Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/08/2004WO2004030046A1 Method of producing lithium tantalate substrate for surface acoustic wave element
04/08/2004WO2004030045A2 Semiconductor device processing
04/08/2004WO2004030041A2 High selectivity and high planarity dielectric polishing
04/08/2004WO2004030039A2 Apparatus and method of using thin film material as diffusion barrier for metallization
04/08/2004WO2004030038A2 Compositions substrate for removing etching residue and use thereof
04/08/2004WO2004030036A2 A modular bipolar-cmos-dmos analog integrated circuit and power transistor technology
04/08/2004WO2004030035A2 Via interconnect forming process and electronic component product thereof
04/08/2004WO2004030030A2 Taped lead frames and methods of making and using the same in semiconductor packaging
04/08/2004WO2004030029A2 Conducting polymer devices for inter-converting light and electricity
04/08/2004WO2004030028A2 Method for the production of an integrated semiconductor circuit
04/08/2004WO2004030014A2 Optical window deposition shield in a plasma processing system
04/08/2004WO2004030013A2 Baffle plate in a plasma processing system
04/08/2004WO2004030012A2 Improved bellows shield in a plasma processing system,and method of manufacture of such bellows shield
04/08/2004WO2004029994A2 Multilayer substrate
04/08/2004WO2004029985A1 Semiconductor storage device and mobile electronic device
04/08/2004WO2004029723A1 Photoresist remover composition
04/08/2004WO2004029606A1 Eddy current based measurement capabilities
04/08/2004WO2004029337A1 Nickel silicides formed by low-temperature annealing of compositionally modulated multilayers
04/08/2004WO2004029328A1 Method of electroless plating
04/08/2004WO2004028999A2 Thin films of oxidic materials having a high dielectric constant
04/08/2004WO2004028988A1 Mechanical scribe device
04/08/2004WO2004028952A2 Small scale wires with microelectromechanical devices
04/08/2004WO2004028816A1 Method and device for positioning electronic components
04/08/2004WO2004028745A1 Polishing pad for planarization
04/08/2004WO2004028744A1 Polishing pad with window for planarization
04/08/2004WO2004028743A1 Polishing apparatus, polishing head, and polishing method
04/08/2004WO2004028732A1 Connection method and connection device
04/08/2004WO2004023530A3 System of transporting and storing containers of semiconductor wafers and transfer mechanism
04/08/2004WO2004019383A3 Self-aligned contacts to gates
04/08/2004WO2004019077A9 Structures and methods for reducing retardance
04/08/2004WO2004018573A3 Method of coating a surface with an organic film
04/08/2004WO2004017387A3 Vision system
04/08/2004WO2004017385A3 Device for rapid heat treatment comprising inside the reaction chamber cold-walled halogen infrared lamps
04/08/2004WO2004013903A3 Wafer batch processing system and method
04/08/2004WO2004012229A3 Reduced volume, high conductance process chamber
04/08/2004WO2004012226A3 Method for making an anisotropic conductive polymer film on a semiconductor wafer
04/08/2004WO2004010494A3 Method for transferring an electrically active thin layer
04/08/2004WO2004010468A3 Low temperature ozone anneal of gate and capacitor dielectrics
04/08/2004WO2004009299A3 Loading and unloading device for a coating unit
04/08/2004WO2004008522A3 Method for producing a component having submerged connecting areas
04/08/2004WO2004008477A3 Heating jacket for plasma etching reactor, and etching method using same
04/08/2004WO2004006334A3 Set of integrated capacitor arrangements, especially integrated grid capacitors
04/08/2004WO2004005593A3 Metal nano-objects, formed on semiconductor surfaces, and method for making said nano-objects
04/08/2004WO2004004015A3 Soi field effect transistor element having a recombination region and method of forming same
04/08/2004WO2004001810A3 Coplanar integration of lattice-mismatched semiconductor with silicon via wafer boning virtual substrates
04/08/2004WO2003107421A3 Semi-conductor component
04/08/2004WO2003103042A3 Electronic component comprising external surface contacts and a method for producing the same
04/08/2004WO2003103031A3 Formation of lattice-tuning semiconductor substrates
04/08/2004WO2003102264A3 Method for depositing silicon nitride or silicon oxynitride, and corresponding product
04/08/2004WO2003100839A3 Method for epitaxial growth of a gallium nitride film separated from its substrate
04/08/2004WO2003100827A3 Organic semiconductor device and method
04/08/2004WO2003100446A3 High performance probe system for testing semiconductor wafers
04/08/2004WO2003099707A3 Method of altering the properties of a thin film and substrate implementing said method
04/08/2004WO2003098848B1 Method and apparatus for optimizing distributed multiplexed bus interconnects
04/08/2004WO2003094204A3 Short channel trench power mosfet with low threshold voltage
04/08/2004WO2003088313A3 Improved method for etching vias
04/08/2004WO2003087946A3 Imaging method
04/08/2004WO2003087431A3 Deposition methods utilizing phased array microwave excitation, and deposition apparatuses
04/08/2004WO2003086917B1 Substrate conveying device
04/08/2004WO2003085491A3 Derivatives having demand-based, adjustable returns, and trading exchange therefor
04/08/2004WO2003085454A3 Technique for writing with a raster scanned beam
04/08/2004WO2003077007A3 Objective lens consisting of crystal lenses
04/08/2004WO2003075368A3 Method and apparatus for induction heating of thin films
04/08/2004WO2003075049A3 Refractive projection objective
04/08/2004WO2003067647A3 Method and device for protecting electronic, optoelectronic and/or electromechanical microcomponents
04/08/2004WO2003065450A3 Integrated circuits with backside contacts and methods for their fabrication
04/08/2004WO2003054954A3 Electrical/optical integration scheme using direct copper bonding
04/08/2004WO2003054929A3 Method for depositing iii-v semiconductor layers on a non-iii-v substrate
04/08/2004WO2003053791B1 Apparatus and method for monitoring environment within a container
04/08/2004WO2003050725A3 Assertion handling for timing model extraction
04/08/2004WO2003027647A9 Method and apparatus for real-time dynamic chemical analysis
04/08/2004WO2003009366A9 Method for enhancing surface condition of a semiconductor wafer
04/08/2004WO2003009345A9 Integration of fault detection with run-to-run control
04/08/2004WO2003006396B1 Bonding method and product
04/08/2004WO2003003415A3 Method and apparatus for providing distributed material management and flow control in an integrated circuit factory
04/08/2004WO2002099909A8 Power mosfet having enhanced breakdown voltage
04/08/2004WO2002099889A9 Trench schottky rectifier
04/08/2004WO2002097868A3 Integrated circuit having an energy-absorbing structure
04/08/2004WO2002084708A3 Method of forming semiconductor compound film for fabrication of electronic device and film produced by same
04/08/2004WO2002064315A8 Polishing disk with end-point detection port
04/08/2004US20040068710 Method of fabricating a semiconductor device having a multilevel interconnections
04/08/2004US20040068703 Method of manufacturing circuit device
04/08/2004US20040068557 IP (Intellectual Property) generating system
04/08/2004US20040068347 Substrate handling system for aligning and orienting substrates during a transfer operation
04/08/2004US20040068082 Containing pyridine and thiophene moieties used as low dielectric insulating layers in electronics applications and articles
04/08/2004US20040067860 Cleaning compositions and methods of use thereof
04/08/2004US20040067718 Polishing apparatus
04/08/2004US20040067717 Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
04/08/2004US20040067661 Method for locally heating a region in a semiconductor substrate
04/08/2004US20040067660 Process for semiconductor device fabrication in which a insulating layer is formed on a semiconductor substrate
04/08/2004US20040067659 Method for fabricating crystalline-dielectric thin films and devices formed using same
04/08/2004US20040067658 Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant
04/08/2004US20040067657 Wet etchant composition and method for etching HfO2 and ZrO2
04/08/2004US20040067656 Method for forming bit line of semiconductor device
04/08/2004US20040067655 Method for forming patterns in a semiconductor device
04/08/2004US20040067654 Method of reducing wafer etching defect
04/08/2004US20040067653 Method of forming contact hole
04/08/2004US20040067652 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry
04/08/2004US20040067649 Silica and silica-based slurry
04/08/2004US20040067648 Crystal film, crystal substrate, and semiconductor device