Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2003
12/04/2003US20030224627 Probe card, probe card manufacturing method, and contact
12/04/2003US20030224625 Substrate processing apparatus and method
12/04/2003US20030224624 Method of forming a semiconductor device and structure therefor
12/04/2003US20030224622 Insulation film on semiconductor substrate and method for forming same
12/04/2003US20030224620 Method and apparatus for smoothing surfaces on an atomic scale
12/04/2003US20030224619 Method for low temperature oxidation of silicon
12/04/2003US20030224618 Oxidizing method and oxidation system
12/04/2003US20030224617 Method of manufacturing a semiconductor device
12/04/2003US20030224616 Semiconductor device producing method and semiconductor device producing apparatus
12/04/2003US20030224615 Method for manufacturing semiconductor device
12/04/2003US20030224613 Method of forming a component overlying a semiconductor substrate
12/04/2003US20030224612 Graded junction termination extensions for electronic devices
12/04/2003US20030224611 Manufacturing method of semiconductor devices by using dry etching technology
12/04/2003US20030224610 Fabrication process for bonded wafer precision layer thickness control and its non-destructructive measurement method
12/04/2003US20030224609 Method of rounding a top corner of trench
12/04/2003US20030224608 Method for manufacturing magnetic random access memory
12/04/2003US20030224607 Structure including multiple wire-layers and methods for forming the same
12/04/2003US20030224606 Method of photolithographically forming extremely narrow transistor gate elements
12/04/2003US20030224605 Process of fabricating dram cells with collar isolation layers
12/04/2003US20030224603 Double side polished wafers having external gettering sites, and method of producing same
12/04/2003US20030224602 Method for reducing dimensions between patterns on a hardmask
12/04/2003US20030224601 Method and apparatus for forming a trench through a semiconductor substrate
12/04/2003US20030224600 Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor
12/04/2003US20030224599 Semiconductor device with a copper line having an increased resistance against electromigration and a method of forming the same
12/04/2003US20030224598 Tungsten plug with conductor capping layer
12/04/2003US20030224597 Electrical coupling stack and processes for making same
12/04/2003US20030224596 Method and system for improving the manufacturing of metal damascene structures
12/04/2003US20030224595 Methods for polymer removal following etch-stop layer etch
12/04/2003US20030224594 Method for forming wiring structure
12/04/2003US20030224593 Integrated circuit with dielectric film comprising vapor deposited carbon doped oxide
12/04/2003US20030224592 Method for forming wiring structure
12/04/2003US20030224591 Airgap for semiconductor devices
12/04/2003US20030224590 Methods of fabricating integrated circuit gates by pretreating prior to oxidizing
12/04/2003US20030224589 Pattern formation method
12/04/2003US20030224588 Stabilization of dopant concentration in semiconductor device having epitaxially-filled trench
12/04/2003US20030224587 Laser irradiation method, laser irradiation apparatus, and semiconductor device
12/04/2003US20030224586 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
12/04/2003US20030224585 Method of passivating and/or removing contaminants on a low-k dielectric/copper surface
12/04/2003US20030224584 Method and configuration for reinforcement of a dielectric layer at defects by self-aligning and self-limiting electrochemical conversion of a substrate material
12/04/2003US20030224583 Method for plasma etching a wafer after backside grinding
12/04/2003US20030224582 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
12/04/2003US20030224581 Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
12/04/2003US20030224580 Novel deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to less than or equal to 0.10 microns
12/04/2003US20030224579 Method of manufacturing semiconductor device with shallow trench isolation
12/04/2003US20030224578 Selective deposition of a barrier layer on a dielectric material
12/04/2003US20030224577 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof
12/04/2003US20030224576 Method of fabricating a diode protecting a gate electrode of a field effect transistor
12/04/2003US20030224575 Method of manufacturing a semiconductor integrated circuit device
12/04/2003US20030224574 Transistor formation for semiconductor devices
12/04/2003US20030224573 High performance logic and high density embedded dram with borderless contact and antispacer
12/04/2003US20030224572 Flash memory structure having a T-shaped floating gate and its fabricating method
12/04/2003US20030224571 Semiconductor integrated circuit device with capacitor of crown structure and method of manufacturing the same
12/04/2003US20030224570 Storage capacitor of planar display and process for fabricating same
12/04/2003US20030224569 Method of forming biasable isolation regions using epitaxially grown silicon between the isolation regions
12/04/2003US20030224568 Method of fabricating capacitor
12/04/2003US20030224567 Method for forming dielectric layer of capacitor
12/04/2003US20030224566 Biasable isolation regions using epitaxially grown silicon between the isolation regions
12/04/2003US20030224565 Method of making a thick microstructural oxide layer and device utilizing same
12/04/2003US20030224564 Non-volatile memory cell having a silicon-oxide nitride-oxide-silicon gate structure and fabrication method of such cell
12/04/2003US20030224563 Manufacturing process of a semiconductor non-volatile memory cell and corresponding memory cell
12/04/2003US20030224562 Thin film transistor manufacture method
12/04/2003US20030224561 Top gate thin-film transistor and method of producing the same
12/04/2003US20030224560 Method for manufacturing an electronic device
12/04/2003US20030224559 Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates
12/04/2003US20030224557 Process and system to package residual quantities of wafer level packages
12/04/2003US20030224556 Traceless flip chip assembly and method
12/04/2003US20030224555 Apparatus for manufacturing an electronic device, method of manufacturing an electronic device, and program for manufacturing an electronic device
12/04/2003US20030224552 Partial wafer processing for random size wafers
12/04/2003US20030224550 Semiconductor device and manufacturing method therefor
12/04/2003US20030224548 Method of forming group-III nitride semiconductor layer on a light-emitting device
12/04/2003US20030224544 Test method
12/04/2003US20030224543 Method and apparatus for determining thickness of a semiconductor substrate at the floor of a trench
12/04/2003US20030224542 Method for making multi-chip packages and single chip packages simultaneously and structures from thereof
12/04/2003US20030224541 Method of monitoring high tilt angle of medium current implant
12/04/2003US20030224540 Recognition method of a mark provided on a semiconductor device
12/04/2003US20030224539 Method for etching a semiconductor element, its use for etching end point detection and a device for carrying it out
12/04/2003US20030224538 Semiconductor device including ferroelectric capacitors and fabricating method thereof
12/04/2003US20030224537 Ferroelectric thin film processing for ferroelectric field-effect transistor
12/04/2003US20030224536 Contact formation
12/04/2003US20030224535 Forming ferroelectric polymer memories
12/04/2003US20030224297 Chemically amplified resist, polymer for the chemically amplified resist, monomer for the polymer and method for transferring pattern to chemically amplified resist layer
12/04/2003US20030224296 Pattern formation method
12/04/2003US20030224295 Transfer method for a mask or substrate, storage box, apparatus adapted for use in such method, and device manufacturing method including such a transfer method
12/04/2003US20030224287 Photo acid generator; resin which is insoluble in an alkali and becomes alkali-soluble by an action of an acid; and an acyclic compound having at least three groups selected from a hydroxyl group and a substituted hydroxyl group.
12/04/2003US20030224286 Processes for producing polysiloxanes and photoresist compositions comprising same
12/04/2003US20030224283 Photoresist composition
12/04/2003US20030224282 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same
12/04/2003US20030224264 Projection exposure device and position alignment device and position alignment method
12/04/2003US20030224262 Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
12/04/2003US20030224254 Method for reducing dimensions between patterns on a photomask
12/04/2003US20030224218 Group 3 metal oxide and group 5 element
12/04/2003US20030224217 Metal nitride formation
12/04/2003US20030224197 Solder
12/04/2003US20030224156 Low dielectric materials and methods for making same
12/04/2003US20030224152 Conductive film forming composition, conductive film, and method for forming the same
12/04/2003US20030224135 Double side polished wafers having external gettering sites, and method of producing same
12/04/2003US20030224104 Placing the metal film precursor on an organic film to produce a transfer sheet, contacting the surface with a substrate, and heating the sheet to decompose the film and the precursor and join the metal ultrafine particles
12/04/2003US20030224079 Molding apparatus for molding semiconductor devices in which the mold is automatically treated with a releasing agent
12/04/2003US20030223853 Dual arm substrate transport apparatus
12/04/2003US20030223630 Overlay metrology and control method
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