| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/29/2004 | DE10331037A1 Sockel für eine Halbleitervorrichtung Base for a semiconductor device |
| 01/29/2004 | DE10330072A1 DRAM cell array region for consumer, commercial and industrial applications, has nodes that are laterally offset from respective source regions along one direction and placed on substrate including MOS transistors |
| 01/29/2004 | DE10330070A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same |
| 01/29/2004 | DE10329072A1 Halbleiterwafer-Behandlungselement A semiconductor wafer processing element |
| 01/29/2004 | DE10328594A1 Verfahren zur Herstellung einer Schaltung mit einer vergrabenen Brücke A method of manufacturing a circuit having a buried strap |
| 01/29/2004 | DE10318825A1 Testsystem für ferroelektrische Materialien und Edelmetallelektroden bei Halbleiterkondensatoren Test system for ferroelectric materials and precious metal electrodes in semiconductor capacitors |
| 01/29/2004 | DE10318183A1 Permanente Chip-ID unter Verwendung eines FeRAM Permanent chip ID using a FeRAM |
| 01/29/2004 | DE10311085A1 Halbleiterspeicher Semiconductor memory |
| 01/29/2004 | DE10310536A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof |
| 01/29/2004 | DE10303511A1 Organische antireflektierende Beschichtungszusammensetzung und Verfahren zum Bilden von Fotolackmustern unter Verwendung derselben Organic anti-reflective coating composition and method for forming photoresist patterns by using the same |
| 01/29/2004 | DE10234945B3 Halbleiterspeicher mit einer Anordnung von Speicherzellen A semiconductor memory comprising an array of memory cells |
| 01/29/2004 | DE10231533A1 Verfahren zur Metallstrukturierung Method for patterning metal |
| 01/29/2004 | DE10230929A1 Verfahren zum elektronenmikroskopischen Beobachten einer Halbleiteranordnung und Vorrichtung hierfür A method for electron microscopic observation of a semiconductor device and apparatus therefor |
| 01/29/2004 | DE10230715A1 Vertikaltransistor und Verfahren zur Herstellung eines Vertikaltransistors Vertical transistor and method of manufacturing a vertical transistor |
| 01/29/2004 | DE10230696A1 Verfahren zur Herstellung eines Kurzkanal-Feldeffekttransistors A process for producing a short-channel field effect transistor |
| 01/29/2004 | DE10230652A1 Optische Vorrichtung mit einer Beleuchtungslichtquelle An optical device comprising an illumination light source |
| 01/29/2004 | DE10229642A1 Verfahren zum lokalen Erhitzen eines in einem Halbleitersubstrat angeordneten Bereichs A method for locally heating an object arranged in a semiconductor substrate region |
| 01/29/2004 | DE10229188A1 Verfahren zur Herstellung von Kontakten zu Teilen eines in einem Halbleitersubstrat integrierten Bauelementes A process for producing contacts to portions of an integrated in a semiconductor substrate component |
| 01/29/2004 | DE10229066A1 Verfahren zur Herstellung einer Floating-Gate-Struktur für nichtflüchtige Halbleiterspeicher A method for producing a floating gate structure for non-volatile semiconductor memory |
| 01/29/2004 | DE10229065A1 Verfahren zur Herstellung eines NROM-Speicherzellenfeldes A process for the preparation of a NROM memory cell array, |
| 01/29/2004 | DE10229040A1 Neue Erdalkalimetallkomplexe und ihre Verwendung New alkaline earth metal complexes and their use |
| 01/29/2004 | DE10229037A1 Vorrichtung und Verfahren zur Erzeugung von Chlortrifluorid und Anlage zur Ätzung von Halbleitersubstraten mit dieser Vorrichtung Apparatus and method for generating chlorine trifluoride and apparatus for etching semiconductor substrates with this device |
| 01/29/2004 | DE10229003A1 SOI-Feldeffekttransistorelement mit einem Rekombinationsgebiet und ein Verfahren zur Herstellung desselben SOI field effect transistor element thereof with a Rekombinationsgebiet and a process for preparing |
| 01/29/2004 | DE10229000A1 Vorrichtung und Verfahren zum Reduzieren der Oxidation von polierten Metalloberflächen in einem chemisch-mechanischen Poliervorgang Apparatus and method for reducing the oxidation of polished metal surfaces in a chemical mechanical polishing process |
| 01/29/2004 | DE10207300B4 Integrierter Festwertspeicher, Verfahren zum Betreiben eines solchen Festwertspeichers sowie Herstellungsverfahren Built-only memory, method of operating such a read-only memory and manufacturing method |
| 01/29/2004 | CA2493853A1 Trench cut light emitting diodes and methods of fabricating same |
| 01/29/2004 | CA2493547A1 Method of preventing shift of alignment marks during rapid thermal processing |
| 01/29/2004 | CA2492704A1 Heteroatom-containing diamondoid transistors |
| 01/29/2004 | CA2491951A1 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers |
| 01/29/2004 | CA2460723A1 Indium-containing wafer and method for production thereof |
| 01/28/2004 | EP1385364A2 Patterning method |
| 01/28/2004 | EP1385241A1 Nitride semiconductor element |
| 01/28/2004 | EP1385220A2 Organic semiconductor device |
| 01/28/2004 | EP1385215A2 Nitride semiconductor device comprising bonded substrate and fabrication method of the same |
| 01/28/2004 | EP1385214A2 Method of forming laminate and method of manufacturing photovoltaic device |
| 01/28/2004 | EP1385213A1 Semiconductor storage device and its manufacturing method |
| 01/28/2004 | EP1385211A1 Mosfet anti-fuse structure and method for making same |
| 01/28/2004 | EP1385203A2 Nonvolatile solid-state magnetic memory, method for controlling coercive force of nonvolatile solid-state magnetic memory, and method for recording in nonvolatile solid-state magnetic memory |
| 01/28/2004 | EP1385202A2 Method for manufacturing a via hole of a semiconductor device |
| 01/28/2004 | EP1385201A2 Method of fabricating dual damascene interconnections of microelectronic device |
| 01/28/2004 | EP1385200A2 Method for making thin film devices intended for solar cells or SOI applications |
| 01/28/2004 | EP1385199A1 Method for making thin film devices intended for solar cells or SOI application |
| 01/28/2004 | EP1385198A1 Process for the formation of contact openings on a MOS integrated circuit |
| 01/28/2004 | EP1385197A1 Planarizing a surface of a semiconductor wafer |
| 01/28/2004 | EP1385196A2 Method of producing a Group III nitride semiconductor crystal |
| 01/28/2004 | EP1385195A2 Substrate treating system |
| 01/28/2004 | EP1385192A2 Device working with beams of charged particles |
| 01/28/2004 | EP1385175A1 Probe tip design for optical near-field microscope |
| 01/28/2004 | EP1385171A2 Method for recording in a nonvolatile solid-state magnetic memory |
| 01/28/2004 | EP1385075A2 Semiconductor integrated circuit device |
| 01/28/2004 | EP1385059A1 Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same |
| 01/28/2004 | EP1385056A2 Method and apparatus for reducing thermal stress in a wafer |
| 01/28/2004 | EP1385053A2 Automatical optical proximity correction (OPC) rule generation |
| 01/28/2004 | EP1385052A2 Orientation dependent shielding for use with dipole illumination techniques |
| 01/28/2004 | EP1385034A1 Adaptive lithography mirror with actuators |
| 01/28/2004 | EP1384958A1 Production system |
| 01/28/2004 | EP1384925A2 Method of fixing a plurality of lower members each having a reference bore for installing an upper member, and fixing jigs |
| 01/28/2004 | EP1384738A1 One-component hot-setting epoxy resin composition and semiconductor mounting underfill material |
| 01/28/2004 | EP1384270A2 Matrix array devices with flexible substrates |
| 01/28/2004 | EP1384269A2 Metal insulator power semiconductor component (mis) and a method for producing the same |
| 01/28/2004 | EP1384268A1 Three-dimensional metal devices highly suspended above semiconductor substrate, their circuit model, and method for manufacturing the same |
| 01/28/2004 | EP1384265A1 Method for thin film lift-off processes using lateral extended etching masks and device |
| 01/28/2004 | EP1384264A2 Metal-to-metal antifuse structure and fabrication method |
| 01/28/2004 | EP1384263A2 Support for electrical circuit elements |
| 01/28/2004 | EP1384262A2 Package level pre-applied underfills for thermo-mechanical reliability enhancements of electronic assemblies |
| 01/28/2004 | EP1384260A1 Two-transistor flash cell having vertical access transistor |
| 01/28/2004 | EP1384259A2 Method for the production of an integrated circuit |
| 01/28/2004 | EP1384258A1 Semiconductor process and integrated circuit |
| 01/28/2004 | EP1384257A2 Ionized pvd with sequential deposition and etching |
| 01/28/2004 | EP1384256A2 Ordered two-phase dielectric film, and semiconductor device containing the same |
| 01/28/2004 | EP1384255A2 Method for grinding the back sides of wafers |
| 01/28/2004 | EP1384254A2 Drying vapor generation |
| 01/28/2004 | EP1384253A1 Measurement arrangement |
| 01/28/2004 | EP1384234A1 Euvl multilayer structures |
| 01/28/2004 | EP1384205A1 Wafer mapping apparatus and method |
| 01/28/2004 | EP1384179A2 System and method for product yield prediction |
| 01/28/2004 | EP1383944A1 Method for treating the surface of a semiconductor material |
| 01/28/2004 | EP1383939A1 Use of perfluoroketones as vapor reactor cleaning, etching, and doping gases |
| 01/28/2004 | EP1383938A1 Method for production of a metallic or metal-containing layer |
| 01/28/2004 | EP1383936A2 Sputter targets comprising ti and zr |
| 01/28/2004 | EP1383812A1 Polycyclic fluorine-containing polymers and photoresists for microlithography |
| 01/28/2004 | EP1383707A2 Fabrication of silicon micro mechanical structures |
| 01/28/2004 | EP1250390B1 Composition and method for planarizing surfaces |
| 01/28/2004 | EP1234009B1 Composition and method for planarizing surfaces |
| 01/28/2004 | EP1204872B1 Electrical contactor, especially wafer level contactor, using fluid pressure |
| 01/28/2004 | EP0982385B1 Adhesive, method for bonding, and assemblies of mounted boards |
| 01/28/2004 | EP0854759B1 Flip chip underfill system and method |
| 01/28/2004 | CN1471802A Method of manufacturing an integrated circuit carrier |
| 01/28/2004 | CN1471732A Semiconductor device and method of making same |
| 01/28/2004 | CN1471730A Electronic circuit device and method for manufacturing the same |
| 01/28/2004 | CN1471729A Method for producing a DMOS transistor |
| 01/28/2004 | CN1471728A Non-volatile memory with source side boron implantation |
| 01/28/2004 | CN1471727A Etching of high aspect ratio features in a substrate |
| 01/28/2004 | CN1471726A Polishing device and method of manufacturing semiconductor device |
| 01/28/2004 | CN1471725A Polishing progress monitoring method and device thereof, polishing device, semiconductor device production method, and semiconductor device |
| 01/28/2004 | CN1471724A Integration of high voltage self-aligned MOS components |
| 01/28/2004 | CN1471712A Non-volatile passive matrix and method for read out of the same |
| 01/28/2004 | CN1471631A Temperature measuring method, heat treating device and method, computer program, and radiation thermometer |
| 01/28/2004 | CN1471565A Energy-beam curable thermal-releasable pressure-sensitive adhesive sheet and method for producing cut pieces using the same |
| 01/28/2004 | CN1471353A Printed circuit board its manufacturing method and semiconductor device |