Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2003
11/27/2003WO2003098681A1 Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip
11/27/2003WO2003098680A1 Chemical mechanical planarization of low dielectric constant materials
11/27/2003WO2003098679A1 Method of fabricating a bipolar transistor having a realigned emitter
11/27/2003WO2003098678A1 Method of treating substrate
11/27/2003WO2003098677A1 Method of predicting processing device condition or processed result
11/27/2003WO2003098676A1 Substrate processing apparatus and substrate processing method
11/27/2003WO2003098675A1 Apparatus, system and method to reduce wafer warpage
11/27/2003WO2003098674A1 Method of inspecting metal film machining residue, inspection apparatus and process for producing thin-film device
11/27/2003WO2003098673A1 Polishing method and polishing system, and method for fabricating semiconductor device
11/27/2003WO2003098672A1 Deposition method of insulating layers having low dielectric constant of semiconductor device
11/27/2003WO2003098671A1 Active matrix display devices and the manufacture thereof
11/27/2003WO2003098670A1 Light-absorbing polymer for forming organic anti-reflective layer, composition including the same, and method for forming semiconductor device pattern using the same
11/27/2003WO2003098669A1 Baffle plate and plasma etching device having same
11/27/2003WO2003098668A2 Pre-aligner
11/27/2003WO2003098667A1 Susceptor for mocvd reactor
11/27/2003WO2003098665A1 Method for processing electrical parts, particularly for processing semiconductor chips and electrical components, and device for carrying out said method
11/27/2003WO2003098664A2 Method for co-fabricating strained and relaxed crystalline and poly-crystalline structures
11/27/2003WO2003098663A2 Trench mosfet with field relief feature
11/27/2003WO2003098662A2 PLASMA ETCHING OF Cu-CONTAINING LAYERS
11/27/2003WO2003098646A1 Improved electrode for thin film capacitor devices
11/27/2003WO2003098641A1 Wiring material and wiring board using the same
11/27/2003WO2003098637A1 Mram-cell and array-architecture with maximum read-out signal and reduced electromagnetic interference
11/27/2003WO2003098636A2 STACKED 1T-nMEMORY CELL STRUCTURE
11/27/2003WO2003098635A1 Method of manufacturing mram offset cells in a double damascene structure with a reduced number of etch steps
11/27/2003WO2003098350A2 Method for the targeted deformation of an optical element
11/27/2003WO2003098244A1 Cell with fixed output voltage for integrated circuit
11/27/2003WO2003097902A1 Fabrication of electronic, magnetic, optical, chemical, and mechanical systems using chemical endpoint detection
11/27/2003WO2003097897A1 Vapor deposition method of low dielectric insulating film, thin film transistor using the same and preparation method thereof
11/27/2003WO2003097894A2 Sputtering cathode adapter
11/27/2003WO2003097651A1 Method of depositing copper on a support
11/27/2003WO2003097552A1 A method of wafer/substrate bonding
11/27/2003WO2003097550A1 Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide
11/27/2003WO2003097532A1 Process for manufacturing a gallium rich gallium nitride film
11/27/2003WO2003097300A1 Polishing pad with optical sensor
11/27/2003WO2003097294A1 Solder compositions for attaching a die to a substrate
11/27/2003WO2003097290A1 Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein
11/27/2003WO2003097223A1 Continuous dissolving device, continuous dissolving method, and gas-dissolved water supply
11/27/2003WO2003085737A3 Method and apparatus for stacking multiple die in a flip chip semiconductor package
11/27/2003WO2003085722A3 Field effect transistor having a lateral depletion structure
11/27/2003WO2003077078A3 Hub array system and method
11/27/2003WO2003073471A3 POWER SiC DEVICES HAVING RAISED GUARD RINGS
11/27/2003WO2003070390A3 Cleaning apparatus using atmospheric pressure plasma
11/27/2003WO2003069263A3 System for detecting anomalies and/or features of a surface
11/27/2003WO2003067676A3 Enhanced photo-emf sensor with high bandwidth and large field of view
11/27/2003WO2003067635A3 Reactor assembly and processing method
11/27/2003WO2003065458A3 Electronic device
11/27/2003WO2003064581A8 Methods and compositions for chemically treating a substrate using foam technology
11/27/2003WO2003063214A3 Process for preparation of separable semiconductor assemblies, particularly to form substrates for electronics, optoelectronics and optics
11/27/2003WO2003062926A8 Method for constructing an optical beam guide system
11/27/2003WO2003054922A3 Image pick-up device and camera system comprising an image pick-up device
11/27/2003WO2003052517A3 Photolithography overlay control using feedforward overlay information
11/27/2003WO2003050813A3 A device and method to read a 2-transistor flash memory cell
11/27/2003WO2003047163A3 Semiconductor device having a byte-erasable eeprom memory
11/27/2003WO2003046951A3 Performance polymer film insert molding for fluid control devices
11/27/2003WO2003044855A3 Polysilicon gate doping level variation for reduced leakage current
11/27/2003WO2003044833A3 Method for limiting divot formation in post shallow trench isolation processes
11/27/2003WO2003043060A3 Reduced footprint tool for automated processing of substrates
11/27/2003WO2003041130A3 Method for creating adhesion during fabrication of electronic devices
11/27/2003WO2003041120A3 Method for making a semiconductor photodetector, in particular in the low-energy uv-x domain, and photodetector obtained by said method
11/27/2003WO2003038869A3 Universal modular wafer transport system
11/27/2003WO2003038868A3 High resistivity silicon carbide single crystal and method of producing it
11/27/2003WO2003034379A3 Active matrix display device
11/27/2003WO2003025243A3 Metal nitride deposition by ald using gettering reactant
11/27/2003WO2003024865A3 Method for producing micro-electromechanical components
11/27/2003WO2003017349A3 Dmos transistor
11/27/2003WO2003017339A3 Method and apparatus for positoning a wafer chuck
11/27/2003WO2003015142A3 Formation of planar strained layers
11/27/2003WO2003012860A3 Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
11/27/2003WO2003011595A3 Laser spectral engineering for lithographic process
11/27/2003WO2003009396A3 Algaas or ingap low turn-on voltage gaas-based heterojunction bipolar transistor
11/27/2003WO2003009368A3 Low emitter resistance contacts to gaas high speed hbt
11/27/2003WO2003008139A3 Etching process for micromachining crystalline materials and devices fabricated thereby
11/27/2003WO2003007340A3 Wafer transport apparatus
11/27/2003WO2003005420A3 Method and apparatus for fabricating structures using chemically selective endpoint detection
11/27/2003WO2003003464A3 Hv-soi ldmos device with integrated diode to improve reliability and avalanche ruggedness
11/27/2003WO2002095809A3 Apparatus and method for substrate preparation implementing a surface tension reducing process
11/27/2003WO2002091452A3 Methods of forming a nitridated surface on a metallic layer and products produced thereby
11/27/2003WO2002091450A3 Ordered two-phase dielectric film, and semiconductor device containing the same
11/27/2003WO2002080271A3 Fluxless flip chip interconnection
11/27/2003WO2002075784A3 Drying vapor generation
11/27/2003WO2002065513B1 Photoresist strip with 02 and nh3 for organosilicate glass applications
11/27/2003WO2002052618A3 Self-aligned double-sided vertical mim-capacitor
11/27/2003US20030221175 Automatic placement and routing apparatus for designing integrated circuit that controls its timing using multiple power supplies
11/27/2003US20030221152 System and method for testing circuitry on a wafer
11/27/2003US20030221144 Devices for storing and accumulating defect information, semiconductor device and device for testing the same
11/27/2003US20030220770 Design rule generating system
11/27/2003US20030220754 Semiconductor production system
11/27/2003US20030220708 Integrated equipment set for forming shallow trench isolation regions
11/27/2003US20030220706 Wafer map host system
11/27/2003US20030220455 Heat resistant resin composition and adhesive film
11/27/2003US20030220431 Anti-reflective coatings and dual damascene fill compositions comprising styrene-allyl alcohol copolymers
11/27/2003US20030220061 Microporous polishing pads
11/27/2003US20030220053 Apparatus for electrochemical processing
11/27/2003US20030220052 Electrochemical planarization of metal feature surfaces
11/27/2003US20030220012 Compliant component for supporting electrical interface component
11/27/2003US20030219996 Method of forming a sealing layer on a copper pattern
11/27/2003US20030219995 Method for fabricating semiconductor integrated circuit device
11/27/2003US20030219994 Method of fabrication for III-V semiconductor surface passivation
11/27/2003US20030219993 Method of enhancing adhesion strength of BSG film to silicon nitride film
11/27/2003US20030219992 Replication and transfer of microstructures and nanostructures
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