Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2003
08/28/2003US20030162462 Apparatus and method for manufacturing liquid crystal display devices, method for using the apparatus, and device produced by the method
08/28/2003US20030162412 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
08/28/2003US20030162411 Polymer material having a low glass transition temperature for use in chemically amplified photoresists for semiconductor production
08/28/2003US20030162410 Method of depositing low K films
08/28/2003US20030162409 Method for utilizing rough insulator to enhance metal-insulator-semiconductor reliability
08/28/2003US20030162408 Insulation film on semiconductor substrate and method for forming same
08/28/2003US20030162407 Anisotropic etching of organic-containing insulating layers
08/28/2003US20030162406 Stabilized resist layer that provides for the prevention of interlayer intermixing with the deposition of subsequent resist layers; t-gate structure; optical lithography
08/28/2003US20030162405 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/28/2003US20030162404 Method for fabricating conductive line on a wafer
08/28/2003US20030162403 Method to eliminate antenna damage in semiconductor processing
08/28/2003US20030162402 Method of through-etching substrate
08/28/2003US20030162401 Semiconductor device manufacturing method
08/28/2003US20030162400 Deep trench isolation of embedded DRAM for improved latch-up immunity
08/28/2003US20030162399 Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures
08/28/2003US20030162398 Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
08/28/2003US20030162397 Method for fabricating a semiconductor device
08/28/2003US20030162396 Semiconductor device using damascene technique and manufacturing method therefor
08/28/2003US20030162395 Method to eliminate striations and surface roughness caused by dry etch
08/28/2003US20030162394 Method of fabricating semiconductor device
08/28/2003US20030162392 Method of annealing metal layers
08/28/2003US20030162391 Barrier layer and method of depositing a barrier layer
08/28/2003US20030162390 Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants
08/28/2003US20030162389 Method of forming different silicide portions on different silicon- containing regions in a semiconductor device
08/28/2003US20030162388 Anti-spacer structure for improved gate activation
08/28/2003US20030162386 Semiconductor device and its manufacturing method
08/28/2003US20030162385 Method of forming metal lines having improved uniformity on a substrate
08/28/2003US20030162384 Semiconductor devices and methods of manufacturing such semiconductor devices
08/28/2003US20030162383 Semiconductor device and method for fabricating the same
08/28/2003US20030162381 Lead-free bump fabrication process
08/28/2003US20030162380 Solder ball fabricating process
08/28/2003US20030162379 Solder ball fabrication process
08/28/2003US20030162378 Bonding method and bonding apparatus
08/28/2003US20030162377 Method for making a semiconductor device having a high-k gate dielectric
08/28/2003US20030162375 Systems and methods for integration of heterogeneous circuit devices
08/28/2003US20030162374 Method for forming a retrograde implant
08/28/2003US20030162373 Semiconductor thin film, semiconductor device employing the same, methods for manufacturing the same and device for manufacturing a semiconductor thin film
08/28/2003US20030162372 Method and apparatus for forming an oxide layer
08/28/2003US20030162371 Boron phosphide-based semiconductor layer and vapor phase growth method thereof
08/28/2003US20030162370 Mixed crystal layer growing method and device, and semiconductor device
08/28/2003US20030162369 Semiconductor device and method for fabricating the same
08/28/2003US20030162368 Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive
08/28/2003US20030162367 Cutting thin layer(s) from semiconductor material(s)
08/28/2003US20030162366 Integrated circuit isolation system
08/28/2003US20030162365 Epitaxial thin film forming method
08/28/2003US20030162364 Method of forming shallow trench isolation in a substrate
08/28/2003US20030162363 HDP CVD process for void-free gap fill of a high aspect ratio trench
08/28/2003US20030162362 Wafer bump fabrication process
08/28/2003US20030162361 Selective hemispherical silicon grain (hsg) conversion inhibitor for use during the manufacture of a semiconductor device
08/28/2003US20030162360 Reduced mask count buried layer process
08/28/2003US20030162359 Metal oxide semiconductor field effect transistor for reducing resistance between source and drain and method for fabricating the same
08/28/2003US20030162358 Method of forming a fully-depleted soi (silicon-on-insulator) mosfet having a thinned channel region
08/28/2003US20030162357 Semiconductor device and process thereof
08/28/2003US20030162356 Semiconductor integrated circuit and method of manufacturing the same
08/28/2003US20030162355 Power sic devices having raised guard rings
08/28/2003US20030162354 Method of fabricating semiconductor memory device and semiconductor memory device driver
08/28/2003US20030162353 Method for fabricating semiconductor device, and semiconductor device, having storage node contact plugs
08/28/2003US20030162352 Method for fabricating a memory cell
08/28/2003US20030162351 Oxidation resistane structure for metal insulator metal capacitor
08/28/2003US20030162350 Method for producing a bipolar transistor
08/28/2003US20030162349 Semiconductor device having increased metal silicide portions and method of forming the semiconductor
08/28/2003US20030162348 Complementary metal oxide semiconductor transistor technology using selective epitaxy of a strained silicon germanium layer
08/28/2003US20030162347 Self aligned method of forming a semiconductor memory array of floating gate memory cells with control gate protruding portions
08/28/2003US20030162346 Silicon oxide co-deposition/etching process
08/28/2003US20030162342 Method for fabricating metal gates in deep sub-micron devices
08/28/2003US20030162341 Method and system for controlling an electrical property of a field effect transistor
08/28/2003US20030162340 Group III nitride compound semiconductor and method for manufacturing the same
08/28/2003US20030162339 High electron mobility transistor and method of manufacturing the same
08/28/2003US20030162338 TFT for LCD device and fabrication method thereof
08/28/2003US20030162337 Transistor and process for fabricating the same
08/28/2003US20030162336 SOI mosfet junction degradation using multiple buried amorphous layers
08/28/2003US20030162335 Semiconductor device and method for fabricating the same
08/28/2003US20030162334 Method of manufacturing a semiconductor device
08/28/2003US20030162333 Method of fabricating polysilicon thin film transistor
08/28/2003US20030162332 Method and apparatus for forming a semiconductor thin film
08/28/2003US20030162331 Method for preventing burnt fuse pad from further electrical connection
08/28/2003US20030162329 Method for manufacturing a lithographic reticle for transferring an integrated circuit design to a semiconductor wafer and structure thereof
08/28/2003US20030162328 Semiconductor device and method for manufacturing the semiconductor device
08/28/2003US20030162326 Semiconductor device and manufactuiring method thereof
08/28/2003US20030162324 Semiconductor wafer with spacer and its manufacturing method, semiconductor device and its manufacturing method, and circuit substrate and electronic device
08/28/2003US20030162323 Method for conducting heat in a flip-chip assembly
08/28/2003US20030162322 Semiconductor wafer having a thin die and tethers and methods of making the same
08/28/2003US20030162321 Bmuping process
08/28/2003US20030162316 Selective electroless attachment of contacts to electrochemically-active molecules
08/28/2003US20030162313 Method for sawing wafer
08/28/2003US20030162312 Vehicle, display device and manufacturing method for a semiconductor device
08/28/2003US20030162214 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
08/28/2003US20030162135 Photolithographic exposing with two different wavelengths, the first wavelength is shorter than the second wavelength, achieve smaller resolution; polymerizing arylalkoxysilane compound to polysiloxanes
08/28/2003US20030162120 Compositions for anti-reflective light absorbing layer and method for forming patterns in semiconductor device using the same
08/28/2003US20030162105 Method of manufacturing a photomask and method of manufacturing a semiconductor device using the photomask
08/28/2003US20030162104 Reflective-type mask blank for exposure, method of producing the same, and reflective-type mask for exposure
08/28/2003US20030162103 The serifs or pattern combine to produce an optical proximity correction that reduces corner rounding and increases edge straightness in the resist pattern
08/28/2003US20030162102 Critical dimension control using full phase and trim masks
08/28/2003US20030162101 A mask for use in a lithographic projection apparatus contains three brackets arranged on the circumference of the mask provide with grooves directed to a common imaginary point intend to cooperate with three pins of a gripper
08/28/2003US20030162034 Organofluorosilicate glass films containing both organic species and inorganic fluorines, exclusive of significant amounts of fluorocarbon species; insulating layers for integrated circuits and associated electronic devices
08/28/2003US20030162005 Reflective-type mask blank for exposure, method of producing the same, and reflective-type mask for exposure
08/28/2003US20030162004 Patterning of solid state features by direct write nanolithographic printing
08/28/2003US20030162002 Low dielectric constant materials with improved thermo-mechanical strength and processability
08/28/2003US20030161959 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase
08/28/2003US20030161954 Selecting precursor of deposit material and solvent, wherein precursor dissociates under conditions at which solvent is supercritical fluid, dissolving precursor, exposing substrate to solution under conditions at which precursor dissociates