Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2003
12/02/2003US6656778 Passivation structure for flash memory and method for fabricating same
12/02/2003US6656776 Thin film transistor and fabricating method thereof
12/02/2003US6656775 Semiconductor substrate, semiconductor device, and manufacturing method thereof
12/02/2003US6656774 Method to enhance operating characteristics of FET, IGBT, and MCT structures
12/02/2003US6656773 Transfer molding of integrated circuit packages
12/02/2003US6656772 Method for bonding inner leads to bond pads without bumps and structures formed
12/02/2003US6656771 Semiconductor device, method of connecting a semiconductor chip, circuit board, and electronic equipment
12/02/2003US6656769 Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
12/02/2003US6656766 Semiconductor device having chip scale package
12/02/2003US6656765 Fabricating very thin chip size semiconductor packages
12/02/2003US6656764 Process for integration of a high dielectric constant gate insulator layer in a CMOS device
12/02/2003US6656761 Method for forming a semiconductor device for detecting light
12/02/2003US6656759 Method of producing semiconductor element, semiconductor element, and gyroscope
12/02/2003US6656758 Method of manufacturing a chip size package
12/02/2003US6656755 Method for manufacturing semiconductor device by polishing
12/02/2003US6656750 Method for testing chips on flat solder bumps
12/02/2003US6656749 In-situ monitoring during laser thermal annealing
12/02/2003US6656748 FeRAM capacitor post stack etch clean/repair
12/02/2003US6656747 Ferroelectric memory and method for manufacturing same
12/02/2003US6656693 Self assembled nano-devices using DNA
12/02/2003US6656678 Impinging with a biocomponent (cells, antibodies, microorganisms) contained in a nutrient/osmotic protective medium; determining chemical or topographic characteristics by evaluating changes in color, shape, size or arrangement
12/02/2003US6656666 Topcoat process to prevent image collapse
12/02/2003US6656659 Resist composition suitable for short wavelength exposure and resist pattern forming method
12/02/2003US6656648 Pattern inspection apparatus, pattern inspection method and mask manufacturing method
12/02/2003US6656646 Fabrication method of semiconductor integrated circuit device
12/02/2003US6656645 Shade pattern; photolithography
12/02/2003US6656644 Resist film patterns are partly formed over substrate in addition to metal patterns to shorten time required to change or correct mask pattern
12/02/2003US6656643 Method of extreme ultraviolet mask engineering
12/02/2003US6656540 Plasma-excited vapor phase growth process, especially using copper and chlorine or hydrogen chloride
12/02/2003US6656538 Method of manufacturing magnetoresistive device, method of manufacturing thin film magnetic head, and method of forming thin film pattern
12/02/2003US6656532 Damascene polysilazanes for manufacturing microelectronic devices; etch resistance
12/02/2003US6656527 Method and device for producing aerogels
12/02/2003US6656402 Wafer planarization using a uniform layer of material and method for forming uniform layer of material used in semiconductor processing
12/02/2003US6656376 Process for cleaning CVD units
12/02/2003US6656375 Selective nitride: oxide anisotropic etch process
12/02/2003US6656372 Methods of making magnetoresistive memory devices
12/02/2003US6656371 Methods of forming magnetoresisitive devices
12/02/2003US6656359 Slurry effluent agglomerated grains are crushed using a mill, ultrasonic oscillation, or pressurized circulation
12/02/2003US6656341 Method of etching, as well as frame element, mask and prefabricated substrate element for use in such etching
12/02/2003US6656330 Coating installation for disk-form workpieces
12/02/2003US6656323 Plasma processing apparatus
12/02/2003US6656322 Plasma processing apparatus
12/02/2003US6656321 Liquid processing apparatus and liquid processing method
12/02/2003US6656320 Removal of masking tape from lead frames
12/02/2003US6656313 Structure and method for improved adhesion between two polymer films
12/02/2003US6656289 Positioning a semiconductor wafer within an enclosed vessel, etching polycrystalline silicon with hydrogen fluoride, filling the vessel with inert nitrogen gas, rinsing the wafer with deionized water, forming anhydrous liquid layer over it
12/02/2003US6656286 Pedestal with a thermally controlled platen
12/02/2003US6656281 Substrate processing apparatus and substrate processing method
12/02/2003US6656277 Apparatus for and method of processing substrate
12/02/2003US6656275 Partial plating system
12/02/2003US6656273 Film forming method and film forming system
12/02/2003US6656272 Method of epitaxially growing submicron group III nitride layers utilizing HVPE
12/02/2003US6656271 Method of manufacturing semiconductor wafer method of using and utilizing the same
12/02/2003US6656270 Excimer laser crystallization of amorphous silicon film
12/02/2003US6656269 Method of manufacturing nitride system III-V compound layer and method of manufacturing substrate
12/02/2003US6656255 Hexafluoroacetylacetonato copper complex with a vinylsilane or a compound with carbon-carbon multiple bond whose p-electrons participate in coordination with the monovalent copper; controlling the amount of water added
12/02/2003US6656241 Silica-based slurry
12/02/2003US6656030 Unsupported chemical mechanical polishing belt
12/02/2003US6656029 Semiconductor device incorporating hemispherical solid immersion lens, apparatus and method for manufacturing the same
12/02/2003US6656028 Method for loading a semiconductor processing system
12/02/2003US6656026 Wafer polishing apparatus
12/02/2003US6656025 Seamless polishing surface
12/02/2003US6656022 Abrasive grains having remained after polishing are easily removed
12/02/2003US6656021 Process for fabricating a semiconductor device
12/02/2003US6656020 Polishing apparatus and polishing method
12/02/2003US6656019 Grooved polishing pads and methods of use
12/02/2003US6656018 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
12/02/2003US6656017 Cleaning or treating miniature electromechanical device surfaces with with cryogenic impingement spray
12/02/2003US6655964 Low cost integrated out-of-plane micro-device structures and method of making
12/02/2003US6655901 Three-dimensionally movable transfer robot
12/02/2003US6655898 Front opening unified pod (FOUP) hoist jig
12/02/2003US6655891 Substrate treatment system, substrate transfer system, and substrate transfer method
12/02/2003US6655808 Focusing-device for the radiation from a light source
12/02/2003US6655767 Active matrix display device
12/02/2003US6655423 Unified pod quick-opening apparatus
12/02/2003US6655286 Method for preventing distortions in a flexibly transferred feature pattern
12/02/2003US6655045 Apparatus and method for pick and place handling
12/02/2003US6655044 Vacuum processing apparatus and operating method therefor
12/02/2003US6655042 System and method for drying semiconductor substrate
12/02/2003US6655024 Method of manufacturing a circuit board
12/02/2003US6655023 Method and apparatus for burning-in semiconductor devices in wafer form
12/02/2003US6655020 Method of packaging a high performance chip
12/02/2003US6655000 Lot management production method and product carrying container
11/2003
11/30/2003CA2388400A1 Method and apparatus for the conveying and positioning of ion implantation targets
11/27/2003WO2003098848A2 Method and apparatus for optimizing distributed multiplexed bus interconnects
11/27/2003WO2003098712A2 High-reliability group iii-nitride light emitting diode
11/27/2003WO2003098710A1 Semiconductor light emitting element and production method therefor
11/27/2003WO2003098706A2 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component
11/27/2003WO2003098698A1 Semiconductor device and its manufacturing method
11/27/2003WO2003098697A1 Method for forming quantum dot, quantum semiconductor device, and its manufacturing method
11/27/2003WO2003098696A1 Circuit fabrication method
11/27/2003WO2003098695A1 Laminated substrate, method of manufacturing the substrate, and wafer outer periphery pressing jigs used for the method
11/27/2003WO2003098694A1 Layer arrangement and memory arrangement
11/27/2003WO2003098693A2 Schottky barrier cmos device and method
11/27/2003WO2003098692A1 Integrated circuit with reverse engineering protection
11/27/2003WO2003098688A2 Structural design of under bump metallurgy for high reliability bumped packages
11/27/2003WO2003098687A1 Semiconductor device and its manufacturing method
11/27/2003WO2003098685A1 Method of making transistors with gate insulation layers of differing thickness
11/27/2003WO2003098684A1 Substrate processing device and substrate processing method
11/27/2003WO2003098682A1 Semiconductor package and method of preparing same
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