| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/27/2004 | US20040099636 Fabrication of three dimensional structures |
| 05/27/2004 | US20040099635 photoreactive alignment layer is made from polyamic acid obtained by reacting a diamine with an acid anhydride, selected from1,2,3,4-cyclopentanetetracarboxylic acid dianhydride,1,2,3,4-butanetetracarboxylic acid dianhydride, and 1,2,3,4-cyclobutanetetracarboxylic acid dianhydride; free of nonuniformity |
| 05/27/2004 | US20040099634 interposing between exothermic device and heat sink surface a heat-spreading layer of a composite comprised of carbon nanotubes dispersed in a matrix of ceramic material |
| 05/27/2004 | US20040099631 Deep reactive ion etching process and microelectromechanical devices formed thereby |
| 05/27/2004 | US20040099602 Developer waste liquid regenerating apparatus and method |
| 05/27/2004 | US20040099569 Thin plate storage container |
| 05/27/2004 | US20040099568 Hard tray for carrying socket connectors |
| 05/27/2004 | US20040099534 Overcoating barrier or seed layer with copper, or other metal; connecting electrode to edges of wafer; applying potentials |
| 05/27/2004 | US20040099509 Chip-transferring station for a bonding machine |
| 05/27/2004 | US20040099441 Printed circuit board,its manufacturing method and csp manufacturing method |
| 05/27/2004 | US20040099378 Gas injection apparatus for semiconductor processing system |
| 05/27/2004 | US20040099377 Non-plasma reaction apparatus and method |
| 05/27/2004 | US20040099376 Plasma etching uniformity control |
| 05/27/2004 | US20040099375 Edge-contact ring for a wafer pedestal |
| 05/27/2004 | US20040099366 Method for contact-connecting an electrical component to a substrate having a conductor structure |
| 05/27/2004 | US20040099364 Method of producing a composite sheet and method of producing a laminate by using the composite sheet |
| 05/27/2004 | US20040099333 In-situ purge system for article containers |
| 05/27/2004 | US20040099290 Method for cleaning a surface of a substrate |
| 05/27/2004 | US20040099289 Cleaning wafers or glass surfaces for liquid crystal displays with acidic or alkaline cleaning compounds, then immersing in water baths and neutralizing |
| 05/27/2004 | US20040099284 Spraying steam on the surfaces photoresists using nozzles, then peeling |
| 05/27/2004 | US20040099283 Drying process for low-k dielectric films |
| 05/27/2004 | US20040099282 Monitoring and decomposition of deposits in enclosures used for chemical vapor deposition of semiconductors, using gas generators, radiation measuring instruments and analysis apparatus |
| 05/27/2004 | US20040099220 [laser annealing apparatus and application of the same] |
| 05/27/2004 | US20040099219 Semiconductor manufacturing system |
| 05/27/2004 | US20040099217 Uniform temperature workpiece holder |
| 05/27/2004 | US20040099215 Chamber for constructing a film on a semiconductor wafer |
| 05/27/2004 | US20040099213 Spatially programmable microelectronics process equipment using segmented gas injection showerhead with exhaust gas recirculation |
| 05/27/2004 | US20040099112 Plate-like carrying mechanism and dicing device with carrying mechanism |
| 05/27/2004 | US20040098951 Device for introducing electric components into continuous tapes |
| 05/27/2004 | US20040098949 Packaging method for wafers |
| 05/27/2004 | US20040098924 Contains hydroxyethyl cellulose, polyethylene oxide, ammonia, water, and silicon dioxide; for reducing haze level of surfaces of silicon wafers |
| 05/27/2004 | DE4341698B4 Halbleiterbauelement mit einem Speicherkondensator und Verfahren zu dessen Herstellung A semiconductor device having a storage capacitor and process for its preparation |
| 05/27/2004 | DE19709911B4 Verfahren zum Ultraschallbonden eines Leiters eines Anschlußrahmens und Anschlußrahmenklemme zum Klemmen eines Anschlußrahmens beim Bonden A method for ultrasonic bonding of a conductor of a lead frame and lead frame clamp for clamping a lead frame during bonding |
| 05/27/2004 | DE19627630B4 Verfahren zur Herstellung eines Halbleiterbauelements oder Speicherbauelements mit einer Siliziumoxidschicht mit annähernd planarer Oberflächenform und Speicherbauelement mit einer Siliziumoxidschicht mit annähernd planarer Oberflächenform A process for producing a semiconductor device or memory device with a silicon oxide layer with approximately planar surface and shape memory device with a silicon oxide layer with approximately planar surface shape |
| 05/27/2004 | DE10352606A1 Device for producing a semiconductor component comprises a chamber containing an inner structure, a reaction gas feed unit for introducing reaction gas into the inner chamber, a cathode and anode for plasma discharge and a heater |
| 05/27/2004 | DE10352070A1 Verfahren zum Verbessern der Ätzgleichmäßigkeit bei der Tiefenätzung von Silizium A method for improving etching uniformity in the deep etching of silicon |
| 05/27/2004 | DE10352068A1 Ausbilden von Siliziumnitridinseln für eine erhöhte Kapazität Forming Siliziumnitridinseln for increased capacity |
| 05/27/2004 | DE10351389A1 Halbleiterwafer und Substrat Semiconductor wafer and substrate |
| 05/27/2004 | DE10351027A1 Crystallizing device used in the production of thin film transistors comprises an illuminating system and a mask consisting of a light absorption layer |
| 05/27/2004 | DE10350703A1 Speicherzelle und Verfahren zu Ihrer Herstellung Memory cell and method for their preparation |
| 05/27/2004 | DE10350510A1 Integrated circuit arrangement comprises an integrated circuit substrate having a secure zone, a window layer formed on the substrate, a buffer pattern formed between the substrate and the window layer, and a secure pattern |
| 05/27/2004 | DE10350354A1 Orientierungs-unabhängige Oxidation von nitriertem Silizium Orientation independent oxidation of nitrided silicon |
| 05/27/2004 | DE10350176A1 Verfahren zum Bearbeiten eines Halbleiterwafers A method of processing a semiconductor wafer |
| 05/27/2004 | DE10349322A1 Halbleitervorrichtung Semiconductor device |
| 05/27/2004 | DE10349154A1 Verfahren für die Bestimmung optimaler Bondparameter beim Bonden mit einem Wire Bonder Method for the determination of optimum bond parameters in bonding with a wire bonder |
| 05/27/2004 | DE10349087A1 Half-tone-type phase shift mask blank manufacturing method involves sputtering reactive gas onto substrate, to form half-tone film with desired optical characteristic, irrespective of change of gas flow amount |
| 05/27/2004 | DE10347428A1 DRAM hoher Dichte mit reduziertem Peripherievorrichtungsbereich und Herstellungsverfahren High density DRAM with reduced peripheral device region and manufacturing processes |
| 05/27/2004 | DE10342998A1 Semiconductor component, typically lower electrode of capacitor in semiconductor memory, for memory miniaturizing using 3D capacitor, with several capacitor contact plugs between two |
| 05/27/2004 | DE10337046A1 Hoch-Wert-Widerstände in Galliumarsenid High-value resistors in gallium arsenide |
| 05/27/2004 | DE10331857A1 Gießharzversiegelte Leistungshalbleitervorrichtung und Verfahren zu deren Herstellung Gießharzversiegelte power semiconductor device and process for their preparation |
| 05/27/2004 | DE10331819A1 Verfahren zum Bilden einer Substratdurchgangsverbindung A method of forming a substrate through connection |
| 05/27/2004 | DE10331541A1 Halbleiterbaugruppe und Herstellungsverfahren dafür A semiconductor package and fabrication method thereof |
| 05/27/2004 | DE10326732A1 Halbleitervorrichtung Semiconductor device |
| 05/27/2004 | DE10321913A1 System-in-package-Halbleitervorrichtung System-in-package semiconductor device |
| 05/27/2004 | DE10309899A1 Verfahren zum Füllen einer Polysiliziumfuge A method of filling a Polysiliziumfuge |
| 05/27/2004 | DE10296988T5 Bearbeitungsvorrichtung und -verfahren Processing apparatus and method |
| 05/27/2004 | DE10253163A1 Component used in microelectronics comprises a sandwich structure, a rear-side metallization extending over the rear side of the chip up to the boundary surfaces of the sandwich structure, lower side contacts, and through-contacts |
| 05/27/2004 | DE10252986A1 Angle control system e.g. for semiconductor wafers cutting machine, has display device for simultaneously displaying image corresponding to digital image data |
| 05/27/2004 | DE10252614A1 Verfahren, Vorrichtung, computerlesbares Speichermedium und Computerprogramm-Element zum Überwachen eines Herstellungsprozesses einer Mehrzahl von physikalischen Objekten A method, apparatus, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects |
| 05/27/2004 | DE10252613A1 Verfahren, Vorrichtung, computerlesbares Speichermedium und Computerprogramm-Element zum Überwachen eines Herstellungsprozesses A method, apparatus, computer-readable storage medium and computer program element for the monitoring of a manufacturing process |
| 05/27/2004 | DE10252606A1 Verfahren, Vorrichtung, computerlesbares Speichermedium und Computerprogramm-Element zur rechnergestützten Überwachung eines Prozessparameters eines Herstellungsprozesses eines physikalischen Objekts A method, apparatus, computer-readable storage medium and computer program element for the computer-aided monitoring of a process parameter of a manufacturing process of a physical object |
| 05/27/2004 | DE10252577A1 Connecting solder partners used in die bonding or chip bonding comprises heating the solder partners so that a solder depot melts and is pulled by capillary forces into a joining region to join the solder partners |
| 05/27/2004 | DE10252058A1 Semiconducting arrangement has lines of first or second type running from inner to outer region, lines of the other type running around inner region so as to enclose it, auxiliary area in inner region |
| 05/27/2004 | DE10196869T5 Substratfehlerreparaturvorrichtung Substrate defect repairing device |
| 05/27/2004 | CA2800957A1 Semiconductor substrate having copper/diamond composite material and method of making same |
| 05/26/2004 | EP1422986A1 Chip transfer station for a bonding machine |
| 05/26/2004 | EP1422766A2 Method of fabrication of electronic devices using microfluidic channels |
| 05/26/2004 | EP1422760A2 Thin film transistors and organic electroluminescent device using the same |
| 05/26/2004 | EP1422759A1 Semiconductor device and production method thereof |
| 05/26/2004 | EP1422757A1 Semiconductor radiating substrate and production method therefor and package |
| 05/26/2004 | EP1422755A2 Dual work function gate electrodes using doped polysilicon and a metal silicon germanium compound |
| 05/26/2004 | EP1422754A1 Ceramic joint body |
| 05/26/2004 | EP1422753A1 Production method for anneal wafer and anneal wafer |
| 05/26/2004 | EP1422752A1 Forming method and forming system for insulation film |
| 05/26/2004 | EP1422751A2 Method of plasma etching high-K dielectric materials with high selectivity to underlying layers |
| 05/26/2004 | EP1422750A1 Method and apparatus for splitting semiconducor wafer |
| 05/26/2004 | EP1422749A1 Purging method for semiconductor production device and production method for semiconductor device |
| 05/26/2004 | EP1422748A1 Group iii nitride semiconductor film and its production method |
| 05/26/2004 | EP1422747A1 APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR CLEANING SEMICONDUCTOR PRODUCING APPARATUS |
| 05/26/2004 | EP1422746A2 Monocrystalline gallium nitride localized substrate and manufacturing method thereof |
| 05/26/2004 | EP1422745A2 Method for fabricating a sige film, substrate for epitaxial growth and multilayered structure |
| 05/26/2004 | EP1422744A2 Method of manufacturing integrated circuit resistors in a CMOS process |
| 05/26/2004 | EP1422743A1 Treatment system |
| 05/26/2004 | EP1422742A2 System for processing semiconductor wafers |
| 05/26/2004 | EP1422727A1 Composition for thin−film capacitive device, high−dielectric constant insulating film, thin−film capacitive device, and thin−film mulitlayer ceramic capacitor |
| 05/26/2004 | EP1422721A2 Magnetic memory device, write current drive circuit, and write current drive method |
| 05/26/2004 | EP1422720A2 Magnetic random access memory |
| 05/26/2004 | EP1422571A2 Stage apparatus and method of controlling the same |
| 05/26/2004 | EP1422569A2 Movement control in a lithographic apparatus |
| 05/26/2004 | EP1422568A2 Method and apparatus for isolating light source gas from main chamber gas in a lithography tool |
| 05/26/2004 | EP1422566A1 Multilayer photoresist systems |
| 05/26/2004 | EP1422565A2 Multilayer photoresist systems |
| 05/26/2004 | EP1422562A1 Reticle and optical characteristic measuring method |
| 05/26/2004 | EP1422320A1 Copper electroplating bath |
| 05/26/2004 | EP1422317A1 Gas treating device and gas treating method |
| 05/26/2004 | EP1422316A1 Method for cleaning reaction container and film deposition system |
| 05/26/2004 | EP1422314A1 Dispositive and process to clean process chambers and vacuum lines |
| 05/26/2004 | EP1422279A1 Semiconductor package with a die attach adhesive having silane functionality |
| 05/26/2004 | EP1422251A2 Unsaturated compounds containing silane, electron donor and electron acceptor functionality |
| 05/26/2004 | EP1422192A1 Process to fabricate a Tool Insert for Injection Moulding a two-level microstructured Piece |