| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/20/2004 | US6723494 Conductor pattern and electronic component having the same |
| 04/20/2004 | US6723488 Photoresist composition for deep UV radiation containing an additive |
| 04/20/2004 | US6723485 Positive resist composition and process for forming resist pattern using same |
| 04/20/2004 | US6723477 Method for manufacturing phase shift mask blank and method for manufacturing phase shift mask |
| 04/20/2004 | US6723475 Multilayer |
| 04/20/2004 | US6723437 Semiconductor processing component having low surface contaminant concentration |
| 04/20/2004 | US6723436 An electrically- conducting fully oxidized transition metal compound combined with an oxide of a different material, where the two materials are immiscible at the temperature range of interest |
| 04/20/2004 | US6723421 Semiconductor with coordinatively irregular structures |
| 04/20/2004 | US6723388 Method of depositing nanostructured films with embedded nanopores |
| 04/20/2004 | US6723386 For use in cleaning silicon wafers |
| 04/20/2004 | US6723281 Silver alloyed with palladium and at least one of aluminum, copper, tantalum, chromium, titanium and cobalt; stability; processability; lower electrical resistivity |
| 04/20/2004 | US6723274 High-purity low-resistivity electrostatic chucks |
| 04/20/2004 | US6723251 Method for planarizing circuit board and method for manufacturing semiconductor device |
| 04/20/2004 | US6723250 Method of producing structured wafers |
| 04/20/2004 | US6723226 Forming fluorine free saturated solution containing oxalic acid, ammonium oxalate, ammonium formate, ammonium bicarbonate and/or ammonium tartrate |
| 04/20/2004 | US6723224 Electro-chemical polishing apparatus |
| 04/20/2004 | US6723219 Method of direct electroplating on a low conductivity material, and electroplated metal deposited therewith |
| 04/20/2004 | US6723215 Sputtering apparatus for forming a metal film using a magnetic field |
| 04/20/2004 | US6723213 Titanium target assembly for sputtering and method for preparing the same |
| 04/20/2004 | US6723202 Worktable device and plasma processing apparatus for semiconductor process |
| 04/20/2004 | US6723201 Microchip fabrication chamber wafer detection |
| 04/20/2004 | US6723186 Method of manufacturing metallic film consisting of giant single crystal grains |
| 04/20/2004 | US6723183 Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target |
| 04/20/2004 | US6723174 Carrying wafers offset from robot arm avoiding contamination |
| 04/20/2004 | US6723172 Method and system for processing semiconductor wafers |
| 04/20/2004 | US6723168 Spin-coater with self-cleaning cup and method of using |
| 04/20/2004 | US6723167 Spindle sleeve for coater/developer |
| 04/20/2004 | US6723165 Method for fabricating Group III nitride semiconductor substrate |
| 04/20/2004 | US6723164 Method for stabilizing oxide-semiconductor interface by using group 5 element and stabilized semiconductor |
| 04/20/2004 | US6723144 Semiconductor device fabricating method |
| 04/20/2004 | US6723143 Reactive aqueous metal oxide sols as polishing slurries for low dielectric constant materials |
| 04/20/2004 | US6722964 Polishing apparatus and method |
| 04/20/2004 | US6722958 Apparatus and process for recovering abrasive |
| 04/20/2004 | US6722953 Abrasive liquid feed apparatus, method for feeding additive to abrasive liquid feed apparatus, and polishing apparatus |
| 04/20/2004 | US6722950 Method and apparatus for electrodialytic chemical mechanical polishing and deposition |
| 04/20/2004 | US6722942 Chemical mechanical polishing with electrochemical control |
| 04/20/2004 | US6722840 Wafer ring supplying and returning apparatus |
| 04/20/2004 | US6722837 Load storage equipment |
| 04/20/2004 | US6722835 System and method for processing semiconductor wafers including single-wafer load lock |
| 04/20/2004 | US6722834 Robot blade with dual offset wafer supports |
| 04/20/2004 | US6722798 Coats a semiconductor wafer with a resist solution, processes it to develop a resist film after exposure to light and inspects the status of the processed wafer |
| 04/20/2004 | US6722665 MESC seal, O-ring carrier |
| 04/20/2004 | US6722642 High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism |
| 04/20/2004 | US6722557 Pretreating and preheating |
| 04/20/2004 | US6722412 Die bonder |
| 04/20/2004 | US6722379 One-piece cleaning tank with indium bonded megasonic transducer |
| 04/20/2004 | US6722376 Polysilicon etch useful during the manufacture of a semiconductor device |
| 04/20/2004 | US6722289 Table system with angular position controls |
| 04/20/2004 | US6722249 Method of fabricating a polishing pad having an optical window |
| 04/20/2004 | US6722056 Drying vapor generation |
| 04/20/2004 | US6722055 Supporting fixture of substrate and drying method of substrate surface using the same |
| 04/20/2004 | US6722028 Method of making electronic device |
| 04/20/2004 | US6722026 Holding with fibers in vacuum environment using van der waals forces |
| 04/20/2004 | US6722022 Apparatus for calibrating the position of a wafer platform in an ion implanter |
| 04/15/2004 | WO2004032252A1 Light emitting diode |
| 04/15/2004 | WO2004032246A1 Finfet having improved carrier mobility and method of its formation |
| 04/15/2004 | WO2004032245A1 Integrated field-effect transistor comprising two control regions, use of said field-effect transistor and method for producing the same |
| 04/15/2004 | WO2004032244A1 Semiconductor device and process for fabricating the same |
| 04/15/2004 | WO2004032241A1 Indium-boron dual halo for mosfet |
| 04/15/2004 | WO2004032240A1 Image sensor having improved productivity and sensitivity |
| 04/15/2004 | WO2004032237A1 Magnetic memory and method of manufacturing the memory |
| 04/15/2004 | WO2004032236A2 Method and apparatus to fabricate an on-chip decoupling capacitor |
| 04/15/2004 | WO2004032227A1 Rapid annealing process for wafers in semiconductor material |
| 04/15/2004 | WO2004032226A1 Method of manufacturing a semiconductor device with field isolation regions consisting of grooves filled with isolating material |
| 04/15/2004 | WO2004032225A1 Process control at an interconnect level |
| 04/15/2004 | WO2004032224A1 Method and apparatus for controlling a fabrication process based on a measured electrical characteristic |
| 04/15/2004 | WO2004032223A1 Semiconductor device |
| 04/15/2004 | WO2004032222A1 Selective connection in ic packaging |
| 04/15/2004 | WO2004032221A1 Hardmask employing multiple layers of silicon oxynitride |
| 04/15/2004 | WO2004032220A1 Method for reducing wafer arcing |
| 04/15/2004 | WO2004032219A1 Plasma processing system |
| 04/15/2004 | WO2004032218A1 Etching pastes for silicon surfaces and layers |
| 04/15/2004 | WO2004032217A1 Circuit element having a metal silicide region thermally stabilized by a barrier diffusion material |
| 04/15/2004 | WO2004032216A1 Semi-conductor dielectric component with a praseodymium oxide dielectric |
| 04/15/2004 | WO2004032215A1 Linearly focused laser-annealing of buried species |
| 04/15/2004 | WO2004032213A1 High frequency plasma generator and high frequency plasma generating method |
| 04/15/2004 | WO2004032212A1 Stage device and exposure device |
| 04/15/2004 | WO2004032211A1 X-ray generator and exposure device |
| 04/15/2004 | WO2004032209A2 Method of etching shaped features on a substrate |
| 04/15/2004 | WO2004032208A1 Reduction of electric-field-induced damage in field-sensitive articles |
| 04/15/2004 | WO2004032207A1 System and method for performing simultaneous precision die bond of photonic components onto a single substrate |
| 04/15/2004 | WO2004032206A1 Forming folded-stack packaged device using progressive folding tool |
| 04/15/2004 | WO2004032205A2 Current-carrying electronic component and method of manufacturing same |
| 04/15/2004 | WO2004032202A2 Device and method for applying semiconductor chips to carriers |
| 04/15/2004 | WO2004032201A2 Method for producing low-resistance ohmic contacts between substrates and wells in cmos integrated circuits |
| 04/15/2004 | WO2004032198A2 Method for maintaining solder thickness in flipchip attach packaging processes |
| 04/15/2004 | WO2004032197A2 Low temperature texturing layer to enhance adhesion of subsequent layers |
| 04/15/2004 | WO2004032196A2 Method of fabricating semiconductor by nitrogen doping of silicon film |
| 04/15/2004 | WO2004032193A2 Large-area nanoenabled macroelectronic substrates and uses therefor |
| 04/15/2004 | WO2004032192A2 Composition and chemical vapor deposition method for forming organic low k dielectric films |
| 04/15/2004 | WO2004032191A2 Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
| 04/15/2004 | WO2004032190A2 Integrated displays using nanowire transistors |
| 04/15/2004 | WO2004032187A2 Multi-zone resitive heater |
| 04/15/2004 | WO2004032183A2 Method for making a detachable semiconductor substrate and for obtaining a semiconductor element |
| 04/15/2004 | WO2004032182A2 Method for making a wire nanostructure in a semiconductor film |
| 04/15/2004 | WO2004032160A2 Methods and systems for processing a substrate using a dynamic liquid meniscus |
| 04/15/2004 | WO2004032148A1 Semiconductor memory device, method for controlling the same, and mobile electronic device |
| 04/15/2004 | WO2004032144A2 Spacer integration scheme in mram technology |
| 04/15/2004 | WO2004031875A1 Method and apparatus for the monitoring and control of a semiconductor manufacturing process |
| 04/15/2004 | WO2004031859A2 Comprehensive integrated lithographic process control system based on product design and yield feedback system |