| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/20/2004 | US20040097086 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097085 Methods of forming conductive capacitor plugs, methods of forming capacitor contact openings, and methods of forming memory arrays |
| 05/20/2004 | US20040097084 Method for grinding rear surface of semiconductor wafer |
| 05/20/2004 | US20040097083 CMP process leaving no residual oxide layer or slurry particles |
| 05/20/2004 | US20040097081 Method for manufacturing circuit devices |
| 05/20/2004 | US20040097080 Method of manufacturing a semiconductor device |
| 05/20/2004 | US20040097079 High speed silicon etching method |
| 05/20/2004 | US20040097078 Thin film transfer join process and multilevel thin film module |
| 05/20/2004 | US20040097077 Method and apparatus for etching a deep trench |
| 05/20/2004 | US20040097076 Controlled use of photochemically susceptible chemistries for etching, cleaning and surface conditioning |
| 05/20/2004 | US20040097075 Copper silicide passivation for improved reliability |
| 05/20/2004 | US20040097074 Semiconductor device manufacturing method |
| 05/20/2004 | US20040097073 Chemical vapor deposition of titanium from titanium tetrachloride and hydrocarbon reactants |
| 05/20/2004 | US20040097072 Method of forming metallized pattern |
| 05/20/2004 | US20040097071 Method of electoless deposition of thin metal and dielectric films with temperature controlled on stages of film growth |
| 05/20/2004 | US20040097070 Method of producing metal film |
| 05/20/2004 | US20040097069 Gap-filling process |
| 05/20/2004 | US20040097068 Semiconductor device and method for fabricating the same |
| 05/20/2004 | US20040097067 Methods of fabricating integrated circuit devices providing improved short prevention |
| 05/20/2004 | US20040097065 Air gap for tungsten/aluminum plug applications |
| 05/20/2004 | US20040097064 Method of manufacturing semiconductor device |
| 05/20/2004 | US20040097063 Single wafer processing method and system for processing semiconductor |
| 05/20/2004 | US20040097062 Method of producing a semiconductor-metal contact through a dielectric layer |
| 05/20/2004 | US20040097061 Method of manufacturing semiconductor element |
| 05/20/2004 | US20040097060 Method for fabricating semiconductor device using a nickel salicide process |
| 05/20/2004 | US20040097059 Method of manufacturing a semiconductor device |
| 05/20/2004 | US20040097058 Controlling the characteristics of implanter ion-beams |
| 05/20/2004 | US20040097057 Method of forming ultra shallow junctions |
| 05/20/2004 | US20040097055 Gettering technique for wafers made using a controlled cleaving process |
| 05/20/2004 | US20040097054 Fabrication method of semiconductor circuit device |
| 05/20/2004 | US20040097053 Semiconductor wafer protective member and semiconductor wafer grinding method |
| 05/20/2004 | US20040097052 Methods of forming semiconductor constructions |
| 05/20/2004 | US20040097051 Methods for improving well to well isolation |
| 05/20/2004 | US20040097050 Capacitor |
| 05/20/2004 | US20040097049 Semiconductor device and method for manufacturing a semiconductor device |
| 05/20/2004 | US20040097048 Semiconductor devices and methods for forming semiconductor devices |
| 05/20/2004 | US20040097047 Method of manufacture of MOSFET device with in-situ doped, raised source and drain structures |
| 05/20/2004 | US20040097046 Method of manufacturing semiconductor device having trench element-isolating structure |
| 05/20/2004 | US20040097045 Method for fabricating nitride read-only memory |
| 05/20/2004 | US20040097044 Silicon/oxide/nitride/oxide/silicon nonvolatile memory with vertical channels, fabricating method thereof, and programming method thereof |
| 05/20/2004 | US20040097043 Polysilicon gate doping level variation for reduced leakage current |
| 05/20/2004 | US20040097042 Trench DMOS transistor having a zener diode for protection from electro-static discharge |
| 05/20/2004 | US20040097041 Inverse-T gate structure using damascene processing |
| 05/20/2004 | US20040097040 Field effect transistor with gate layer and method of making same |
| 05/20/2004 | US20040097039 Sige vertical gate contact for gate conductor post etch treatment |
| 05/20/2004 | US20040097038 Superjunction device and process for its manufacture |
| 05/20/2004 | US20040097037 Method for manufacturing a multi-bit memory cell |
| 05/20/2004 | US20040097036 Method for fabricating a vertical NROM cell |
| 05/20/2004 | US20040097035 Method of manufacturing semiconductor device |
| 05/20/2004 | US20040097034 Capacitor structure |
| 05/20/2004 | US20040097033 Method for manufacturing semiconductor devices and integrated circuit capacitors whereby degradation of surface morphology of a metal layer from thermal oxidation is suppressed |
| 05/20/2004 | US20040097032 Method for fabricating semiconductor device |
| 05/20/2004 | US20040097031 Method of fabricating a semiconductor device having an l-shaped spacer |
| 05/20/2004 | US20040097030 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same |
| 05/20/2004 | US20040097029 Semiconductor device with deep trench isolation and method of manufacturing same |
| 05/20/2004 | US20040097028 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands |
| 05/20/2004 | US20040097027 Method for manufacturing semiconductor device |
| 05/20/2004 | US20040097026 Increased input field effect transister capacitance; three angstrom thickness |
| 05/20/2004 | US20040097025 Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel mosfets |
| 05/20/2004 | US20040097024 Interconnections including multi-layer metal film stack for improving corrosion and heat resistances |
| 05/20/2004 | US20040097023 Method for fabricating semiconductor device with negative differential conductance or transconductance |
| 05/20/2004 | US20040097022 Silicon-on-insulator structures and methods |
| 05/20/2004 | US20040097021 Method of fabricating heterojunction photodiodes integrated with cmos |
| 05/20/2004 | US20040097020 Thin film transistor array panel used for a liquid crystal display and a manufactring method thereof |
| 05/20/2004 | US20040097018 Mask ROM fabrication method |
| 05/20/2004 | US20040097017 Method of manufacturing a semiconductor device |
| 05/20/2004 | US20040097014 Semiconductor package with a die attach adhesive having silane functionality |
| 05/20/2004 | US20040097013 Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
| 05/20/2004 | US20040097012 Semiconductor wafer processing to increase the usable planar surface area |
| 05/20/2004 | US20040097011 Circuit substrates, semiconductor packages, and ball grid arrays |
| 05/20/2004 | US20040097010 Methods of forming semiconductor stacked die devices |
| 05/20/2004 | US20040097008 Three dimensional structure integrated circuit |
| 05/20/2004 | US20040097004 Three-dimensional integrated CMOS-MEMS device and process for making the same |
| 05/20/2004 | US20040097002 Three-dimensional integrated CMOS-MEMS device and process for making the same |
| 05/20/2004 | US20040096999 Method of forming a liquid crystal display |
| 05/20/2004 | US20040096997 Method for manufacturing GaN compound semiconductor light emitting device |
| 05/20/2004 | US20040096996 Low voltage multi-junction vertical cavity surface emitting laser |
| 05/20/2004 | US20040096993 Method of repairing organic light-emitting element pixels |
| 05/20/2004 | US20040096992 Method for producing and testing a corrosion-resistant channel in a silicon device |
| 05/20/2004 | US20040096797 Thermal treatment equipment and method for heat-treating |
| 05/20/2004 | US20040096780 Resist pattern thickening material, resist pattern and process for forming the same, and semiconductor device and process for manufacturing the same |
| 05/20/2004 | US20040096778 Exposure metal circuit to mixture of acid, hydrogen peroxide and buffer |
| 05/20/2004 | US20040096773 Soluble polyimide for photosensitive polyimide precursor and photosensitive polyimide precursor composition comprising the soluble polyimide |
| 05/20/2004 | US20040096772 Amplificated photoresist; addition polymer containing silicon compond and acrylated ester; mixture with solvent and acid generator; exposure to radiation, then heat treatment |
| 05/20/2004 | US20040096771 Photoresist composition for forming an insulation film, insulation film for organic electroluminescence element and method for itis formation |
| 05/20/2004 | US20040096760 Accumulating developer fluid; measurement photoresist concentration; calibration; uniform development; reuse |
| 05/20/2004 | US20040096755 Mask-making member and its production method, mask and its making method, exposure process, and fabrication method of semiconductor device |
| 05/20/2004 | US20040096754 Mask for laser irradiation and apparatus for laser crystallization using the same |
| 05/20/2004 | US20040096753 Mask for laser irradiation, method of manufacturing the same, and apparatus for laser crystallization using the same |
| 05/20/2004 | US20040096706 Aluminum nitride ceramics and a member used for the production of semiconductors |
| 05/20/2004 | US20040096699 Current-responsive resistive component |
| 05/20/2004 | US20040096676 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 05/20/2004 | US20040096672 Multilayer integrated circuits; vapor deposition; exposure to ultraviolet radiation; forming porosity |
| 05/20/2004 | US20040096636 Lifting glass substrate without center lift pins |
| 05/20/2004 | US20040096633 Adhesive film for underfill and semiconductor device using the same |
| 05/20/2004 | US20040096593 Exposure to ultraviolet radiation in non-oxidizing environment; removal zones of material |
| 05/20/2004 | US20040096592 Mixture of cobalt compound, complexing agent and reducing agent |
| 05/20/2004 | US20040096591 Dielectric layer with aperture; scanning, discharging drops of polymeric etching barrier; hardening |
| 05/20/2004 | US20040096587 Epitaxial oxide films via nitride conversion |
| 05/20/2004 | US20040096586 System for deposition of mesoporous materials |