Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/26/2003US6610564 Method of fabricating semiconductor device
08/26/2003US6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same
08/26/2003US6610559 Integrated void-free process for assembling a solder bumped chip
08/26/2003US6610558 Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
08/26/2003US6610557 CMOS image sensor and a fabrication method for the same
08/26/2003US6610554 Method of fabricating organic electroluminescent display
08/26/2003US6610551 Vertical geometry InGaN LED
08/26/2003US6610550 Method and apparatus for correlating error model with defect data
08/26/2003US6610549 Amorphous barrier layer in a ferroelectric memory cell
08/26/2003US6610548 Crystal growth method of oxide, cerium oxide, promethium oxide, multi-layered structure of oxides, manufacturing method of field effect transistor, manufacturing method of ferroelectric non-volatile memory and ferroelectric non-volatile memory
08/26/2003US6610465 One filter sheet of a self-supported fibrous matrix having immobilized therein a particulate filter aid and a particulate ion exchange resin; other filter sheet of a self supporting matrix of fibers, such as cellulose fibers
08/26/2003US6610463 Method of manufacturing structure having pores
08/26/2003US6610461 Reticle having accessory pattern divided into sub-patterns
08/26/2003US6610460 Exposure method
08/26/2003US6610406 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
08/26/2003US6610374 Method of annealing large area glass substrates
08/26/2003US6610373 Magnetic film-forming device and method
08/26/2003US6610366 Forming an oxide layer on a silicon carbide layer; and annealing the oxide layer in presence of nitrous oxide, heating
08/26/2003US6610361 Predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so.
08/26/2003US6610213 Process for the wet chemical treatment of a semiconductor wafer
08/26/2003US6610212 The two primary etchant gases are CHF3 and CH2F2, delivered at flow rates on about 10 and 40 sccm for CH2F2.
08/26/2003US6610190 Anode, a shaping plate, a liquid electrolyte, and electrical contact members
08/26/2003US6610184 Magnet array in conjunction with rotating magnetron for plasma sputtering
08/26/2003US6610182 Cup-type plating apparatus and method for plating wafers
08/26/2003US6610180 Substrate processing device and method
08/26/2003US6610171 Method of holding substrate and substrate holding system
08/26/2003US6610170 Method of holding substrate and substrate holding system
08/26/2003US6610169 Semiconductor processing system and method
08/26/2003US6610168 Resist film removal apparatus and resist film removal method
08/26/2003US6610167 Protective layer of tape having an adhesive lower surface formed by a polymerizable material which loses its adhesive qualities upon polymerization
08/26/2003US6610151 Seed layers for interconnects and methods and apparatus for their fabrication
08/26/2003US6610150 Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
08/26/2003US6610145 Deposition of nanoporous silica films using a closed cup coater
08/26/2003US6610144 Method to reduce the dislocation density in group III-nitride films
08/26/2003US6610143 Method of manufacturing a semiconductor component
08/26/2003US6610142 Process for fabricating semiconductor and process for fabricating semiconductor device
08/26/2003US6610141 For use in electrically excited devices such as light emitting devices (LEDs), laser diodes (LDs), field effect transistors (FETs), photodetectors, and transducers
08/26/2003US6610114 Oxidizing polishing slurries for low dielectric constant materials
08/26/2003US6609965 Cutting blade
08/26/2003US6609962 Dressing apparatus and polishing apparatus
08/26/2003US6609957 Methods and apparatuses for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies on planarizing pads
08/26/2003US6609954 Method of planarization
08/26/2003US6609950 Method for polishing a substrate
08/26/2003US6609923 Semiconductor device-socket
08/26/2003US6609909 Heat treatment apparatus and method
08/26/2003US6609877 Vacuum chamber load lock structure and article transport mechanism
08/26/2003US6609876 Loading and unloading station for semiconductor processing installations
08/26/2003US6609874 Handler for the transporting of flat substrates for application in the semi-conductor industry
08/26/2003US6609870 Granular semiconductor material transport system and process
08/26/2003US6609869 Transfer chamber with integral loadlock and staging station
08/26/2003US6609652 Ball bumping substrates, particuarly wafers
08/26/2003US6609632 Removable lid and floating pivot
08/26/2003US6609553 Sample processing apparatus and method
08/26/2003US6609446 Separating apparatus, separating method, and method of manufacturing semiconductor substrate
08/21/2003WO2003069780A1 Multi power supply circuit protection apparatus and method
08/21/2003WO2003069753A1 A protection device
08/21/2003WO2003069743A1 Sub-mount and semiconductor device
08/21/2003WO2003069722A1 Cofired multi-layer ceramic structure incorporating a microwave component
08/21/2003WO2003069681A1 High performance active and passive structures based on silicon material grown epitaxially or bonded to silicon carbide substrate
08/21/2003WO2003069678A1 Semiconductor device and its manufacturing method
08/21/2003WO2003069676A1 Semiconductor device and its manufacturing method
08/21/2003WO2003069675A1 Semiconductor device and its manufacturing method
08/21/2003WO2003069674A1 Magnetic memory device and its production method
08/21/2003WO2003069673A1 Malfunction suprressing circuit for semiconductor device
08/21/2003WO2003069672A1 Nanoporous dielectric films with graded density and process for making such films
08/21/2003WO2003069670A1 Semiconductor device and method for manufacturing same
08/21/2003WO2003069669A1 Semiconductor fabrication process, lateral pnp transistor, and integrated circuit
08/21/2003WO2003069668A2 A method of calibrating and using a semiconductor processing system
08/21/2003WO2003069667A1 Polarization analyzing method
08/21/2003WO2003069665A1 Method of manufacturing an encapsulated integrated circuit package
08/21/2003WO2003069664A1 Method of forming a vertical double gate semiconductor device and structure thereof
08/21/2003WO2003069663A1 Polysilicon bipolar transistor and method for producing the same
08/21/2003WO2003069662A1 Method for manufacturing semiconductor device, and semiconductor device
08/21/2003WO2003069661A1 Semiconductor manufacturing method and semiconductor manufacturing apparatus
08/21/2003WO2003069660A1 Plate-like object carrying mechanism and dicing device with carrying mechanism
08/21/2003WO2003069659A1 Cleaning gas and etching gas
08/21/2003WO2003069658A2 Strained si based layer made by uhv-cvd, and devices therein
08/21/2003WO2003069657A1 Method for production of a layer of silicon carbide or a nitride of a group iii element on a suitable substrate
08/21/2003WO2003069656A1 Irreversible reduction of the value of a polycrystalline silicon resistor
08/21/2003WO2003069655A2 Electronic micro component including a capacitive structure
08/21/2003WO2003069654A1 Heated substrate support
08/21/2003WO2003069653A1 Process and system for positioning a die on a substrate
08/21/2003WO2003069636A1 Etching solution for forming an embedded resistor
08/21/2003WO2003069626A1 Extraction of a binary code from physical parameters of an integrated circuit
08/21/2003WO2003069410A1 Radiation-sensitive resin composition
08/21/2003WO2003069286A2 Method and apparatus to measure fiber optic pickup errors in interferometry systems
08/21/2003WO2003069274A1 Interferometer with dynamic beam steering element
08/21/2003WO2003069264A2 Characterization and compensation of non-cyclic errors in interferometry systems
08/21/2003WO2003069263A2 System for detecting anomalies and/or features of a surface
08/21/2003WO2003069246A1 High-speed dryer
08/21/2003WO2003069228A1 Method for treating exhaust gas
08/21/2003WO2003069020A1 System for processing substrate and method for processing substrate
08/21/2003WO2003069016A2 In-line deposition processes for circuit fabrication
08/21/2003WO2003069015A2 Aperture masks for circuit fabrication
08/21/2003WO2003069014A1 Aperture masks for circuit fabrication
08/21/2003WO2003069004A1 High chromium and carbide rich tool steel made by powder metallurgi and tool made of the steel
08/21/2003WO2003068883A1 Anionic abrasive particles treated with positively-charged polyelectrolytes for cmp
08/21/2003WO2003068882A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
08/21/2003WO2003068881A1 Process for chemical-mechanical polishing of metal substrates
08/21/2003WO2003068699A1 Group iii nitride semiconductor crystal, production method thereof and group iii nitride semiconductor epitaxial wafer
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