Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/08/2004US20040065936 Transistor structures including separate anti-punchthrough layers and methods of forming same
04/08/2004US20040065935 Power devices and methods for manufacturing the same
04/08/2004US20040065933 Flip chip optical and imaging sensor device
04/08/2004US20040065931 Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
04/08/2004US20040065930 Dual metal gate process: metals and their silicides
04/08/2004US20040065929 Organic gate insulating film and organic thin film transistor using the same
04/08/2004US20040065928 UV-programmed P-type mask ROM and fabrication thereof
04/08/2004US20040065927 TFT-based common gate CMOS inverters, and computer systems utilizing novel CMOS inverters
04/08/2004US20040065926 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device
04/08/2004US20040065925 Semiconductor constructions comprising three-dimensional thin film transistor devices and resistors; and processes of forming stacked resistor constructions
04/08/2004US20040065924 Ldd structure of thin film transistor and process for producing same
04/08/2004US20040065923 Bi-directional silicon controlled rectifier for electrostatic discharge protection
04/08/2004US20040065918 Nonvolatile memory device
04/08/2004US20040065917 Flash memory cells with separated self-aligned select and erase gates, and process of fabrication
04/08/2004US20040065916 Non-volatile semiconductor memory devices and methods for manufacturing the same
04/08/2004US20040065915 Semiconductor device having a built-in contact-type sensor and manufacturing method of such a semiconductor device
04/08/2004US20040065914 Semiconductor device and method of fabricating the same
04/08/2004US20040065913 Memory device
04/08/2004US20040065908 Image sensor
04/08/2004US20040065907 Narrow wire; reducing contactor defects ; using automatic layout tools
04/08/2004US20040065906 Semiconductor integrated circuit device
04/08/2004US20040065903 Integrated circuit with MOSFETS having bi-layer metal gate electordes and method of making same
04/08/2004US20040065902 Electro-optical device and electronic device
04/08/2004US20040065901 Semiconductor device
04/08/2004US20040065900 Semiconductor device and manufacturing the same
04/08/2004US20040065899 Semiconductor device
04/08/2004US20040065892 Methods and devices related to electrode pads for p-type group III nitride compound semiconductors
04/08/2004US20040065889 Semiconductor wafer, semiconductor device, and methods for fabricating the same
04/08/2004US20040065885 Semiconductor thin film and its manufacturing method and semiconductor device and its manufacturing method
04/08/2004US20040065884 High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters
04/08/2004US20040065883 Semiconductor device and manufacturing method thereof
04/08/2004US20040065882 Semiconductor device and process for production thereof
04/08/2004US20040065881 Ceramic substrate for semiconductor production and inspection
04/08/2004US20040065879 Process via mismatch detecting device
04/08/2004US20040065878 Semiconductor device
04/08/2004US20040065875 Semiconductor device
04/08/2004US20040065864 Mixture of colloidal silica abrasive and halide compound; shallow channel isolation
04/08/2004US20040065851 Cutting device
04/08/2004US20040065848 Electron beam lithography system and method therefor
04/08/2004US20040065847 Lithographic apparatus and device manufacturing method
04/08/2004US20040065843 Emitter device with focusing columns
04/08/2004US20040065827 Method for the electron-microscopic observation of a semiconductor arrangement and apparatus therefor
04/08/2004US20040065826 System for imaging a cross-section of a substrate
04/08/2004US20040065825 Pattern width measuring apparatus, pattern width measuring method, and electron beam exposure apparatus
04/08/2004US20040065817 Collector having unused region for illumination systems using a wavelength less than or equal to 193 nm
04/08/2004US20040065720 Apparatus and method to prevent oxidation of electronic devices
04/08/2004US20040065719 Bondhead lead clamp apparatus and method
04/08/2004US20040065677 Air supply apparatus for semiconductor device fabricating equipment
04/08/2004US20040065657 Black reflector plate
04/08/2004US20040065656 Heated substrate support
04/08/2004US20040065647 Die bonder
04/08/2004US20040065645 Temperature controlled dome-coil system for high power inductively coupled plasma systems
04/08/2004US20040065643 Laser irradiation apparatus and method of manufacturing semiconductor device
04/08/2004US20040065555 Conformable contact masking methods and apparatus utilizing in situ cathodic activation of a substrate
04/08/2004US20040065554 Multilayer three-dimensional structure; barrier layer prevent damage due to copper diffusion
04/08/2004US20040065553 Contacting substrate with masking structure; multilayer, three-dimensional structure ; cycles; etching to remove residues
04/08/2004US20040065552 Method for electrochemical fabrication
04/08/2004US20040065547 Real-time component monitoring and replenishment system for multicomponent fluids
04/08/2004US20040065543 Insoluble electrode for electrochemical operations on substrates
04/08/2004US20040065540 Liquid treatment using thin liquid layer
04/08/2004US20040065468 Composite noble metal wire
04/08/2004US20040065462 High frequency module
04/08/2004US20040065432 High performance thermal stack for electrical components
04/08/2004US20040065413 Cassette for preventing breakage of glass substrate
04/08/2004US20040065412 Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
04/08/2004US20040065401 Method to produce pedestal features in constrained sintered substrates
04/08/2004US20040065363 Insertion of surfactant; low pressure desorption; solar cells
04/08/2004US20040065358 Treatment device for wafers
04/08/2004US20040065354 Apparatus and method for substrate processing
04/08/2004US20040065352 Cup with cleaning liquid; nozzle; prevent splashing
04/08/2004US20040065345 Method for cleaning substrate
04/08/2004US20040065344 Processing apparatus and cleaning method
04/08/2004US20040065261 Truncated dummy plate for process furnace
04/08/2004US20040065260 Heating element CVD system and connection structure between heating element and electric power supply mechanism in the heating element CVD system
04/08/2004US20040065259 Susceptor device
04/08/2004US20040065258 Atomic layer deposition methods and atomic layer deposition tools
04/08/2004US20040065253 Method of growing oxide thin films
04/08/2004US20040065251 Liquid phase growth method for silicon crystal, manufacturing method for solar cell and liquid phase growth apparatus for silicon crystal
04/08/2004US20040065250 Epitaxial silicon wafer
04/08/2004US20040065022 Slurry containing mixture of cerium compound and hydroxide; forming shallow channels in semiconductors
04/08/2004US20040065020 Polishing semiconductors using aqueous solution of polymer; smoothness thin films
04/08/2004US20040064965 Wafer dryer system for PRS wet bench
04/08/2004US20040064916 Buffering structure for wheels
04/08/2004DE20319104U1 Anordnung zur Wärmebehandlung von Siliziumscheiben in einer Prozesskammer Arrangement for heat treatment of silicon wafers in a process chamber
04/08/2004DE19839063B4 Flüssigkristallanzeigevorrichtung und Herstellungsverfahren dafür A liquid crystal display device and production method thereof
04/08/2004DE19641857B4 Schaltung zur Erzeugung bestimmter Betriebskennwerte einer Halbleitereinrichtung Circuit for production of certain operating characteristics of a semiconductor device
04/08/2004DE19625240B4 Halbleitervorrichtung Semiconductor device
04/08/2004DE19615179B4 Verfahren zur Herstellung lichtemittierender Halbleiterbauelemente mit verbesserter Stabilität A method for manufacturing light emitting semiconductor devices with improved stability
04/08/2004DE10338087A1 Production of an electronic switching arrangement for vehicles, comprises applying a switching structure to a base, connecting wires to the base, electrically connecting the wires with the switching structure, and further processing
04/08/2004DE10338021A1 Vertikaler NROM und Verfahren zu dessen Herstellung Vertical NROM and process for its preparation
04/08/2004DE10334415A1 Diode used as a pn-barrier layer diode comprises a semiconductor substrate, strip diffusion regions, first electrodes connected to the diffusion regions, and a second electrode
04/08/2004DE10245928A1 Process for the structured selective metallization of a surface of a substrate comprises preheating the substrate to a temperature below the deposition temperature of a predetermined metal and depositing the metal in predetermined regions
04/08/2004DE10245671A1 Production of a semiconductor structure comprises preparing a semiconductor substrate, forming a silicon nitride layer on the substrate, forming a silicon dioxide layer on the silicon nitride layer, and etching the silicon dioxide layer
04/08/2004DE10245553A1 Process for the gas phase deposition of components contained in a process gas flowing along a main flow direction used in the manufacture of transistors or capacitors comprises changing the main flow direction once during the process
04/08/2004DE10245534A1 Teststruktur zum Bestimmen eines Bereiches einer Deep-Trench-Ausdiffusion in einem Speicherzellenfeld Test structure for determining a region of a deep trench outdiffusion in a memory cell array
04/08/2004DE10245533A1 Teststruktur zum Bestimmen eines Dotierbereiches eines Elektrodenanschlusses zwischen einem Grabenkondensator und einem Auswahltransistor in einem Speicherzellenfeld Test structure for determining a doping region of the electrode terminal between a grave capacitor and a select transistor in a memory cell array
04/08/2004DE10245091A1 Production of a semiconductor component structure used as a diode or MOSFET comprises preparing a semiconductor body, forming a doped trenched semiconductor zone in the semiconductor body, and removing the semiconductor body
04/08/2004DE10245090A1 Production of a semiconductor component used as a MOSFET comprises preparing a channel zone layer, forming a recess in the first channel zone layer, filling the recess with a recombination zone, and applying a further channel zone layer
04/08/2004DE10245089A1 Doping process used in the production of a transistor, IGBT, thyristor or diode comprises preparing a semiconductor body, producing crystal defects in the body, introducing hydrogen ions into the body, and heat treating
04/08/2004DE10245052A1 Elektronenstrahlquelle und elektronenoptischer Apparat mit einer solchen Electron beam source and electron-optical apparatus with such a