Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2004
04/15/2004US20040072412 Recessed gate electrode MOS transistors having a substantially uniform channel length across a width of the recessed gate electrode and methods of forming same
04/15/2004US20040072411 Method for manufacturing semiconductor device
04/15/2004US20040072410 GaN single crystal substrate and method of making the same
04/15/2004US20040072409 Coplanar integration of lattice-mismatched semiconductor with silicon via wafer bonding virtual substrates
04/15/2004US20040072408 Methods of forming trench isolated integrated circuit devices including grooves, and trench isolated integrated circuit devices so formed
04/15/2004US20040072407 Ferroelectric capacitor memory device fabrication method
04/15/2004US20040072406 Structure and process for a capacitor and other devices
04/15/2004US20040072405 Method of avoiding dielectric arcing
04/15/2004US20040072404 High speed trench DMOS
04/15/2004US20040072403 Method of manufacturing semiconductor device
04/15/2004US20040072402 Semiconductor device and method of fabricating the same
04/15/2004US20040072401 Method for forming capacitor
04/15/2004US20040072400 Method of forming a shallow trench isolation structure
04/15/2004US20040072399 Method for fabricating BiCMOS transistor
04/15/2004US20040072397 Non-oxidizing spacer densification method for manufacturing semiconductor devices
04/15/2004US20040072396 Semiconductor electronic device and method of manufacturing thereof
04/15/2004US20040072395 Method to produce localized halo for MOS transistor
04/15/2004US20040072394 Semiconductor device and method for fabricating the same
04/15/2004US20040072393 Crystalline semiconductor thin film, method of fabricating the same, semiconductor device, and method of fabricating the same
04/15/2004US20040072392 Method of forming a low temperature polysilicon thin film transistor
04/15/2004US20040072391 Contactless uniform-tunneling separate p-well (cusp) non-volatile memory array architecture, fabrication and operation
04/15/2004US20040072390 Method for providing and utilizing rerouting resources
04/15/2004US20040072389 Chip carrier, semiconductor package and fabricating method thereof
04/15/2004US20040072388 Method of manufacturing semiconductor chip
04/15/2004US20040072387 Method of fabricating and mounting flip chips
04/15/2004US20040072385 Chip alignment and placement apparatus for integrated circuit, mems, photonic or other devices
04/15/2004US20040072383 Nitride semiconductor device comprising bonded substrate and fabrication method of the same
04/15/2004US20040072382 Method of producing a light-emitting diode
04/15/2004US20040072381 Domain epitaxy for thin film growth
04/15/2004US20040072380 Light emitting device and method for manufacturing the same
04/15/2004US20040072377 Multi chip module assembly
04/15/2004US20040072376 Load port of a semiconductor manufacturing apparatus having integrated kinematic coupling pins and sensors, and method of loading wafers using the same
04/15/2004US20040072108 Prevents collapse; photolithography
04/15/2004US20040072104 Comprises kryton fluoride photoresist pattern
04/15/2004US20040072103 Positive-working photoresist composition
04/15/2004US20040072099 High resolution; improved development and etch resistance; microelectronics
04/15/2004US20040072098 Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device
04/15/2004US20040072097 Photosensitive composition and acid generator
04/15/2004US20040072096 Photoresists; thin films; irradiation polymerization/ photopolymerization; surface/heat treatment
04/15/2004US20040072095 Comprises 4-(1-butoxyphenyl)diphenylsulfonium mesylate; photosensitivity; high resolution, photospeed and depth of focus; semiconductors; relief imaging
04/15/2004US20040072083 For use in photolithography
04/15/2004US20040072082 Photomask, method of manufacturing a photomask, and method of manufacturing an electronic product
04/15/2004US20040072081 Methods for etching photolithographic reticles
04/15/2004US20040072009 Copper sputtering targets and methods of forming copper sputtering targets
04/15/2004US20040071991 Forming a row of aligned windows in a planar surface; depositing an electromigration-inhibiting/electrically conductive material over the planar surface and through the windows to fill; removing portions
04/15/2004US20040071945 Ceramic joint body
04/15/2004US20040071899 For photolithographic patterning
04/15/2004US20040071879 Method of film deposition, and fabrication of structures
04/15/2004US20040071878 Surface preparation using plasma for ALD Films
04/15/2004US20040071875 Ferroelectric property, and therefore, it can be advantageously used in an electric or electronic device
04/15/2004US20040071874 Apparatus and method for single-wafer-processing type CVD
04/15/2004US20040071873 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof
04/15/2004US20040071872 Dividing a coating region of substrate into at least two regions; and setting a jet amount of the liquid to any one of at least two regions to a greater value than the jet amount to another of at least two regions
04/15/2004US20040071805 Transfer holding of integrated circuit packages
04/15/2004US20040071613 Plasma processing apparatus
04/15/2004US20040071534 Adjustable wafer alignment arm
04/15/2004US20040071531 Substrate treating apparatus
04/15/2004US20040071336 Exposure method and device manufacturing method using this exposure method
04/15/2004US20040071266 Low vapor pressure, low debris solid target for EUV production
04/15/2004US20040071262 Method of alignment
04/15/2004US20040071260 X-ray projection exposure apparatus and a device manufacturing method
04/15/2004US20040071189 Temperature measuring sensor incorporated in semiconductor substrate, and semiconductor device containing such temperature measuring sensor
04/15/2004US20040071030 Semiconductor integrated circuits, fabrication method for the same and semiconductor integrated circuit systems
04/15/2004US20040071026 Semiconductor integrated circuit device operating with low power consumption
04/15/2004US20040071025 Flash memory device and fabricating method therefor
04/15/2004US20040071024 Nonvolatile semiconductor memory device and method for fabricating the same
04/15/2004US20040071022 ROM embedded DRAM with dielectric removal/short
04/15/2004US20040071020 Multi-level flash EEPROM cell and method of manufacture thereof
04/15/2004US20040071011 Semiconductor memory device and control method and manufacturing method thereof
04/15/2004US20040071008 Contactless uniform-tunneling separate p-well (CUSP) non-volatile memory array architecture, fabrication and operation
04/15/2004US20040070961 Contactor apparatus for semiconductor devices and a test method of semiconductor devices
04/15/2004US20040070945 Heat dissipation structures and method of making
04/15/2004US20040070916 Electrostatic chucks and electrostatically attracting structures
04/15/2004US20040070914 Electrostatic device for holding an electronic component wafer
04/15/2004US20040070901 Electrostatic discharge protection circuit
04/15/2004US20040070753 Pattern inspection apparatus
04/15/2004US20040070742 Relay image optical system, and illuminating optical device and exposure system provided with the optical system
04/15/2004US20040070741 Alignment system and projection exposure apparatus
04/15/2004US20040070721 Image display device
04/15/2004US20040070707 Liquid crystal display device and method for manufacturing the same
04/15/2004US20040070697 Method of forming an active matrix display
04/15/2004US20040070623 User interface for quantifying wafer non-uniformities and graphically explore significance
04/15/2004US20040070427 Semiconductor integrated circuit device having a leakage current cutoff circuit, constructed using MT-CMOS, for reducing standby leakage current
04/15/2004US20040070417 Cantilever type probe card and method for production thereof
04/15/2004US20040070413 Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
04/15/2004US20040070412 Device testing contactor, method of producing the same, and device testing carrier
04/15/2004US20040070407 Fingerprint detector with improved sensing surface layer
04/15/2004US20040070393 Differential measurement method using eddy-current sensing to resolve a stack of conducting films on substrates
04/15/2004US20040070387 Water staging platform
04/15/2004US20040070383 Integrated circuit driver having stable bootstrap power supply
04/15/2004US20040070348 Neutral particle beam processing apparatus
04/15/2004US20040070312 Integrated circuit and process for fabricating the same
04/15/2004US20040070285 Electric motors with reduced stray magnetic fields
04/15/2004US20040070221 Device for gripping and holding and object in a contactless manner
04/15/2004US20040070087 Semiconductor package with enhanced chip groundability and method of fabricating the same
04/15/2004US20040070086 Fabrication of wire bond pads over underlying active devices, passive devices and /or dielectric layers in integrated circuits
04/15/2004US20040070085 Method for producing a semiconductor device and corresponding semiconductor device
04/15/2004US20040070084 Solder ball assembly, a method for its manufacture, and a method of forming solder bumps
04/15/2004US20040070081 Lower the on-resistance in protection circuit of rechargeable battery by using flip-chip technology
04/15/2004US20040070080 Low cost, high performance flip chip package structure