Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/15/2004WO2004031857A1 Method for correcting mask pattern
04/15/2004WO2004031457A1 Method and apparatus for forming epitaxial layers
04/15/2004WO2004031455A2 Method, composition and apparatus for tunable selectivity during chemical mechanical polishing of metallic structures
04/15/2004WO2004031447A1 Method of electroless plating
04/15/2004WO2004031442A1 Plasma processing system and its substrate processing process, plasma enhanced chemical vapor deposition system and its film deposition process
04/15/2004WO2004031072A2 Electrostatically driven lithography
04/15/2004WO2004031071A1 Method for preparing silver nano-structure by means of scanning tunneling microscopy
04/15/2004WO2004030838A1 Ultrsonic washing equipment and ultrasonic washing method
04/15/2004WO2004030830A1 Nanostructured and nanoporous film compositions, structures, and methods for making the same
04/15/2004WO2004021411A3 Method and apparatus for supplying substrates to a processing tool
04/15/2004WO2004019390A3 Mbe growth of an algan layer or algan multilayer structure
04/15/2004WO2004017365A3 Deposition of amorphous silicon-containing films
04/15/2004WO2004016309A3 Catheter securement device
04/15/2004WO2004012254A8 Semiconductor device manufacturing device
04/15/2004WO2004012230A3 Dynamic targeting for a process control system
04/15/2004WO2004006303A3 Method for fabricating an ultra shallow junction of a field effect transistor
04/15/2004WO2004006290A3 Device for maintaining an object under vacuum and methods for making same, use in non-cooled infrared sensors
04/15/2004WO2004004003A8 Multilayer substrate metallization for ic interconnection
04/15/2004WO2004001814A3 Method of forming a raised contact for a substrate
04/15/2004WO2003107410A3 Process for etching dielectric films with improved resist and/or etch profile characteristics
04/15/2004WO2003107400A3 Acid etching mixture having reduced water content
04/15/2004WO2003106916A3 Optical metrology of single features
04/15/2004WO2003105204A3 Semiconductor devices having strained dual channel layers
04/15/2004WO2003100825A3 Multiple thickness semiconductor interconnect and method therefor
04/15/2004WO2003096394A3 A multi-layer inductor formed in a semiconductor substrate and having a core of ferromagnetic material
04/15/2004WO2003095702A3 Method for curing low dielectric constant film by electron beam
04/15/2004WO2003092013A3 Self-aligned magnetic tunneling junction and via contact
04/15/2004WO2003081974A3 Electronic component mounting apparatus and electronic component mounting method
04/15/2004WO2003081645A3 An integrated in-situ etch process performed in a multichamber substrate processing system
04/15/2004WO2003081644A3 Electronic component mounting method and apparatus and ultrasondic bonding head
04/15/2004WO2003077321A3 Schottky power diode comprising a sicoi substrate and the method of producing one such diode
04/15/2004WO2003071614A3 Silver-selenide/chalcogenide glass stack for resistance variable memory
04/15/2004WO2003071317A8 Monochromator mirror for the euv-spectral range
04/15/2004WO2003070809A3 Organosiloxanes and their use in dielectric films of semiconductors
04/15/2004WO2003063227A3 A method of fabrication for iii-v semiconductor surface passivation
04/15/2004WO2003060960A3 High density area array solder microjoining interconnect structure and fabrication method
04/15/2004WO2003052808A3 Self-aligned contact etch with high sensitivity to nitride shoulder
04/15/2004WO2003043074A3 Semiconductor component and method for contacting said semiconductor component
04/15/2004WO2003037497A3 Method of etching high aspect ratio features
04/15/2004WO2003023840A3 Methods and apparatus for cleaning and/or treating a substrate using co¿2?
04/15/2004WO2003017341B1 Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions
04/15/2004WO2003009057A9 Thin film transistors suitable for use in flat panel displays
04/15/2004WO2003005412A9 Method and apparatus for production line screening
04/15/2004WO2003003377A3 Low-voltage and interface damage-free polymer memory device
04/15/2004WO2002099161A3 Method for the deposition of materials from mesomorphous films
04/15/2004WO2002092878A3 Electroless plating method and device, and substrate processing method and apparatus
04/15/2004WO2002045871A9 System and method for modulated ion-induced atomic layer deposition (mii-ald)
04/15/2004WO2001082362A8 Process for forming electrical/mechanical connections
04/15/2004US20040073880 Method and system for designing circuit layout
04/15/2004US20040073878 Layout device
04/15/2004US20040073732 Parameter generating circuit for deciding priority of master blocks and method of generating parameter
04/15/2004US20040073398 Methods and systems for determining a critical dimension and a thin film characteristic of a specimen
04/15/2004US20040073331 Automated material handling system and method of use
04/15/2004US20040073328 Devices and methods for detecting orientation and shape of an object
04/15/2004US20040073327 Semiconductor manufacturing line monitoring system
04/15/2004US20040072707 Washing a substrate and coating a high molecular straight chain organic compound on the surface
04/15/2004US20040072706 Placing an object onto a support within a pressure chamber, pressurizing the chamber, cleaning, decompressing and venting
04/15/2004US20040072520 Support substrate for thin-sheet work
04/15/2004US20040072517 Apparatus for polishing a semiconductor wafer and method therefor
04/15/2004US20040072516 Polishing pad having a grooved pattern for use in chemical mechanical polishing apparatus
04/15/2004US20040072512 Polishing apparatus
04/15/2004US20040072507 Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles
04/15/2004US20040072506 Fixed abrasive article for use in modifying a semiconductor wafer
04/15/2004US20040072505 Polishing member and method of manufacturing semiconductor device
04/15/2004US20040072501 Polishing method and polishing apparatus used for the same
04/15/2004US20040072500 Chemical mechanical polishing with friction-based control
04/15/2004US20040072499 Polishing apparatus
04/15/2004US20040072456 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods
04/15/2004US20040072451 Method of manufacturing a semiconductor device
04/15/2004US20040072450 Spin-coating methods and apparatuses for spin-coating, including pressure sensor
04/15/2004US20040072449 Method of manufacturing semiconductor device using flexible tube
04/15/2004US20040072448 Protecting delicate semiconductor features during wet etching
04/15/2004US20040072446 Method for fabricating an ultra shallow junction of a field effect transistor
04/15/2004US20040072444 Etchant for wire, method of manufacturing wire using etchant, thin film transistor array panel including wire and manufacturing method thereof
04/15/2004US20040072443 Method for plasma etching performance enhancement
04/15/2004US20040072442 Low-bias bottom electrode etch for patterning ferroelectric memory elements
04/15/2004US20040072441 Clean for high density capacitors
04/15/2004US20040072440 Process for removal of photoresist mask used for making vias in low K carbon-doped silicon oxide dielectric material, and for removal of etch residues from formation of vias and removal of photoresist mask
04/15/2004US20040072439 Chemical mechanical polishing composition and process
04/15/2004US20040072437 Production method for silicon wafer and silicon wafer and soi wafer
04/15/2004US20040072436 metalloamides; chemical vapor depostion (CVD); low carbon/halide impurity in comparison with silica gate dielectrics; semiconductors
04/15/2004US20040072435 Method of integrating L - shaped spacers in a high performance CMOS process via use of an oxide - nitride - doped oxide spacer
04/15/2004US20040072434 Device manufacturing apparatus
04/15/2004US20040072433 Method of forming a capacitor
04/15/2004US20040072431 Method for fabricating semiconductor device
04/15/2004US20040072430 Method for forming a dual damascene structure
04/15/2004US20040072429 Method for manufacturing a semiconductor device
04/15/2004US20040072426 Process chamber for manufacturing a smiconductor device
04/15/2004US20040072425 Mbe-method for production of a gallium manganese nitride ferromagnetic film
04/15/2004US20040072424 Method of controlling metal formation processes using ion implantation, and system for performing same
04/15/2004US20040072423 Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features
04/15/2004US20040072422 Methods of forming conductive through-wafer vias
04/15/2004US20040072421 Laterally interconnecting structures
04/15/2004US20040072420 Anti-reflective compositions comprising triazine compounds
04/15/2004US20040072419 Method for applying metal features onto barrier layers using electrochemical deposition
04/15/2004US20040072418 Semiconductor device and manufacturing method thereof
04/15/2004US20040072417 Method of manufacturing a semiconductor element
04/15/2004US20040072416 Method for eliminating voiding in plated solder
04/15/2004US20040072415 Semiconductor device and method of manufacturing the same
04/15/2004US20040072413 Semiconductor device and method of manufacturing the same, circuit board and electronic instrument