Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/30/2013EP2656390A2 Uniaxially strained quantum well device and method of making same
10/30/2013EP2656389A1 Selective germanium p-contact metalization through trench
10/30/2013EP2656388A2 Trap rich layer for semiconductor devices
10/30/2013EP2656383A1 Simultaneous wafer bonding and interconnect joining
10/30/2013EP2656382A2 Process margin engineering in charge trapping field effect transistors
10/30/2013EP2656381A2 Edge rounded field effect transistors and methods of manufacturing
10/30/2013EP2656380A2 Improving toughness of polycrystalline diamond by incorporation of bulk metal foils
10/30/2013EP2656379A1 Group-iii-nitride based layer structure and semiconductor device
10/30/2013EP2656378A1 Accommodating device for retaining wafers
10/30/2013EP2656064A1 Dissolved nitrogen concentration monitoring method, substrate cleaning method, and substrate cleaning apparatus
10/30/2013EP2656056A1 Single-position hall effect measurements
10/30/2013EP2655701A1 A method for providing an ecpr master electrode
10/30/2013EP2655700A1 An ecpr master electrode and a method for providing such ecpr master electrode
10/30/2013EP2655699A1 An ecpr master electrode, and a method for providing such master electrode
10/30/2013EP2655687A1 Retaining device for substrates and method for coating a substrate
10/30/2013EP2655685A1 Method and device for depositing silicon on a substrate
10/30/2013EP2655536A2 Photocurable dicing die bonding tape
10/30/2013EP2655068A1 Printing table assembly, method for operating a printing table assembly
10/30/2013CN203260626U Novel automation complete equipment for LED module group packaging
10/30/2013CN203260581U Low-cost non-volatile memory with single polycrystalline architecture
10/30/2013CN203260562U LED suction nozzle modularized device
10/30/2013CN203260561U Substrate adsorption apparatus
10/30/2013CN203260560U Ejection fixture for image sensors
10/30/2013CN203260559U Transportation basket of solar energy silicon wafers
10/30/2013CN203260558U Device used for wet chemistry process
10/30/2013CN203260557U Encapsulation mold with high pressures on both sides
10/30/2013CN203260556U Cavity plate for package moulds
10/30/2013CN203260555U Switching device and etching device
10/30/2013CN203260551U Dry etching device
10/30/2013CN203254606U DIP (dual-in-line package) lead frame plastic package mold
10/30/2013CN203253420U Quantitative material addition apparatus, treatment station and treatment equipment
10/30/2013CN103380495A Pressure contact type semiconductor device and method for fabricating same
10/30/2013CN103380494A Ion-assisted plasma treatment of a three-dimensional structure
10/30/2013CN103380493A Apparatus and method for handling a substrate
10/30/2013CN103380492A Electronic-component-mounting structure
10/30/2013CN103380491A Manufacturing method for adhered material, manufacturing method for substrate having adhesive pattern, and substrate having adhesive pattern
10/30/2013CN103380490A Thin-film transistor device and method for manufacturing same, organic electroluminescent display element, and organic electroluminescent display device
10/30/2013CN103380489A Process margin engineering in charge trapping field effect transistors
10/30/2013CN103380488A Edge rounded field effect transistors and methods of manufacturing
10/30/2013CN103380487A Method for forming insulating film
10/30/2013CN103380486A Vaporizer
10/30/2013CN103380485A Remotely-excited fluorine and water vapor etch
10/30/2013CN103380484A Self-aligned NAND flash select-gate wordlines for spacer double patterning
10/30/2013CN103380483A Substrate processing device
10/30/2013CN103380482A Monocrystalline substrate production method and monocrystalline member with modified layer formed therein
10/30/2013CN103380481A Making semiconductor bodies from molten material using a free-standing interposer sheet
10/30/2013CN103380480A Low-temperature selective epitaxial growth of silicon for device integration
10/30/2013CN103380400A Positive-acting photosensitive composition and hardened material thereof
10/30/2013CN103380368A Single-position hall effect measurements
10/30/2013CN103380188A Thermally conductive adhesive
10/30/2013CN103379736A System-in-package assembly, printed circuit board assembly and manufacturing method thereof
10/30/2013CN103379735A Semiconductor device and method of manufacturing the same
10/30/2013CN103378239A Epitaxial structure body
10/30/2013CN103378237A Epitaxial structure
10/30/2013CN103378223A Preparation method of epitaxial structure body
10/30/2013CN103378222A Method for manufacturing graphere layer by laser
10/30/2013CN103378178A Schottky semiconductor device with groove structures and preparation method thereof
10/30/2013CN103378177A Schottky semiconductor device with grooves and preparation method thereof
10/30/2013CN103378176A Schottky semiconductor device with charge compensation and manufacturing method thereof
10/30/2013CN103378175A Charge compensation Schottky semiconductor device and preparation method thereof
10/30/2013CN103378174A Schottky semiconductor device with charge compensation and preparation method thereof
10/30/2013CN103378173A Schottky semiconductor device with charge compensation and manufacturing method thereof
10/30/2013CN103378172A Schottky semiconductor device and method for preparing same
10/30/2013CN103378171A Groove Schottky semiconductor device and preparation method thereof
10/30/2013CN103378170A Schottky semiconductor device with super junction and preparation method thereof
10/30/2013CN103378167A Semiconductor devices and methods for fabricating the same
10/30/2013CN103378162A Thin-film transistor and producing method thereof
10/30/2013CN103378161A Field effect transistor and method of fabricating the same
10/30/2013CN103378160A Device structures compatible with fin-type field-effect transistor technologies
10/30/2013CN103378159A Transistor arrangement with a mosfet and manufacture method thereof
10/30/2013CN103378157A Semiconductor device channel system and method
10/30/2013CN103378156A Multi-gate devices with replaced-channels and methods for forming the same
10/30/2013CN103378155A Dummy finfet structure and method of making same
10/30/2013CN103378153A Structure and method for finfet integrated with capacitor
10/30/2013CN103378152A Fin type field-effect tube and forming method thereof
10/30/2013CN103378151A Silicon germanium structure for reducing load effect and forming method thereof
10/30/2013CN103378150A Semiconductor device and method for manufacturing same
10/30/2013CN103378149A Mosfet及其制造方法 Mosfet and manufacturing method
10/30/2013CN103378148A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/30/2013CN103378146A Groove-type metal oxide semiconductor field-effect transistor and production method thereof
10/30/2013CN103378145A High-voltage component and manufacturing method thereof
10/30/2013CN103378142A Power device and fabricating method thereof
10/30/2013CN103378141A 绝缘栅双极型晶体管及其制作方法 Insulated gate bipolar transistor and manufacturing method thereof
10/30/2013CN103378139A 半导体结构及其制作方法 Semiconductor structure and fabrication method
10/30/2013CN103378138A 双极晶体管及其制作方法 Bipolar transistor and manufacturing method thereof
10/30/2013CN103378137A Gate electrodes with notches and methods for forming the same
10/30/2013CN103378136A Structure and method for NFET with high k metal gate
10/30/2013CN103378134A Gate structure and forming method thereof, semiconductor structure and forming method thereof
10/30/2013CN103378133A 肖特基位障二极管及其制造方法 The method of manufacturing a Schottky diode barrier bits
10/30/2013CN103378132A Strained structure of semiconductor device and method of making the strained structure
10/30/2013CN103378131A Charge compensation Schottky semiconductor device and manufacturing method thereof
10/30/2013CN103378130A Semiconductor structure and manufacturing process thereof
10/30/2013CN103378129A Semiconductor structure and manufacturing method thereof
10/30/2013CN103378128A Passivation layer structure, and forming method and etching method thereof
10/30/2013CN103378126A 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
10/30/2013CN103378119A Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
10/30/2013CN103378110A Dual profile shallow trench isolation apparatus and system
10/30/2013CN103378105A Non-volatile memory (nvm) and method for manufacturing thereof
10/30/2013CN103378104A Semiconductor device and method of manufacturing the same
10/30/2013CN103378103A Nonvolatile memory and manufacturing method thereof
1 ... 440 441 442 443 444 445 446 447 448 449 450 451 452 453 454 455 456 457 458 459 460 ... 6590