| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/13/2004 | US6720621 SOI semiconductor device with resistor body |
| 04/13/2004 | US6720620 Material and method for manufacturing semiconductor on insulator substrates and devices |
| 04/13/2004 | US6720619 Semiconductor-on-insulator chip incorporating partially-depleted, fully-depleted, and multiple-gate devices |
| 04/13/2004 | US6720618 Power MOSFET device |
| 04/13/2004 | US6720617 Thin film field effect transistor |
| 04/13/2004 | US6720613 Method of fabricating multi-bit flash memory |
| 04/13/2004 | US6720612 Semiconductor device |
| 04/13/2004 | US6720611 Fabrication method for flash memory |
| 04/13/2004 | US6720610 Nonvolatile semiconductor memory device and its manufacturing method |
| 04/13/2004 | US6720609 Structure for reducing contact aspect ratios |
| 04/13/2004 | US6720608 Metal-insulator-metal capacitor structure |
| 04/13/2004 | US6720607 Method for improving the resistance degradation of thin film capacitors |
| 04/13/2004 | US6720606 Dynamic semiconductor memory device having a trench capacitor |
| 04/13/2004 | US6720605 Aluminum-filled self-aligned trench for stacked capacitor structure and methods |
| 04/13/2004 | US6720604 Capacitor for an integrated circuit |
| 04/13/2004 | US6720603 Capacitor structure and a semiconductor device with a first metal layer, a second metal silicide layer formed over the first metal layer and a second metal layer formed over the second metal silicide layer |
| 04/13/2004 | US6720602 Dynamic random access memory (DRAM) cell with folded bitline vertical transistor and method of producing the same |
| 04/13/2004 | US6720601 Even with nitride film sidewall |
| 04/13/2004 | US6720600 Reduced alignment margin between contact hole and capacitor |
| 04/13/2004 | US6720599 Ferroelectric memory and electronic apparatus |
| 04/13/2004 | US6720598 Stacking; larger capacitors without increasing cell size |
| 04/13/2004 | US6720596 Semiconductor device and method for driving the same |
| 04/13/2004 | US6720593 Charge-coupled device having a reduced width for barrier sections in a transfer channel |
| 04/13/2004 | US6720591 Semiconductor integrated circuit device |
| 04/13/2004 | US6720590 C implants for improved SiGe bipolar yield |
| 04/13/2004 | US6720587 Structure evaluation method, method for manufacturing semiconductor devices, and recording medium |
| 04/13/2004 | US6720586 Method of fabricating nitride semiconductor, method of fabricating nitride semiconductor device, nitride semiconductor device, semiconductor light emitting device and method of fabricating the same |
| 04/13/2004 | US6720579 Semiconductor device and method of manufacturing the same |
| 04/13/2004 | US6720578 Polycrystalline silicon thin film for a thin film transistor and display device using the same |
| 04/13/2004 | US6720577 Semiconductor device and method of manufacturing the same |
| 04/13/2004 | US6720575 Semiconductor device with a semiconductor layer over a surface having a recess pitch no smaller than 0.3 microns |
| 04/13/2004 | US6720565 Real-time prediction of and correction of proximity resist heating in raster scan particle beam lithography |
| 04/13/2004 | US6720563 Ion implantation apparatus and ion implantation method |
| 04/13/2004 | US6720533 Maintaining uniform temperature between peripheral and central portions; using electrical resistance zones of varied spacings |
| 04/13/2004 | US6720531 Temperature uniformity during chemical vapor deposition |
| 04/13/2004 | US6720522 Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining |
| 04/13/2004 | US6720500 Plug-in type electronic control unit, structure of connection of wiring board with plug member, unit of connection of electronic part with wiring board, and process for mounting electronic part |
| 04/13/2004 | US6720276 Methods of forming spin on glass layers by curing remaining portions thereof |
| 04/13/2004 | US6720275 Methods of fabricating capacitors including Ta2O5 layers in a chamber including changing a Ta2O5 layer to heater separation or chamber pressure |
| 04/13/2004 | US6720274 Method for fabricating a semiconductor device and a substrate processing apparatus |
| 04/13/2004 | US6720273 Device and method for the high-frequency etching of a substrate using a plasma etching installation and device and method for igniting a plasma and for pulsing the plasma out put or adjusting the same upwards |
| 04/13/2004 | US6720272 Methods of forming capacitor constructions |
| 04/13/2004 | US6720271 Process for removing polymers during the fabrication of semiconductor devices |
| 04/13/2004 | US6720270 Method for reducing size of semiconductor unit in packaging process |
| 04/13/2004 | US6720269 Semiconductor device having a self-aligned contact structure and methods of forming the same |
| 04/13/2004 | US6720268 Method for anisotropic plasma etching of semiconductors |
| 04/13/2004 | US6720267 Method for forming a cantilever beam model micro-electromechanical system |
| 04/13/2004 | US6720266 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies |
| 04/13/2004 | US6720265 Composition compatible with aluminum planarization and methods therefore |
| 04/13/2004 | US6720264 Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties |
| 04/13/2004 | US6720263 Planarization of metal layers on a semiconductor wafer through non-contact de-plating and control with endpoint detection |
| 04/13/2004 | US6720262 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 04/13/2004 | US6720261 Method and system for eliminating extrusions in semiconductor vias |
| 04/13/2004 | US6720259 Passivation method for improved uniformity and repeatability for atomic layer deposition and chemical vapor deposition |
| 04/13/2004 | US6720258 Method of fabricating a nickel silicide on a substrate |
| 04/13/2004 | US6720257 Bump with basic metallization and method for manufacturing the basic metallization |
| 04/13/2004 | US6720256 Method of dual damascene patterning |
| 04/13/2004 | US6720255 Semiconductor device with silicon-carbon-oxygen dielectric having improved metal barrier adhesion and method of forming the device |
| 04/13/2004 | US6720253 Method of manufacturing semiconductor device having an aluminum wiring layer |
| 04/13/2004 | US6720252 Method of deep contact fill and planarization for dual damascene structures |
| 04/13/2004 | US6720251 Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing |
| 04/13/2004 | US6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper |
| 04/13/2004 | US6720249 Protective hardmask for producing interconnect structures |
| 04/13/2004 | US6720248 Method of forming metal interconnection layer in semiconductor device |
| 04/13/2004 | US6720247 Pre-pattern surface modification for low-k dielectrics using A H2 plasma |
| 04/13/2004 | US6720246 Flip chip assembly process for forming an underfill encapsulant |
| 04/13/2004 | US6720245 Method of fabrication and device for electromagnetic-shielding structures in a damascene-based interconnect scheme |
| 04/13/2004 | US6720244 Bump fabrication method |
| 04/13/2004 | US6720243 Bump fabrication method |
| 04/13/2004 | US6720242 Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer |
| 04/13/2004 | US6720241 Method for manufacturing semiconductor device |
| 04/13/2004 | US6720238 Method for manufacturing buried areas |
| 04/13/2004 | US6720237 Method for manufacturing a semiconductor film |
| 04/13/2004 | US6720235 Method of forming shallow trench isolation in a semiconductor substrate |
| 04/13/2004 | US6720234 Semiconductor integrated circuit device and method of manufacturing involving the scale-down width of shallow groove isolation using round processing |
| 04/13/2004 | US6720233 Process for producing trench insulation in a substrate |
| 04/13/2004 | US6720232 Method of fabricating an embedded DRAM for metal-insulator-metal (MIM) capacitor structure |
| 04/13/2004 | US6720231 Fin-type resistors |
| 04/13/2004 | US6720230 Method of fabricating integrated coil inductors for IC devices |
| 04/13/2004 | US6720227 Method of forming source/drain regions in a semiconductor device |
| 04/13/2004 | US6720226 Semiconductor device and method for facticating the same |
| 04/13/2004 | US6720225 Reactive pre-clean using reducing gas during nickel silicide process |
| 04/13/2004 | US6720224 Method for forming transistor of semiconductor device |
| 04/13/2004 | US6720223 Power |
| 04/13/2004 | US6720222 Method of manufacturing semiconductor device |
| 04/13/2004 | US6720221 Structure and method for dual gate oxide thicknesses |
| 04/13/2004 | US6720220 Method of fabricating semiconductor device |
| 04/13/2004 | US6720219 Split gate flash memory and formation method thereof |
| 04/13/2004 | US6720218 Method for manufacturing horizontal surrounding gate flash memory cell |
| 04/13/2004 | US6720217 Method of manufacturing flash memory device using trench device isolation process |
| 04/13/2004 | US6720216 Programmable memory address and decode circuits with vertical body transistors |
| 04/13/2004 | US6720215 Device and method for protecting against oxidation of a conductive layer in said device |
| 04/13/2004 | US6720214 Method for manufacturing semiconductor integrated circuit |
| 04/13/2004 | US6720213 Low-K gate spacers by fluorine implantation |
| 04/13/2004 | US6720212 Method of eliminating back-end rerouting in ball grid array packaging |
| 04/13/2004 | US6720211 Method for fabricating electric interconnections and interconnection substrate having electric interconnections fabricated by the same method |
| 04/13/2004 | US6720210 Mask ROM structure and manufacturing method thereof |
| 04/13/2004 | US6720209 Method for fabricating a circuit device |
| 04/13/2004 | US6720208 Semiconductor device |
| 04/13/2004 | US6720207 Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device |