrated circuit and a planar micro capacitor
07/02/2003EP1324375A2 Via/line inductor on semiconductor material
07/02/2003EP1324374A2 Etching System for an insulation-film
07/02/2003EP1324371A1 Plasma processing apparatus
07/02/2003EP1324343A2 Non-volatile semiconductor memory device adapted to store a multi-valued data in a single memory cell
07/02/2003EP1324261A1 Non-contact data carrier and method of fabricating the same
07/02/2003EP1324234A1 Polygon reprensentation in an integrated circuit layout
07/02/2003EP1324232A2 Lsi design verification apparatus, method and program
07/02/2003EP1324208A1 Circuit device for transmitting bus signals
07/02/2003EP1324136A1 Lithographic projection apparatus and device manufacturing method
07/02/2003EP1324133A1 Photoresist compositions for short wavelength imaging
07/02/2003EP1324109A1 Display device and manufacturing method therefor
07/02/2003EP1324093A1 Device for storing and transporting of optical elements
07/02/2003EP1324058A2 Range recognizer employing a single range internally partitioned by monotonically increasing boundary values
07/02/2003EP1324022A1 Apparatus for inspecting wafer surface, method for inspecting wafer surface, apparatus for judging defective wafer, method for judging defective wafer, and apparatus for processing information on wafer surface
07/02/2003EP1323851A2 Method for fabricating a III nitride film and products and elements obtained therefrom
07/02/2003EP1323850A1 Electroplating method of printed circuit with pulsed current density
07/02/2003EP1323845A1 Multilayer structure
07/02/2003EP1323798A1 Composition for chemical mechanical polishing of metal and metal-dielectrics structures
07/02/2003EP1323793A1 Metallic nanoparticle cluster ink and method for forming metal pattern using the same
07/02/2003EP1323721A2 Organic metal precursor for use in forming metal-containing patterned films
07/02/2003EP1323196A1 Solid state embossing of polymer devices
07/02/2003EP1323195A1 Electrode and/or conductor track for organic components and production method therefor
07/02/2003EP1323191A2 Trench dmos transistor with embedded trench schottky rectifier
07/02/2003EP1323190A2 Self-assembled electrical networks
07/02/2003EP1323189A2 Electronic device manufacture
07/02/2003EP1323188A1 Method to detect surface metal contamination
07/02/2003EP1323187A2 Wafer cleaning module and method for cleaning the surface of a substrate
07/02/2003EP1323186A2 Plating system with remote secondary anode for semiconductor manufacturing
07/02/2003EP1323185A2 Method of fabricating an oxide layer on a silicon carbide layer utilizing n2o
07/02/2003EP1323184A2 Charge-coupled image sensor comprising gate electrodes interconnected by shunt electrodes
07/02/2003EP1323183A1 Method for producing a microelectronic circuit and a microelectronic circuit
07/02/2003EP1323182A2 Apparatus and method for reducing contamination on thermally processed semiconductor substrates