Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2013
10/30/2013CN103377960A 晶圆缺陷检测方法 Wafer defect detection method
10/30/2013CN103377959A Methods of adjusting ultrasonic bonding energy on wire bonding machines
10/30/2013CN103377958A Thermal compression bonding of semiconductor chips
10/30/2013CN103377957A Chip package and method of forming the same
10/30/2013CN103377956A Package structure and substrate bonding method
10/30/2013CN103377955A Package on package structures and methods for forming the same
10/30/2013CN103377954A Forming method for grid bonding pad and source bonding pad
10/30/2013CN103377953A Method for forming single sided buried strap
10/30/2013CN103377952A Fixation method for bonding wires
10/30/2013CN103377951A Manufacturing method for semiconductor device and semiconductor device
10/30/2013CN103377950A Substrate and method of producing substrate for at least one power semiconductor component
10/30/2013CN103377949A Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
10/30/2013CN103377948A Semiconductor device manufacturing method
10/30/2013CN103377947A Semiconductor structure and manufacturing method thereof
10/30/2013CN103377946A Semiconductor structure and manufacturing method thereof
10/30/2013CN103377945A Forming method of MOS transistor
10/30/2013CN103377944A Semiconductor device manufacturing method
10/30/2013CN103377943A Semiconductor device manufacturing method
10/30/2013CN103377942A Forming method of semiconductor structure and forming method of transistor
10/30/2013CN103377941A PMOS transistor and forming method
10/30/2013CN103377940A P-type transmission grid electrode transistor for SRAM and manufacture method thereof
10/30/2013CN103377939A Trench type power semiconductor structure manufacturing method
10/30/2013CN103377938A Method for forming semiconductor device
10/30/2013CN103377937A Forming method of semiconductor structures and forming method of transistors
10/30/2013CN103377936A Method for manufacturing semiconductor device
10/30/2013CN103377935A Manufacturing method of MOS transistors
10/30/2013CN103377934A Method for manufacturing semiconductor device structure
10/30/2013CN103377933A Manufacturing method of MOS transistors
10/30/2013CN103377932A Pmos晶体管及其制造方法 Pmos transistor and its manufacturing method
10/30/2013CN103377931A Semiconductor structure and manufacturing method thereof
10/30/2013CN103377930A Semiconductor structure and manufacturing method thereof
10/30/2013CN103377929A Perpendicular double-diffusion metal oxide semiconductor transistor and manufacturing method thereof
10/30/2013CN103377928A Forming method of semiconductor structure, and forming method of transistor
10/30/2013CN103377927A 悬浮纳米线场效应晶体管及其形成方法 Suspended nanowire field effect transistor and method of forming
10/30/2013CN103377926A Manufacturing method for normally-off gallium nitride field effect transistor
10/30/2013CN103377925A Semiconductor structure and manufacture method thereof
10/30/2013CN103377924A Semiconductor structure and manufacturing method thereof
10/30/2013CN103377923A MOS transistor and forming method
10/30/2013CN103377922A Fin type field effect transistor and forming method thereof
10/30/2013CN103377921A Method for manufacturing normally open type GaN (gallium nitride) field effect transistor
10/30/2013CN103377920A Insulated gate bipolar transistor and manufacturing method thereof
10/30/2013CN103377919A 绝缘栅双极晶体管及其制作方法 Insulated gate bipolar transistor and manufacturing method thereof
10/30/2013CN103377918A Npn异质结双极晶体管及其制造方法 Npn heterojunction bipolar transistor and its manufacturing method
10/30/2013CN103377917A Deep groove insulated gate bipolar transistor and manufacturing method thereof
10/30/2013CN103377916A Method for manufacturing semiconductor device
10/30/2013CN103377915A Method of fabricating gallium nitride semiconductor, method of fabricating group iii nitride semiconductor device, and group iii nitride semiconductor device
10/30/2013CN103377914A Improved structure of copper metal on back of semiconductor component and processing method thereof
10/30/2013CN103377913A Method of forming opening
10/30/2013CN103377912A Shallow trench isolation chemical-mechanical planarization method
10/30/2013CN103377911A Method for improving CMP (chemical mechanical planarization) uniformity
10/30/2013CN103377910A Method for etching semiconductor device
10/30/2013CN103377909A Apparatus and method for the singulation of a semiconductor wafer
10/30/2013CN103377908A LED chip miter cutting method, LED luminous element and LED lighting device
10/30/2013CN103377907A Method for manufacturing grid polycrystalline silicon of deep groove device
10/30/2013CN103377906A Preparation method of silicon oxynitride thin film
10/30/2013CN103377905A Methods of fabricating semiconductor devices having buried channel array
10/30/2013CN103377904A Method for etching back polycrystalline silicon groove
10/30/2013CN103377903A Method for forming grate trench of deep trench type super junction with trench grates
10/30/2013CN103377902A Method for generating oxide layer by wafer thermal oxidation
10/30/2013CN103377901A Polysilicon grid forming method
10/30/2013CN103377900A Preparation method of metal silicide layer
10/30/2013CN103377899A Metal grid electrode manufacturing method and CMOS manufacturing method
10/30/2013CN103377898A Methods for forming semiconductor device and fin type field effect tube
10/30/2013CN103377897A Forming method of silicon-germanium source / drain structure
10/30/2013CN103377896A Method for manufacturing high-k metal-gate device
10/30/2013CN103377895A Manufacturing method of MOSFET
10/30/2013CN103377894A Metal silicide manufacturing method
10/30/2013CN103377893A Gate oxide layer implementation process for DDMOS steps
10/30/2013CN103377892A Manufacturing method of semiconductor device
10/30/2013CN103377891A Laser crystallization apparatus and method for manufacturing thin film transistor array panel using the same
10/30/2013CN103377890A Methods for fabricating and orienting semiconductor wafers
10/30/2013CN103377889A Formation method of doped contour
10/30/2013CN103377888A Method of making doped region
10/30/2013CN103377887A 场效应晶体管及其制作方法 Field effect transistor and manufacturing method thereof
10/30/2013CN103377886A Hard mask layer structure, manufacturing method thereof and manufacturing method of semiconductor device
10/30/2013CN103377885A Method for forming opening
10/30/2013CN103377884A 硬掩膜层结构及低k介质层刻蚀方法 Hard mask layer structure and method for etching a low-k dielectric layer
10/30/2013CN103377883A Layout of a MOS Array Edge with Density Gradient Smoothing
10/30/2013CN103377882A Substrate processing apparatus and substrate processing method
10/30/2013CN103377881A Method for producing a conductor line
10/30/2013CN103377880A Coil and method of manufacturing a coil
10/30/2013CN103377879A Temperature-controlled depth of release layer
10/30/2013CN103377878A Manufacture method of roughened silicon substrate, process device thereof and manufacture method of solar cell element
10/30/2013CN103377877A Method for cleaning semiconductor device
10/30/2013CN103377876A Preparation method of epitaxial structure body
10/30/2013CN103377875A Method for manufacturing capacitor
10/30/2013CN103377874A Method for manufacturing hafnium silicate nitrogen oxide
10/30/2013CN103377868A Lower electrode apparatus in etching electrode machine
10/30/2013CN103376668A Metal light cover
10/30/2013CN103376608A Liquid crystal display device and method for manufacturing the same
10/30/2013CN103375588A Sealring member and apparatus for processing substrate using the same
10/30/2013CN103373712A Sulfur phase transition compound, semiconductor substrate product, as well as preparation method and application of semiconductor substrate product
10/30/2013CN103372721A Laser processor and laser processing method
10/30/2013CN103372519A Paste applying apparatus, paste applying method, and die bonder
10/30/2013CN102549498B Photosensitive resin composition for resist material, and photosensitive resin laminate
10/30/2013CN102543801B Die bonder
10/30/2013CN102533123B Chemi-mechanical polishing fluid for polishing semiconductor wafer
10/30/2013CN102509754B Dispensing arm structure for die bonder
10/30/2013CN102456083B 工艺数据分析方法和系统 Process data analysis methods and systems
10/30/2013CN102445711B THz-wave detector
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