Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/23/2003US20030196989 Selective & damage free Cu cleaning process for pre-dep, post etch/CMP
10/23/2003US20030196986 Puddle etching method of thin film by using spin-processor
10/23/2003US20030196930 Carrier tape for containing good therein, and container using the carrier tape
10/23/2003US20030196892 Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces
10/23/2003US20030196870 Edge grip aligner with buffering capabilities
10/23/2003US20030196763 Liquid material evaporation apparatus for semiconductor manufacturing
10/23/2003US20030196760 Plasma treatment system
10/23/2003US20030196759 Highly heat-resistant plasma etching electrode and dry etching device including the same
10/23/2003US20030196756 Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber
10/23/2003US20030196755 Confinement ring support assembly
10/23/2003US20030196754 Plasma processing methods and apparatus
10/23/2003US20030196752 Epoxy tacking for optoelectronic device placement
10/23/2003US20030196686 Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber and positioning such a wafer in this single wafer chamber
10/23/2003US20030196685 Cleaning composition and method
10/23/2003US20030196683 Substrate processing method and substrate processing apparatus
10/23/2003US20030196682 Semiconductor substrate batch demounting apparatus
10/23/2003US20030196681 Stripping away polymers created in etching with a wet stripping; stripping away residual polymers with a dry stripping; rinsing wafer
10/23/2003US20030196680 Process modules for transport polymerization of low epsilon thin films
10/23/2003US20030196679 For cleaning of semiconductor wafers, masks
10/23/2003US20030196678 Introducing ozone into a process chamber; activating a water spray; deactivating the water spray for a second predetermined amount of time, thereby controlling a thickness of the water layer; re-activating and re-deactivating water spray
10/23/2003US20030196604 Padded clamp ring with edge exclusion for deposition of thick AlCu/AlSiCu/Cu metal alloy layers
10/23/2003US20030196599 Apparatus for clamping a planar substrate
10/23/2003US20030196593 Thin-film crystal-structure-processed mechanical devices, and methods and systems for making
10/23/2003US20030196592 Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making
10/23/2003US20030196591 Formation of crystal-structure-processed mechanical, and combined mechanical and electrical, devices on low-temperature substrates
10/23/2003US20030196590 Crystal-structure-processed mechanical devices and methods and systems for making
10/23/2003US20030196589 Laser annealing mask and method for smoothing an annealed surface
10/23/2003US20030196588 Silicon boat with protective film, method of manufacture thereof, and silicon wafer heat-treated using silicon boat
10/23/2003US20030196586 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
10/23/2003US20030196477 Acoustic wave sensor apparatus, method and system using wide bandgap materials
10/23/2003US20030196460 Set of washing machine and dryer and rear cover assembly thereof
10/23/2003US20030196386 For use in micro isolating step or a planarizing step of an inter layer dielectric in production of semiconductor devices
10/23/2003US20030196343 Measurement module
10/23/2003DE10245946C1 Production of a light source module comprises arranging light emitting diodes in a recess of a casting frame, casting the recesses and removing the casting frame
10/23/2003DE10159974C1 Halbleiterchip-Montageanlage mit einem Saugnippel zur Abnahme eines Halbleiterchips Semiconductor chip assembly plant with a teat for acceptance of a semiconductor chip
10/23/2003CA2505014A1 Hermetic encapsulation of organic electro-optical elements
10/23/2003CA2485022A1 Method for connecting substrates and composite element
10/23/2003CA2481358A1 Method for making a molecularly smooth surface
10/23/2003CA2480854A1 Method for producing a product having a structured surface
10/23/2003CA2480797A1 Method for producing a copy protection for an electronic circuit and corresponding component
10/23/2003CA2480737A1 Method for coating metal surfaces and substrate having a coated metal surface
10/23/2003CA2480691A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/23/2003CA2479873A1 Electropolishing and electroplating methods
10/23/2003CA2479823A1 Method for the production of structured layers on substrates
10/23/2003CA2479794A1 Electropolishing and/or electroplating apparatus and methods
10/23/2003CA2478624A1 Gas driven planetary rotation apparatus and methods for forming silicon carbide layers
10/22/2003EP1355363A2 Semiconductor device and method for fabricating the same
10/22/2003EP1355362A1 Semiconductor device
10/22/2003EP1355358A2 Thin film semiconductor memory and manufacture method therefor
10/22/2003EP1355356A2 Memory device and method of production and method of use of same and semiconductor device and method of production of same
10/22/2003EP1355355A2 Protection circuit section for semiconductor circuit system
10/22/2003EP1355350A2 Chip scale marker and marking method
10/22/2003EP1355348A2 Method of manufacturing amorphous metal oxide film and methods of manufacturing capacitance element having said film and semiconductor device
10/22/2003EP1355347A2 Workpiece holder for semiconductor manufacturing apparatus
10/22/2003EP1355346A2 Apparatus for heat-treatment of semiconductor films under low temperature
10/22/2003EP1355342A2 Plasma treatment system
10/22/2003EP1355244A1 Method for designing an LSI system
10/22/2003EP1355195A1 Particle filter for radiation source
10/22/2003EP1355194A2 Projection exposure apparatus and device manufacturing method
10/22/2003EP1355187A1 Process for connection of a printed circuit board to a liquid crystal display
10/22/2003EP1354999A1 Set of washing machine and dryer and rear cover assembly thereof
10/22/2003EP1354987A1 Silicon carbide single crystal, and method and apparatus for producing the same
10/22/2003EP1354980A1 Method for forming a porous SiOCH layer.
10/22/2003EP1354925A1 Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part
10/22/2003EP1354503A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module
10/22/2003EP1354405A2 Depopulated programmable logic array
10/22/2003EP1354363A2 Metamorphic long wavelength high-speed photodiode
10/22/2003EP1354358A2 Design of lithography alignment and overlay measurement marks on damascene surface
10/22/2003EP1354355A1 Planarizers for spin etch planarization of electronic components and methods of use thereof
10/22/2003EP1354354A2 Microelectronic package having an integrated heat sink and build-up layers
10/22/2003EP1354351A2 Direct build-up layer on an encapsulated die package
10/22/2003EP1354350A2 Plastic encapsulated semiconductor devices with improved corrosion resistance
10/22/2003EP1354348A2 Self-aligned conductive line for cross-point magnetic memory integrated circuits
10/22/2003EP1354347A2 Viscous protective overlayers for planarization of integrated circuits
10/22/2003EP1354346A1 Method for producing a thin film comprising introduction of gaseous species
10/22/2003EP1354345A2 Semiconductor tiling structure and method of formation
10/22/2003EP1354344A2 Method and apparatus for monitoring a semiconductor wafer during a spin drying operation
10/22/2003EP1354343A2 Use of endpoint system to match individual processing stations within a tool
10/22/2003EP1354342A2 Method for producing a semiconductor component comprising a t-shaped contact electrode
10/22/2003EP1354341A1 Method for single-scan, continuous motion sequential lateral solidification
10/22/2003EP1354339A2 Method of producing soi materials
10/22/2003EP1354337A2 Substrate processing in an immersion, scrub and dry system
10/22/2003EP1354336A2 Plasma generation apparatus and method
10/22/2003EP1354325A2 Collector with an unused area for lighting systems having a wavelength inferior or equal of 193 nm
10/22/2003EP1354322A1 Non orthogonal mram device
10/22/2003EP1354321A2 Mram arrangement
10/22/2003EP1354245A2 Multilayer elements containing photoresist compositions and their use in microlithography
10/22/2003EP1354227A2 Electro-optic structure and process for fabricating same
10/22/2003EP1354072A1 Carbonitride coated component of semiconductor processing equipment and method of manufacturing thereof
10/22/2003EP1354019A2 Azeotrope-like composition of 1,2-dichloro-3,3,3-trifluoropropene and hydrogen fluoride
10/22/2003EP1354017A2 Ready-to-use stable chemical-mechanical polishing slurries
10/22/2003EP1354012A2 A cmp polishing pad including a solid catalyst
10/22/2003EP1353792A2 Catalytic reactive pad for metal cmp
10/22/2003EP1353693A2 Pharmaceutical combination containing a 4-quinazolineamine and another anti-neoplastic agent for the treatment of cancer
10/22/2003EP1212170B1 Method and system for chemical mechanical polishing with a cylindrical polishing pad
10/22/2003EP1210395B1 Compositions for insulator and metal cmp and methods relating thereto
10/22/2003EP1201108B1 A circuit singulation system and method
10/22/2003EP1173632B1 Reaction chamber for an epitaxial reactor
10/22/2003EP1133380B1 A carrier head with edge control for chemical mechanical polishing
10/22/2003EP1050076B1 Method for producing diodes
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