| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/13/2004 | US6720206 Method for manufacturing digital micro-mirror device (DMD) packages |
| 04/13/2004 | US6720205 Electronic device and method of manufacturing the same, and electronic instrument |
| 04/13/2004 | US6720204 Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding |
| 04/13/2004 | US6720203 Flexible organic electronic device with improved resistance to oxygen and moisture degradation |
| 04/13/2004 | US6720200 Field effect transistor and fabrication process thereof |
| 04/13/2004 | US6720199 Method for manufacturing TFT array substrate of liquid crystal display device |
| 04/13/2004 | US6720196 Nitride-based semiconductor element and method of forming nitride-based semiconductor |
| 04/13/2004 | US6720195 Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture |
| 04/13/2004 | US6720194 Semiconductor characterization and production information system |
| 04/13/2004 | US6720133 Memory manufacturing process using disposable ARC for wordline formation |
| 04/13/2004 | US6720129 Maleimide-photoresist polymers containing fluorine and photoresist compositions comprising the same |
| 04/13/2004 | US6720117 Exposure mask with appended mask error data |
| 04/13/2004 | US6720116 Process flow and pellicle type for 157 nm mask making |
| 04/13/2004 | US6720115 Exposure method and exposure apparatus using near-field light and exposure mask |
| 04/13/2004 | US6720096 Dielectric element film comprising insulator film including oxide-based dielectric film and electrode including first conductor film containing at least one selected from nickel, cobalt and molybdenum silicon nitrides |
| 04/13/2004 | US6720083 Adhesive and semiconductor devices |
| 04/13/2004 | US6720037 Plasma processing method and apparatus |
| 04/13/2004 | US6720031 Preparing substrate placing substrate into chemical vapor deposition chamber; heating; introducing water flow in a carrier gas; stopping water flow; starting flow of copper precursor |
| 04/13/2004 | US6720027 Cyclical deposition of a variable content titanium silicon nitride layer |
| 04/13/2004 | US6719919 Composition of matter |
| 04/13/2004 | US6719918 Method of reducing notching during reactive ion etching |
| 04/13/2004 | US6719917 Method of ashing semiconductor device having metal interconnection |
| 04/13/2004 | US6719916 Multilayer microstructures and laser based method for precision and reduced damage patterning of such structures |
| 04/13/2004 | US6719915 Step and flash imprint lithography |
| 04/13/2004 | US6719886 Method and apparatus for ionized physical vapor deposition |
| 04/13/2004 | US6719885 Method of reducing stress induced defects in an HDP-CVD process |
| 04/13/2004 | US6719884 Tuning a band-gap by intermixing an impurity with one quantum well in the at least two areas to different values; copper or a copper alloy impurity; high-speed diffusion; dopes |
| 04/13/2004 | US6719875 Plasma process apparatus |
| 04/13/2004 | US6719871 Method for bonding heat sinks to overmolds and device formed thereby |
| 04/13/2004 | US6719851 Lid assembly for opening a process chamber lid and uses therefor |
| 04/13/2004 | US6719849 Single-substrate-processing apparatus for semiconductor process |
| 04/13/2004 | US6719848 Chemical vapor deposition system |
| 04/13/2004 | US6719844 Deposition method, deposition apparatus, and pressure-reduction drying apparatus |
| 04/13/2004 | US6719819 Polishing composition |
| 04/13/2004 | US6719808 Method of and apparatus for manufacturing a semiconductor device using a polysilicon hard mask |
| 04/13/2004 | US6719618 Polishing apparatus |
| 04/13/2004 | US6719614 Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing |
| 04/13/2004 | US6719613 Methods for cleaning surfaces substantially free of contaminants utilizing filtered carbon dioxide |
| 04/13/2004 | US6719550 System to supply semiconductor devices and lead frames relative to application means and attaching means |
| 04/13/2004 | US6719517 Substrate processing apparatus with independently configurable integral load locks |
| 04/13/2004 | US6719516 Single wafer load lock with internal wafer transport |
| 04/13/2004 | US6719499 Device for positioning a wafer |
| 04/13/2004 | US6719185 Substrate with top-flattened solder bumps and method for manufacturing the same |
| 04/13/2004 | US6719183 Transducer and a bonding apparatus using the same |
| 04/13/2004 | US6719142 Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays |
| 04/13/2004 | US6719012 Method of forming trench isolation regions |
| 04/13/2004 | US6718858 Integrated circuit package separators |
| 04/13/2004 | US6718631 Process for producing a flexible wiring board |
| 04/13/2004 | US6718622 Method of forming an assembly of stacked layers |
| 04/13/2004 | US6718604 Mounting method for electronic device elements |
| 04/08/2004 | WO2004030426A2 Improved deposition shield in a plasma processing system,and methods of manufacture of such shield |
| 04/08/2004 | WO2004030411A1 Wafer holder and semiconductor production system |
| 04/08/2004 | WO2004030197A1 Electrostatic holding device and electrostatic tweezers using same |
| 04/08/2004 | WO2004030104A1 Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
| 04/08/2004 | WO2004030101A1 Solid state imaging device and production method therefor |
| 04/08/2004 | WO2004030100A1 Temperature-compensated ferroelectric capacitor device, and its fabrication |
| 04/08/2004 | WO2004030098A1 High-performance substrate for magnetic isolator |
| 04/08/2004 | WO2004030091A1 Underlayer for polysilicon tft |
| 04/08/2004 | WO2004030090A1 Method of reducing voiding in copper interconnects with copper alloys in the seed layer |
| 04/08/2004 | WO2004030089A1 Method of forming a copper interconnect with concentrated alloy atoms at copper-passivation interface |
| 04/08/2004 | WO2004030088A1 Method for forming metal-metal oxide etch stop/electromigration barrier for integrated circuit interconnects and device |
| 04/08/2004 | WO2004030087A2 Via liner integration to avoid resistance shift and resist mechanical stress |
| 04/08/2004 | WO2004030086A2 Integrated structure with microwave components |
| 04/08/2004 | WO2004030085A1 Method for carrying object to be processed |
| 04/08/2004 | WO2004030084A2 Method for quantifying uniformity patterns and inclusion of expert knowledge for tool development and control |
| 04/08/2004 | WO2004030083A2 User interface for quantifying wafer non-uniformities and graphically explore significance |
| 04/08/2004 | WO2004030082A1 Expert knowledge methods and systems for data analysis |
| 04/08/2004 | WO2004030081A1 Correlating an inline parameter to a device operation parameter in semiconductor processing |
| 04/08/2004 | WO2004030080A1 A hollow microprobe using a mems technique and a method of manufacturing the same |
| 04/08/2004 | WO2004030079A1 Connection method and connection device |
| 04/08/2004 | WO2004030078A1 Joining apparatus |
| 04/08/2004 | WO2004030077A1 Connection method and connection device |
| 04/08/2004 | WO2004030076A1 Bonding device and method |
| 04/08/2004 | WO2004030075A1 Method for manufacturing semiconductor device |
| 04/08/2004 | WO2004030074A1 Method of manufacturing an electronic device comprising a thin film transistor |
| 04/08/2004 | WO2004030073A1 Heat treatment system, process for fabricating semiconductor device and process for producing substrate |
| 04/08/2004 | WO2004030072A1 Electric circuit, thin film transistor, method for manufacturing electric circuit and method for manufacturing thin film transistor |
| 04/08/2004 | WO2004030071A1 Methods for producing silicon nitride films and silicon oxynitride films by thermal chemical vapor deposition |
| 04/08/2004 | WO2004030070A1 Borazine based resin and method for production thereof, borazine based resin composition, insulating coating and method for formation thereof, and electronic parts having the insulating coating |
| 04/08/2004 | WO2004030069A2 Method of patterning capacitors and capacitors made thereby |
| 04/08/2004 | WO2004030068A1 Method for the production of an electronic component comprising a praseodymium oxide layer |
| 04/08/2004 | WO2004030067A1 Ozone processing apparatus |
| 04/08/2004 | WO2004030066A1 Substrate processing apparatus |
| 04/08/2004 | WO2004030065A1 Substrate processing apparatus |
| 04/08/2004 | WO2004030064A1 Substrate processing apparatus |
| 04/08/2004 | WO2004030063A1 Substrate processing apparatus |
| 04/08/2004 | WO2004030062A1 Polishing compound composition, method for producing same and polishing method |
| 04/08/2004 | WO2004030061A1 Heat treatment apparatus |
| 04/08/2004 | WO2004030060A1 Two layer lto temperature oxide backside seal for a wafer |
| 04/08/2004 | WO2004030059A1 Method for depositing nitride film using chemical vapor deposition apparatus of single chamber type |
| 04/08/2004 | WO2004030058A1 Heat treatment method and heat treatment device |
| 04/08/2004 | WO2004030057A1 Glass-type planar substrate, use thereof, and method for the production thereof |
| 04/08/2004 | WO2004030055A1 Wafer holder and semiconductor manufacturing apparatus |
| 04/08/2004 | WO2004030054A1 Substrate processing apparatus |
| 04/08/2004 | WO2004030053A1 Thin semiconductor chip manufacturing method |
| 04/08/2004 | WO2004030052A2 Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces |
| 04/08/2004 | WO2004030051A2 System for substrate processing with meniscus, vacuum, ipa vapor, drying manifold |
| 04/08/2004 | WO2004030050A2 Apparatus and method for controlling etch depth |
| 04/08/2004 | WO2004030049A2 A method and system for etching high-k dielectric materials |
| 04/08/2004 | WO2004030048A1 A system for the improved handling of wafers within a process tool |