Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2003
10/21/2003US6635185 Method of etching and cleaning using fluorinated carbonyl compounds
10/21/2003US6635184 Method for pattern-etching alumina layers and products
10/21/2003US6635157 Electro-chemical deposition system
10/21/2003US6635144 Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipment
10/21/2003US6635138 Method of immobilizing circuitry fingers
10/21/2003US6635117 Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
10/21/2003US6635116 Residual oxygen reduction system
10/21/2003US6635115 Tandem process chamber
10/21/2003US6635114 High temperature filter for CVD apparatus
10/21/2003US6635113 Coating apparatus and coating method
10/21/2003US6635110 Cyclic thermal anneal for dislocation reduction
10/21/2003US6635099 Forming uniform copper formulation comprising gel forming polysaccharide binder, copper particles; molding; sintering to form heat sink
10/21/2003US6634936 Chemical mechanical planarization or polishing pad with sections having varied groove patterns
10/21/2003US6634934 Method for cleaning polishing tool, polishing method polishing apparatus
10/21/2003US6634924 Polishing apparatus
10/21/2003US6634882 Susceptor pocket profile to improve process performance
10/21/2003US6634851 Workpiece handling robot
10/21/2003US6634847 Method and an apparatus for picking up a module IC in a customer tray of a module IC handler
10/21/2003US6634845 Transfer module and cluster system for semiconductor manufacturing process
10/21/2003US6634806 Substrate processing method and substrate processing apparatus
10/21/2003US6634805 Applying a developer to a photoresist material wafer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a apertures for dispensing developer. The developer plate has a bottom with
10/21/2003US6634686 End effector assembly
10/21/2003US6634650 Rotary vacuum-chuck with water-assisted labyrinth seal
10/21/2003US6634538 Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
10/21/2003US6634371 Apparatus for removing contaminants from a workpiece using a chemically reactive additive
10/21/2003US6634370 Liquid treatment system and liquid treatment method
10/21/2003US6634368 Application of ozonated DI water to scrubbers for resist strip and particle removal processes
10/21/2003US6634314 Atomic layer deposition method and semiconductor device fabricating apparatus having rotatable gas injectors
10/21/2003US6634245 Drivingly rotatable mechanism of specimen loading table and specimen loading mechanism
10/21/2003US6634177 Apparatus for the real-time monitoring and control of a wafer temperature
10/21/2003US6634116 Vacuum processing apparatus
10/16/2003WO2003086038A1 Multi-layer integrated circuit package
10/16/2003WO2003086037A1 Method of manufacturing an electronic device
10/16/2003WO2003086032A1 Ecr plasma source and ecr plasma device
10/16/2003WO2003085750A1 Magnetoresistance effect element and magnetic memory device
10/16/2003WO2003085746A1 Method for fabricating tandem thin film photoelectric converter
10/16/2003WO2003085744A1 High speed soi transistors
10/16/2003WO2003085743A1 Structure and method for an emitter ballast resistor in an hbt
10/16/2003WO2003085742A1 Method for forming a modified semiconductor having a plurality of band gaps
10/16/2003WO2003085741A1 Non-volatile flip-flop
10/16/2003WO2003085739A1 Circuit module and method for manufacturing the same
10/16/2003WO2003085737A2 Method and apparatus for stacking multiple die in a flip chip semiconductor package
10/16/2003WO2003085736A1 Electronic device and method of manufacturing same
10/16/2003WO2003085735A1 Beol process for cu metallizations free from al-wirebond pads
10/16/2003WO2003085734A1 Interconnection structure and methods
10/16/2003WO2003085731A1 Semiconductor device and method of manufacturing same
10/16/2003WO2003085730A1 Method of manufacturing an electronic device, and electronic device
10/16/2003WO2003085729A1 Method of manufacturing an electronic device
10/16/2003WO2003085728A1 Carrier, method of manufacturing a carrier and an electronic device
10/16/2003WO2003085727A2 Semiconductor chip comprising a protective layer and a corresponding production method
10/16/2003WO2003085726A1 Semiconductor device and its manufacturing method
10/16/2003WO2003085724A1 Tri-layer masking architecture for patterning dual damascene interconnects
10/16/2003WO2003085723A1 Alignment method and mounting method using the alignment method
10/16/2003WO2003085722A2 Field effect transistor having a lateral depletion structure
10/16/2003WO2003085721A2 Variable temperature processes for tunable electrostatic chuck
10/16/2003WO2003085720A2 Diffusion and activation control of implanted dopants with athermales annealing
10/16/2003WO2003085719A2 Process for making air gap containing semiconducting devices and resulting semiconducting device
10/16/2003WO2003085718A1 Plasma processing system
10/16/2003WO2003085717A1 Plasma etching method
10/16/2003WO2003085716A1 Plasma etching method and plasma etching device
10/16/2003WO2003085715A1 Method for suppressing charging of component in vacuum processing chamber of plasma processing system and plasma processing system
10/16/2003WO2003085714A1 Method for manufacturing semiconductor chip
10/16/2003WO2003085713A1 Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
10/16/2003WO2003085712A1 Vertical heat treating equipment
10/16/2003WO2003085711A1 VAPOR PHASE GROWTH METHOD FOR Al-CONTAINING III-V GROUP COMPOUND SEMICONDUCTOR, AND METHOD AND DEVICE FOR PRODUCING Al-CONTAINING III-V GROUP COMPOUND SEMICONDUCTOR
10/16/2003WO2003085710A1 Vertical heat treating equipment
10/16/2003WO2003085709A1 Reflection type mask blank and reflection type mask and production methods for them
10/16/2003WO2003085707A1 Extreme ultraviolet light source
10/16/2003WO2003085706A1 Manufacturing method and apparatus to avoid prototype-hold in asic/soc manufacturing
10/16/2003WO2003085705A1 Transition flow treatment process and apparatus
10/16/2003WO2003085704A2 Device for accommodating substrates
10/16/2003WO2003085703A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof
10/16/2003WO2003085702A1 Method for processing electrical components, especially semiconductor chips, and device for carrying out the method
10/16/2003WO2003085674A2 Synthetic-ferrimagnet sense-layer for high density mram applications
10/16/2003WO2003085672A1 Memory chip architecture having non-rectangular memory banks and method for arranging memory banks
10/16/2003WO2003085659A1 Method of delivering substrates to a film forming device for disk-like substrates, substrate delivering mechanism and mask used in such method, and disk-like recording medium producing method using such method
10/16/2003WO2003085586A1 Metrology diffraction signal adaptation for tool-to-tool matching
10/16/2003WO2003085504A2 Graphical user interface (gui) for a semiconductor processing system
10/16/2003WO2003085491A2 Derivatives having demand-based, adjustable returns, and trading exchange therefor
10/16/2003WO2003085455A2 Photoresist compositions comprising acetals and ketals as solvents
10/16/2003WO2003085454A2 Technique for writing with a raster scanned beam
10/16/2003WO2003085410A1 Method and arrangement for protecting a chip and checking its authenticity
10/16/2003WO2003085343A1 Pulsed processing semiconductor heating methods using combinations of heating sources
10/16/2003WO2003085166A2 Electroless deposition methods
10/16/2003WO2003085160A1 Device and method for forming thin-film, and method of manufacturing electronic component using the device
10/16/2003WO2003085159A1 Replacement unit and replacement method for substrate in thin-film forming device
10/16/2003WO2003085037A1 Chemically and electrically stabilized polymer films background
10/16/2003WO2003085032A1 Method of synthesizing polymeric material, method of forming thin polymer film, and method of forming interlayer dielectric
10/16/2003WO2003084969A1 Silicon source reagent compositions, and method of making and using same for microelectronic device structure
10/16/2003WO2003084688A2 Method and system for providing a thin film
10/16/2003WO2003084684A1 In-situ local heating using megasonic transducer resonator
10/16/2003WO2003084680A1 Enhanced processing of performance films using high-diffusivity penetrants
10/16/2003WO2003073165A3 Self-aligned pattern formation using dual wavelengths
10/16/2003WO2003072853A3 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
10/16/2003WO2003067639A3 Method for producing a memory cell
10/16/2003WO2003067633A3 Programmable resistance memory element and method for making same
10/16/2003WO2003065064A3 Predictive, adaptive power supply for an integrated circuit under test
10/16/2003WO2003063206A3 METHOD FOR DOPING GALLIUM NITRIDE (GaN) SUBSTRATES AND THE RESULTING DOPED GaN SUBSTRATE
10/16/2003WO2003063204A3 Igbt having thick buffer region
10/16/2003WO2003062835A3 Proximity sensor
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