Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/30/2013CN103378102A 半导体结构及其制作方法 Semiconductor structure and fabrication method
10/30/2013CN103378101A Semiconductor device and method of manufacturing the same
10/30/2013CN103378100A Semiconductor device comprising ferroelectric elements and fast high-k metal gate transistors
10/30/2013CN103378099A Device and methods for high-k and metal gate stacks
10/30/2013CN103378098A Integrated circuit devices including stress proximity effects and methods of fabricating the same
10/30/2013CN103378095A Metal oxide semiconductor electrical parameter testing device and method of manufacture
10/30/2013CN103378094A Capacitor for interposers and methods of manufacture thereof
10/30/2013CN103378093A Schottky diode with opposite-polarity schottky diode field guard ring
10/30/2013CN103378087A Electrostatic discharge protection structure and manufacturing method thereof
10/30/2013CN103378075A Semiconductor memory modules and methods of fabricating the same
10/30/2013CN103378073A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
10/30/2013CN103378069A Method for stabilizing embedded silicon
10/30/2013CN103378068A Circuit module and method of manufacturing the same
10/30/2013CN103378067A Wafer assembly with carrier wafer
10/30/2013CN103378065A Semiconductor device and method for fabricating the same
10/30/2013CN103378064A Metal interconnection structure and manufacturing method thereof
10/30/2013CN103378062A Software and method for via spacing in a semiconductor device
10/30/2013CN103378061A Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
10/30/2013CN103378060A Through silicon via and filling method thereof
10/30/2013CN103378059A Through silicon via and forming method thereof
10/30/2013CN103378058A Semiconductor chip and method for forming same
10/30/2013CN103378057A Semiconductor chip and method for forming same
10/30/2013CN103378054A Semiconductor device with self-aligned interconnects
10/30/2013CN103378053A Semiconductor device with self-aligned interconnects and blocking portions
10/30/2013CN103378052A Semiconductor devices, methods of manufacture thereof, and methods of forming conductive features
10/30/2013CN103378050A Electronic assemblies and methods of fabricating electronic assemblies
10/30/2013CN103378049A Strain reduced structure for IC packaging
10/30/2013CN103378046A Chip assembling structure and chip assembling method
10/30/2013CN103378045A Lead frame, semiconductor package, and manufacturing method of the same
10/30/2013CN103378044A Chip assembly structure and chip assembly method
10/30/2013CN103378043A Chip assembly structure and chip assembly method
10/30/2013CN103378041A Methods and apparatus for bump-on-trace chip packaging
10/30/2013CN103378040A Semiconductor device packages and methods
10/30/2013CN103378039A Stud bump structure for semiconductor package assemblies
10/30/2013CN103378037A Methods and apparatus for solder connections
10/30/2013CN103378036A Semiconductor devices and methods of manufacturing and using thereof
10/30/2013CN103378035A Pressure contact arrangement and method for producing a pressure contact arrangement
10/30/2013CN103378033A Through-substrate vias and methods for forming the same
10/30/2013CN103378032A Semiconductor chip and method for forming same
10/30/2013CN103378031A Semiconductor chip, packaging structure and method for forming same
10/30/2013CN103378028A Semiconductor structure with stress protection structure and forming method of semiconductor structure
10/30/2013CN103378024A Heat dissipation device and method for manufacturing the same
10/30/2013CN103378022A 散热片及其制造方法 Heat sink and a manufacturing method
10/30/2013CN103378021A Power module with directly attached thermally conductive structures
10/30/2013CN103378019A Semiconductor packages with heat dissipation structures and related methods
10/30/2013CN103378017A High density 3D package
10/30/2013CN103378016A Chip assembling structure, chip assembling method and optical fiber coupling module
10/30/2013CN103378015A Semiconductor chip, packaging structure and method for forming same
10/30/2013CN103378014A Package carrier and manufacturing method thereof
10/30/2013CN103378011A Optoelectronic package and method for making same
10/30/2013CN103378010A Diode-triggered silicon controlled rectifier with an integrated diode
10/30/2013CN103378009A Method for manufacturing metal oxide semiconductor memory
10/30/2013CN103378008A Bimetallic grid CMOS device and manufacturing method thereof
10/30/2013CN103378007A Method for manufacturing semiconductor component
10/30/2013CN103378006A Method for forming stress layer in stress memorization technique
10/30/2013CN103378005A Method for manufacturing fin-shaped structures of multi-gate field effect transistor
10/30/2013CN103378004A Manufacturing method of CMOS device with stress covering layer
10/30/2013CN103378003A Method for manufacturing CMOS device by means of stress memorization technique
10/30/2013CN103378002A Integrated circuits having protruding source and drain regions and methods for forming integrated circuits
10/30/2013CN103378001A Forming method of patterned graphene
10/30/2013CN103378000A Method for manufacturing display panel of organic light emitting diode
10/30/2013CN103377999A 3d integrated circuit system with connecting via structure and method for forming the same
10/30/2013CN103377998A Methods and apparatus for via last through-vias
10/30/2013CN103377997A Method for forming buried conductive line and structure of buried conductive line
10/30/2013CN103377996A Method for forming double mosaic structures
10/30/2013CN103377995A Semiconductor chip, semiconductor encapsulation structure and forming method thereof
10/30/2013CN103377994A Method for manufacturing through silicon hole
10/30/2013CN103377993A Method for forming hole
10/30/2013CN103377992A Silicon through hole structure and method for manufacturing same
10/30/2013CN103377991A Methods of forming groove
10/30/2013CN103377990A Through-silicon-via structure
10/30/2013CN103377989A Method of making damascene structure
10/30/2013CN103377988A Method for preventing copper diffusion
10/30/2013CN103377987A Forming method and processing method of semiconductor structure
10/30/2013CN103377986A Method for manufacturing contact hole
10/30/2013CN103377985A Method for manufacturing contact hole
10/30/2013CN103377984A Manufacturing process method for TSV backside conduction
10/30/2013CN103377983A SOI Wafer, manufacturing method therefor, and MEMS device
10/30/2013CN103377982A Semiconductor device and method of manufacturing the same
10/30/2013CN103377981A Shallow groove segregation structure and forming method thereof
10/30/2013CN103377980A 浅沟槽隔离结构及其形成方法 Shallow trench isolation structure and method of forming
10/30/2013CN103377979A Adjustment plate and apparatus for treating substrate having the same
10/30/2013CN103377978A Tray for wafer treatment apparatus
10/30/2013CN103377977A Method of dicing substrate
10/30/2013CN103377976A Tape holding mechanism, sheet peeling apparatus, and sheet peeling method
10/30/2013CN103377975A Solar cell string layup system and method
10/30/2013CN103377974A Grain peeling, picking and placing method and apparatus thereof
10/30/2013CN103377973A Robot for transmitting substrate, multi-chamber substrate processing apparatus employing the robot and control method for the apparatus
10/30/2013CN103377972A Substrate processing apparatus and method of supplying processing solution
10/30/2013CN103377971A Apparatus and method for cleaning substrates
10/30/2013CN103377970A Substrate processing apparatus
10/30/2013CN103377969A Sheet adhibiting system and sheet adhibiting method
10/30/2013CN103377968A Processing chamber allocation setting device and processing chamber allocation setting program
10/30/2013CN103377967A Handling system for semiconductor elements
10/30/2013CN103377966A Substrate transfer device and substrate transfer method
10/30/2013CN103377965A Substrate storage device
10/30/2013CN103377964A Assembly device for packaging semiconductor
10/30/2013CN103377963A Tool induced shift reduction determination for overlay metrology
10/30/2013CN103377962A Method and system for testing low-voltage differential signals
10/30/2013CN103377961A Testing and manufacturing methods of three-dimensional stacking type random access memory and testing method of wafer
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