Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/25/2004US6740582 Integrated circuits and methods for their fabrication
05/25/2004US6740580 Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier
05/25/2004US6740579 Method of making a semiconductor device that includes a dual damascene interconnect
05/25/2004US6740577 Method of forming a small pitch torch bump for mounting high-performance flip-flop devices
05/25/2004US6740576 Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly
05/25/2004US6740575 Method for forming an antifuse
05/25/2004US6740574 Methods of forming DRAM assemblies, transistor devices, and openings in substrates
05/25/2004US6740573 Method for forming an integrated circuit interconnect using a dual poly process
05/25/2004US6740572 Method for fabricating CMOS transistor of a semiconductor device
05/25/2004US6740571 Method of etching a dielectric material in the presence of polysilicon
05/25/2004US6740570 Method for forming a self-aligned silicide of a metal oxide semiconductor
05/25/2004US6740569 Method of fabricating polysilicon film by excimer laser annealing process
05/25/2004US6740568 Method to enhance epitaxial regrowth in amorphous silicon contacts
05/25/2004US6740567 Laminating method for forming integrated circuit microelectronic fabrication
05/25/2004US6740566 Ultra-thin resist shallow trench process using high selectivity nitride etch
05/25/2004US6740565 Process for fabrication of a SIMOX substrate
05/25/2004US6740564 Method for manufacturing a semiconductor device
05/25/2004US6740563 Amorphizing ion implant method for forming polysilicon emitter bipolar transistor
05/25/2004US6740562 Manufacturing method of a semiconductor device having a polysilicon electrode
05/25/2004US6740561 Method of manufacturing a semiconductor device
05/25/2004US6740560 Bipolar transistor and method for producing same
05/25/2004US6740559 Semiconductor device comprising MIS field-effect transistor, and method of fabricating the same
05/25/2004US6740558 SiGe vertical gate contact for gate conductor post etch treatment
05/25/2004US6740557 Spacer like floating gate formation
05/25/2004US6740556 Method for forming EPROM with low leakage
05/25/2004US6740555 Semiconductor structures and manufacturing methods
05/25/2004US6740554 Methods to form rhodium-rich oxygen barriers
05/25/2004US6740553 Capacitor for semiconductor memory device and method of manufacturing the same
05/25/2004US6740552 Method of making vertical diode structures
05/25/2004US6740551 Method of manufacturing a semiconductor integrated circuit
05/25/2004US6740550 Methods of manufacturing semiconductor devices having chamfered silicide layers therein
05/25/2004US6740549 Gate structures having sidewall spacers using selective deposition and method of forming the same
05/25/2004US6740548 Method of manufacture of silicon on insulator device with improved heat removal
05/25/2004US6740547 Method for fabricating thin-film transistor
05/25/2004US6740544 Solder compositions for attaching a die to a substrate
05/25/2004US6740543 Method and apparatus for encapsulating articles by stencil printing
05/25/2004US6740541 Unmolded package for a semiconductor device
05/25/2004US6740539 Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates
05/25/2004US6740536 Devices and methods for integrated circuit manufacturing
05/25/2004US6740535 Enhanced T-gate structure for modulation doped field effect transistors
05/25/2004US6740534 Determination of a process flow based upon fault detection analysis
05/25/2004US6740533 Semiconductor device having a ferroelectric capacitor and fabrication process thereof
05/25/2004US6740532 Method of manufacturing a ferroelectric thin film
05/25/2004US6740531 Method of fabricating integrated circuit devices having dielectric regions protected with multi-layer insulation structures
05/25/2004US6740473 Method for shrinking critical dimension of semiconductor devices
05/25/2004US6740471 Improving adhesion between an inorganic anti-reflective coatinglayer and photoresist; roughening
05/25/2004US6740469 Developer-soluble metal alkoxide coatings for microelectronic applications
05/25/2004US6740459 Method of designing photosensitive composition and lithography process
05/25/2004US6740456 Method of correcting a photomask and method of manufacturing a semiconductor device
05/25/2004US6740455 Simplification of lithography
05/25/2004US6740427 Thermo-mechanically robust C4 ball-limiting metallurgy to prevent failure due to die-package interaction and method of making same
05/25/2004US6740416 Functional thin film formed uniformly on aerogel surface; layers can be infrared reflective film, optical wavequide, electroconductive, fluorescent; intermediate layer is copper phthalocyanine for electroconductive functional layer
05/25/2004US6740411 Embedding resin, wiring substrate using same and process for producing wiring substrate using same
05/25/2004US6740392 Surface barriers for copper and silver interconnects produced by a damascene process
05/25/2004US6740368 Beam shaped film pattern formation method
05/25/2004US6740367 Plasma CVD film-forming device
05/25/2004US6740351 Method for production of a regular multi-layer construction, in particular for electrical double layer capacitors and the corresponding device
05/25/2004US6740252 Potassium hypochlorite, hydrofluoric acid and deionized water
05/25/2004US6740248 Method for etching dielectric films
05/25/2004US6740247 HF vapor phase wafer cleaning and oxide etching
05/25/2004US6740242 For forming an interconnection by embedding copper in fine interconnection groove defined in surface of semiconductor substrate through copper sulfate plating
05/25/2004US6740221 Positioning substrate in an electroplating bath; forming doped copper layer on substrate; wherein the doped copper layer comprises an amount of non-metal that is controlled for increasing electromigration resistance in doped copper layer
05/25/2004US6740208 Photo mask blank and method of manufacturing the same
05/25/2004US6740207 Plasma discharge is at least conjointly supplied by means of high frequency (hf) energy, wherein the hf supply of the plasma discharge is briefly deactivated.
05/25/2004US6740196 RTA chamber with in situ reflective index monitor
05/25/2004US6740195 Detection of nontransient processing anomalies in vacuum manufacturing process
05/25/2004US6740194 Apparatus for etching or depositing a desired profile onto a surface
05/25/2004US6740183 Method of producing ceramic multi-layered substrate
05/25/2004US6740171 Manufacturing method of semiconductor integrated circuit device
05/25/2004US6740170 Apparatus and method for cleaning peripheral part of substrate
05/25/2004US6740169 Immersing the conditioning disk which has been used in a cmp process in sulfuric acid in order to dissolve adhesive film and remove abrasive grains; new adhesive layers and abrasive grains are then applied
05/25/2004US6740167 Device for mounting a substrate and method for producing an insert for a susceptor
05/25/2004US6740166 Thin film deposition apparatus for semiconductor
05/25/2004US6740164 Plating apparatus and method of manufacturing semiconductor device
05/25/2004US6740163 Photoresist recirculation and viscosity control for dip coating applications
05/25/2004US6740160 Crystal growing apparatus
05/25/2004US6739958 Carrier head with a vibration reduction feature for a chemical mechanical polishing system
05/25/2004US6739954 Grinding pin for grinding machines comprising resin bonded selections of rough grit and fine grit
05/25/2004US6739953 Mechanical stress free processing method
05/25/2004US6739951 Method and apparatus for electrochemical-mechanical planarization
05/25/2004US6739947 In situ friction detector method and apparatus
05/25/2004US6739945 Polishing pad with built-in optical sensor
05/25/2004US6739939 Toy top game unit
05/25/2004US6739820 Stocker apparatus with increased input/output capacity
05/25/2004US6739638 Work transfer device
05/25/2004US6739498 Solder ball attachment system
05/25/2004US6739497 SMT passive device noflow underfill methodology and structure
05/25/2004US6739495 Friction stir welding method and component part welded by the method
05/25/2004US6739494 Device with electrodes for the formation of a ball at the end of a wire
05/25/2004US6739493 Device with an electrode for the formation of a ball at the end of a wire
05/25/2004US6739360 Liner for use in processing chamber
05/25/2004US6739326 Semiconductor manufacturing equipment
05/25/2004US6739286 Automated foot bath apparatus and method
05/25/2004US6739208 Method of delivering target object to be processed, table mechanism of target object and probe apparatus
05/25/2004US6739048 Process of fabricating a circuitized structure
05/25/2004US6739047 Low temperature co-fired ceramic circuit boards with metal support substrates; patterning the metal support to provide openings prior to mounting one or more high power modules, and applying solder pads to both sides
05/25/2004US6739046 Method for producing dendrite interconnect for planarization
05/25/2004US6739045 Method for removing solder bumps from LSI
05/25/2004US6739013 Wafer cleaning apparatus
05/25/2004CA2238952C Low resistance contact semiconductor diode