| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/27/2004 | WO2004044992A1 Double gate semiconductor device having separate gates |
| 05/27/2004 | WO2004044991A1 Thin film transistor array panel and manufacturing method thereof |
| 05/27/2004 | WO2004044990A1 One transistor dram cell structure and method for forming |
| 05/27/2004 | WO2004044989A1 Grounded gate and isolation techniques for reducing dark current in cmos image sensors |
| 05/27/2004 | WO2004044983A1 Semiconductor device and method therefor |
| 05/27/2004 | WO2004044981A1 Semiconductor integrated device and method for manufacturing same |
| 05/27/2004 | WO2004044980A2 Hermetically encapsulated component and waferscale method for the production thereof |
| 05/27/2004 | WO2004044979A1 Side wall passivation films for damascene cu/low k electronic devices |
| 05/27/2004 | WO2004044978A1 Reliable low-k interconnect structure with hybrid dielectric |
| 05/27/2004 | WO2004044977A1 Semiconductor device channel termination |
| 05/27/2004 | WO2004044976A1 Method for forming a brittle zone in a substrate by co-implantation |
| 05/27/2004 | WO2004044975A1 Semiconductor structure, and methods for fabricating same |
| 05/27/2004 | WO2004044974A2 Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
| 05/27/2004 | WO2004044973A1 Planarizing gate material to improve gate critical dimension in semiconductor devices |
| 05/27/2004 | WO2004044972A1 Composition for porous film formation, porous films, process for production of the films, interlayer dielectrics, and semiconductor devices |
| 05/27/2004 | WO2004044971A1 Method and device for polishing plasma chamber cathode holes |
| 05/27/2004 | WO2004044969A1 Valve unit and heat treatment system |
| 05/27/2004 | WO2004044968A1 Exposure device, exposure method, and semiconductor device manufacturing method |
| 05/27/2004 | WO2004044967A1 Method for manufacturing transfer mask substrate, transfer mask substrate, and transfer mask |
| 05/27/2004 | WO2004044965A2 Method of producing semiconductor device |
| 05/27/2004 | WO2004044964A1 Advanced mask cleaning and handling |
| 05/27/2004 | WO2004044963A2 Atomic layer deposition methods |
| 05/27/2004 | WO2004044962A1 Forced convection assisted rapid thermal furnace |
| 05/27/2004 | WO2004044961A1 Apparatus and method for reducing stray light in substrate processing chambers |
| 05/27/2004 | WO2004044960A2 Thermal interface composite structure and method of making same |
| 05/27/2004 | WO2004044958A2 Composition and method for low temperature deposition of silicon-containing films |
| 05/27/2004 | WO2004044956A2 Rear interconnect blade for rack mounted systems |
| 05/27/2004 | WO2004044954A2 Gcib processing of integrated circuit interconnect structures |
| 05/27/2004 | WO2004044953A2 High pressure compatible vacuum check for semiconductor wafer including lift mechanism |
| 05/27/2004 | WO2004044921A2 Nonvolatile memory array using unified cell structure in divided-well allowing write operation with no disturb |
| 05/27/2004 | WO2004044918A1 Semiconductor storage device |
| 05/27/2004 | WO2004044917A2 A combination nonvolatile memory using unified technology with byte, page and block write and simultaneous read and write operations |
| 05/27/2004 | WO2004044898A2 Nitridation of high-k dielectrics |
| 05/27/2004 | WO2004044660A2 Probability constrained optimization for electrical fabrication control |
| 05/27/2004 | WO2004044655A1 Method for the bulk machining of fluoropolymer substrates |
| 05/27/2004 | WO2004044596A2 Defect analyzer |
| 05/27/2004 | WO2004044500A1 Gas heating method and gas heating device |
| 05/27/2004 | WO2004044273A1 Electropolishing system and process |
| 05/27/2004 | WO2004044263A1 Device for carrying out a surface treatment of substrates under vacuum |
| 05/27/2004 | WO2004044092A1 Fluorinated surfactants for aqueous acid etch solutions |
| 05/27/2004 | WO2004044091A1 Fluorinated surfactants for buffered acid etch solutions |
| 05/27/2004 | WO2004044081A1 Organic acid containing compositions and methods for use thereof |
| 05/27/2004 | WO2004044076A1 A slurry composition and a polishing method using the same |
| 05/27/2004 | WO2004044075A2 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents |
| 05/27/2004 | WO2004044074A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044073A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044072A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device |
| 05/27/2004 | WO2004044053A1 Toughened epoxy/polyanhydride no- flow underfill encapsulant composition |
| 05/27/2004 | WO2004043850A2 An integrated structure and method for fabricating the same |
| 05/27/2004 | WO2004043673A1 Resin seal device |
| 05/27/2004 | WO2004043653A1 Device for correcting reference position for transfer mechanism, and correction method |
| 05/27/2004 | WO2004043648A1 Polishing apparatus |
| 05/27/2004 | WO2004038783A3 Pecvd of organosilicate thin films |
| 05/27/2004 | WO2004034476A3 Flip chip imaging sensor |
| 05/27/2004 | WO2004034468A9 Flash memory array with increased coupling between floating and control gates |
| 05/27/2004 | WO2004033158A3 Substrate handling system for aligning and orienting substrates during a transfer operation |
| 05/27/2004 | WO2004030029A3 Conducting polymer devices for inter-converting light and electricity |
| 05/27/2004 | WO2004026531A3 Device and method for connecting objects |
| 05/27/2004 | WO2004019373A3 Nanocrystal electron device |
| 05/27/2004 | WO2004017071A3 Method for joining surfaces, semiconductor with joined surfaces, bio-chip and bio-sensor |
| 05/27/2004 | WO2004009861A8 Method to form ultra high quality silicon-containing compound layers |
| 05/27/2004 | WO2004009299B1 Loading and unloading device for a coating unit |
| 05/27/2004 | WO2004008816A8 Method and device for substrate etching with very high power inductively coupled plasma |
| 05/27/2004 | WO2004008503A9 Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules |
| 05/27/2004 | WO2004008496A3 Non-oriented optical character recognition of a wafer mark |
| 05/27/2004 | WO2004008493A3 Method and apparatus for supporting semiconductor wafers |
| 05/27/2004 | WO2004007793A3 Method and apparatus for providing gas to a processing chamber |
| 05/27/2004 | WO2004006315A3 Semiconductor capacitor and mosfet fitted therewith |
| 05/27/2004 | WO2004006306A3 Method for controlling the extent of notch or undercut in an etched profile using optical reflectometry |
| 05/27/2004 | WO2004006300B1 Organic contact-enhancing layer for organic field effect transistors |
| 05/27/2004 | WO2004001808A3 Method and system for atomic layer removal and atomic layer exchange |
| 05/27/2004 | WO2003100823A3 Control of contact resistance in quantum well intermixed devices |
| 05/27/2004 | WO2003098706A3 Method for fixing a semiconductor chip in a plastic housing body, optoelectronic semiconductor component |
| 05/27/2004 | WO2003094200A3 Low voltage high density trench-gated power device with uniformly doped channel and its edge termination technique |
| 05/27/2004 | WO2003088340A3 Method for the production of structured layers on substrates |
| 05/27/2004 | WO2003087431B1 Deposition methods utilizing phased array microwave excitation, and deposition apparatuses |
| 05/27/2004 | WO2003076891A3 Moiré method and measuring system for measuring the distortion of an optical imaging system |
| 05/27/2004 | WO2003069658B1 Strained si based layer made by uhv-cvd, and devices therein |
| 05/27/2004 | WO2003062139A3 Activation effect on carbon nanotubes |
| 05/27/2004 | WO2003049178A3 Semiconductor power device metal structure and method of formation |
| 05/27/2004 | WO2003042072A8 A bag |
| 05/27/2004 | WO2003041154A3 A method of manufacturing a plurality of assemblies |
| 05/27/2004 | WO2003036387A3 Method of forming a pattern of sub-micron broad features |
| 05/27/2004 | WO2003034500A3 Trench-gate semiconductor devices and their manufacture |
| 05/27/2004 | WO2003030214A3 Method of manufacturing an integrated circuit, integrated circuit obtained in accordance with said method, wafer provided with an integrated circuit obtained in accordance with the method, and system comprising an integrated circuit obtained by means of the method |
| 05/27/2004 | WO2003023863A3 Trench-gate semiconductor devices and their manufacture |
| 05/27/2004 | WO2003023820A8 Boat for ball attach manufacturing process and method of fabricating reliable flip-chip assembly |
| 05/27/2004 | WO2003015152A3 Method of manufacturing a semiconductor non-volatile memory |
| 05/27/2004 | WO2003001584A8 A non-self-aligned sige heterojunction bipolar transistor |
| 05/27/2004 | WO2002101784B1 Plasma processor |
| 05/27/2004 | WO2002097145B1 Compositions, methods and devices for high temperature lead-free solder |
| 05/27/2004 | WO2002046975A9 Routing method and apparatus |
| 05/27/2004 | WO2000066969A3 Interferometry system having a dynamic beam-steering assembly for measuring angle and distance |
| 05/27/2004 | US20040103388 First approximation for OPC significant speed-up |
| 05/27/2004 | US20040103385 Method of ITO layout to make IC bear the high-volt electrostatic discharge |
| 05/27/2004 | US20040103384 Parasitic element extraction apparatus |
| 05/27/2004 | US20040103382 Master slice semiconductor integrated circuit |
| 05/27/2004 | US20040103357 Semiconductor testing device |
| 05/27/2004 | US20040103353 Failure analysis method |
| 05/27/2004 | US20040102912 Automatic calibration of a masking process simulator |