Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2003
12/09/2003US6660590 Vertical transistor and method of manufacturing thereof
12/09/2003US6660589 Semiconductor devices and methods for fabricating the same
12/09/2003US6660588 High density floating gate flash memory and fabrication processes therefor
12/09/2003US6660587 Method for forming a gate electrode in a semiconductor device
12/09/2003US6660586 Semiconductor device and process for manufacturing same
12/09/2003US6660585 Stacked gate flash memory cell with reduced disturb conditions
12/09/2003US6660584 Selective polysilicon stud growth of 6F2 memory cell manufacturing having a convex upper surface profile
12/09/2003US6660582 Method of forming a vertical field-effect transistor device
12/09/2003US6660581 Method of forming single bitline contact using line shape masks for vertical transistors in DRAM/e-DRAM devices
12/09/2003US6660580 Capacitor of an integrated circuit device and method of manufacturing the same
12/09/2003US6660579 Zero power memory cell with improved data retention
12/09/2003US6660578 High-K dielectric having barrier layer for P-doped devices and method of fabrication
12/09/2003US6660577 Method for fabricating metal gates in deep sub-micron devices
12/09/2003US6660576 Substrate and method for producing variable quality substrate material
12/09/2003US6660575 Method for forming a semiconductor device
12/09/2003US6660574 Method of forming a semiconductor device including recombination center neutralizer
12/09/2003US6660573 Method of forming a gate electrode in a semiconductor device and method of manufacturing a non-volatile memory device using the same
12/09/2003US6660572 Thin film semiconductor device and method for producing the same
12/09/2003US6660571 High voltage power MOSFET having low on-resistance
12/09/2003US6660570 Method of fabricating a high voltage semiconductor device using SIPOS
12/09/2003US6660568 BiLevel metallization for embedded back end of the line structures
12/09/2003US6660565 Flip chip molded/exposed die process and package structure
12/09/2003US6660564 Wafer-level through-wafer packaging process for MEMS and MEMS package produced thereby
12/09/2003US6660560 No-flow underfill material and underfill method for flip chip devices
12/09/2003US6660559 Method of making a chip carrier package using laser ablation
12/09/2003US6660558 Semiconductor package with molded flash
12/09/2003US6660557 Method of manufacturing an electronic device
12/09/2003US6660553 Semiconductor device having solid-state image sensor with suppressed variation in impurity concentration distribution within semiconductor substrate, and method of manufacturing the same
12/09/2003US6660550 Surface emission type semiconductor light-emitting device and method of manufacturing the same
12/09/2003US6660547 Stabilization for thin substrates
12/09/2003US6660546 Method of etching an object, method of repairing pattern, nitride pattern and semiconductor device
12/09/2003US6660545 Semiconductor device and manufacturing method therefor, circuit substrate, and electronic apparatus
12/09/2003US6660544 Method of forming conductive patterns formed in semiconductor integrated circuit device using multilayer interconnection
12/09/2003US6660541 Semiconductor device and a manufacturing method thereof
12/09/2003US6660540 Test wafer and method for investigating electrostatic discharge induced wafer defects
12/09/2003US6660539 Methods for dynamically controlling etch endpoint time, and system for accomplishing same
12/09/2003US6660538 Non-contacting deposition control of chalcopyrite thin films
12/09/2003US6660537 Method of inducing movement of charge carriers through a semiconductor material
12/09/2003US6660536 Method of making ferroelectric material utilizing anneal in an electrical field
12/09/2003US6660535 Barium strontium titanate, (Sr,Ba)TiO3 (BST) by supplying BST sources into a chamber; and inducing textured growth of the film over the substrate in a uniform desired crystal orientation; metal-organic chemical vapor deposition (MOCVD)
12/09/2003US6660462 Suppressing variation in gate length caused by proximity effect
12/09/2003US6660459 System and method for developing a photoresist layer with reduced pattern collapse
12/09/2003US6660456 Transferring an image of the first opening from a photoresist layer into the first film layer by etching
12/09/2003US6660455 Pattern formation material, pattern formation method, and exposure mask fabrication method
12/09/2003US6660438 A halftone phase-shift pattern on an optically transmissive plate and a resist film outside the pattern formation area, is illuminated, transferring the pattern to a photosensitive film
12/09/2003US6660437 The phase mask contains a T-patterned structure composed of transparent surface segments with mutually displaced phases and surface boundary segment whose phase is situated between the phases of the adjacent surface segments
12/09/2003US6660414 Barium strontium titanate material; low dielectric loss or leakage; decreased leakage current; high frequency or microwave applications
12/09/2003US6660393 Reduced resistance
12/09/2003US6660391 Polysilazane having alkyl, phenyl and/or fluoroalkyl groups; high thermal stability; reliable; cost effective
12/09/2003US6660331 MOCVD of SBT using toluene-based solvent system for precursor delivery
12/09/2003US6660330 Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support
12/09/2003US6660234 Generation of preferential nucleotide sequences on preferential substrate; obtain substrate, expose to activator, remove terminal groups, recover biopolymer
12/09/2003US6660185 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
12/09/2003US6660180 Compositions for etching silicon with high selectivity to oxides and methods of using same
12/09/2003US6660177 Apparatus and method for reactive atom plasma processing for material deposition
12/09/2003US6660154 Contacting a metal seed layer with a copper colloid composition including a minor amount of ionizable palladium compound
12/09/2003US6660153 Seed layer repair bath
12/09/2003US6660151 Microstructure elements and process for the production thereof
12/09/2003US6660140 Sputtering apparatus
12/09/2003US6660139 Plating apparatus and method
12/09/2003US6660135 Staged aluminum deposition process for filling vias
12/09/2003US6660134 Feedthrough overlap coil
12/09/2003US6660127 Apparatus for plasma etching at a constant etch rate
12/09/2003US6660126 Lid assembly for a processing system to facilitate sequential deposition techniques
12/09/2003US6660124 Polishing system and polishing method
12/09/2003US6660104 Support tubes confining cassette within rotor; rotation; applying fluid
12/09/2003US6660101 Supplying predetermined quantity of cleaning gas to container, controlling opening degree of automatic pressure regulating valve in vacuum exhaust system to maintain constant pressure, detecting etching end point by change in degree of opening
12/09/2003US6660098 System for processing a workpiece
12/09/2003US6660097 Single-substrate-processing apparatus for semiconductor process
12/09/2003US6660096 Gas treatment apparatus
12/09/2003US6660089 Substrate support mechanism and substrate rotation device
12/09/2003US6660085 Polycrystal thin film forming method and forming system
12/09/2003US6660083 Method of epitaxially growing device structures with submicron group III nitride layers utilizing HVPE
12/09/2003US6659850 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
12/09/2003US6659847 Polishing surface of probe pin of probe card by moving cleaning wafer to contact surface of pin with first acceleration rate for plurality of times, smoothing surface by moving cleaning wafer with second, faster, acceleration rate
12/09/2003US6659842 Method and apparatus for optical monitoring in chemical mechanical polishing
12/09/2003US6659661 Substrate processing apparatus
12/09/2003US6659634 Chemical solution feeding apparatus and method for preparing slurry
12/09/2003US6659441 Travelling worktable apparatus
12/09/2003US6659334 Method for forming end-face electrode
12/09/2003US6659331 Welding high purity alloys having controlled particulate size and distribution to form geometric shapes, then anodizing in electrolytic cells form protective coatings having chemical and corrosion resistance
12/09/2003US6659116 System for wafer carrier in-process clean and rinse
12/09/2003US6659111 Removing deposits from interior surfaces of metal apparatus used for forming metal or alloy films, by flowing mixtures of hydrogen fluoride and oxygen, then evacuating with inert gases
12/09/2003US6659098 Rotary tool including a cutting blade and cutting apparatus comprising the same
12/09/2003US6658917 Air-sampling carrier, apparatus and method for analyzing air in a semiconductor process tool
12/09/2003US6658764 Apparatus and method for preventing droplets on wafers during solvent drying process
12/09/2003US6658763 Method for heating and cooling substrates
12/09/2003US6658762 Method and apparatus for transporting substrates in OLED process
12/09/2003US6658736 Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent
12/09/2003US6658734 Method of manufacturing a circuit member for a resin-sealed semiconductor device
12/09/2003US6658727 Method for assembling die package
12/09/2003US6658718 Positioning adhesive tapes close to semiconductor wafers supports, then pulling to reduce adhesion
12/09/2003US6658716 Method for assembling motor assembly to support wafer
12/05/2003CA2430803A1 Heat dissipation structures and method of making
12/04/2003WO2003101166A1 Aluminum nitride sintered compact having metallized layer and method for preparation thereof
12/04/2003WO2003101165A1 Direct-write laser transfer and processing
12/04/2003WO2003101164A1 Nanoparticle filled underfill
12/04/2003WO2003100863A1 Microwave field effect transistor structure on silicon carbide substrate
12/04/2003WO2003100861A1 Electric signal transmission line
12/04/2003WO2003100859A2 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component