Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/25/2004US6741492 Semiconductor memory device
05/25/2004US6741447 Wafer space supporting apparatus installed on electrostatic chuck and method for fabricating the same
05/25/2004US6741446 Vacuum plasma processor and method of operating same
05/25/2004US6741445 Method and system to monitor and control electro-static discharge
05/25/2004US6741358 Exposure apparatus and device production method in which position of reference plate provided on substrate stage is measured
05/25/2004US6741334 Exposure method, exposure system and recording medium
05/25/2004US6741331 Lithographic apparatus with improved exposure area focus, device manufacturing method, and device manufactured thereby
05/25/2004US6741330 Exposure device
05/25/2004US6741329 Lithographic apparatus and device manufacturing method
05/25/2004US6741327 Eliminating residual pattern aberration
05/25/2004US6741320 Method for cutting liquid crystal display panel
05/25/2004US6741297 Control signal part and liquid crystal display including the control signal
05/25/2004US6741118 Semiconductor integrated circuit device and method of manufacturing the same
05/25/2004US6741100 Semiconductor integrated circuit capable of high-speed circuit operation
05/25/2004US6741093 Method of determining one or more properties of a semiconductor wafer
05/25/2004US6741086 Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
05/25/2004US6741085 Contact carriers (tiles) for populating larger substrates with spring contacts
05/25/2004US6741044 Lamp lighting controlling apparatus and light emitting apparatus
05/25/2004US6741029 Light emission apparatus and method of fabricating the same
05/25/2004US6740998 Single motor, multi-axis stage
05/25/2004US6740982 Microelectronic package with an attachment layer including spacer elements
05/25/2004US6740980 Semiconductor device
05/25/2004US6740979 Semiconductor device and LSI defect analyzing method using the same
05/25/2004US6740977 Insulating layers in semiconductor devices having a multi-layer nanolaminate structure of SiNx thin film and BN thin film and methods for forming the same
05/25/2004US6740976 Semiconductor device including via contact plug with a discontinuous barrier layer
05/25/2004US6740974 Semiconductor device having capacitors provided with protective insulating film
05/25/2004US6740969 Electronic device
05/25/2004US6740966 Bendable; no removal required
05/25/2004US6740964 Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device
05/25/2004US6740961 Lead frame design for chip scale package
05/25/2004US6740955 Trench device isolation structure
05/25/2004US6740954 Semiconductor device reducing junction leakage current and narrow width effect
05/25/2004US6740953 High frequency integrated devices
05/25/2004US6740952 High withstand voltage semiconductor device
05/25/2004US6740951 Two-mask trench schottky diode
05/25/2004US6740950 Eliminates air gap between glass and die
05/25/2004US6740947 MRAM with asymmetric cladded conductor
05/25/2004US6740945 Apparatus and method for contacting a conductive layer
05/25/2004US6740944 Having thicker oxide layer at one or more gate ends
05/25/2004US6740943 MOSFET transistor with thick and thin pad oxide films
05/25/2004US6740942 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact
05/25/2004US6740941 Semiconductor device including a gate insulating film made of high-dielectric-constant material
05/25/2004US6740939 Miniaturization; accuracy; high and low voltage zones
05/25/2004US6740938 Transistor provided with first and second gate electrodes with channel region therebetween
05/25/2004US6740937 Basic cells configurable into different types of semiconductor integrated circuits
05/25/2004US6740935 Semiconductor device
05/25/2004US6740934 ESD protection scheme for outputs with resistor loading
05/25/2004US6740933 Semiconductor device having trench isolation structure and method of fabricating the same
05/25/2004US6740932 Semiconductor device for improving sustaining voltage
05/25/2004US6740931 Semiconductor device
05/25/2004US6740927 Nonvolatile memory capable of storing multibits binary information and the method of forming the same
05/25/2004US6740926 Planar transistor structure using isolation implants for improved Vss resistance and for process simplification
05/25/2004US6740925 Memory device comprising single transistor having functions of RAM and ROM and methods for operating and manufacturing the same
05/25/2004US6740924 Semiconductor integrated circuit device and the method of producing the same
05/25/2004US6740923 Capacitor structure
05/25/2004US6740922 Interdigitated capacitor and method of manufacturing thereof
05/25/2004US6740920 Vertical MOSFET with horizontally graded channel doping
05/25/2004US6740919 Ram
05/25/2004US6740918 Semiconductor memory device
05/25/2004US6740917 Integrated semiconductor memory fabrication method
05/25/2004US6740916 Contact structure for integrated circuit devices
05/25/2004US6740915 CMOS imager cell having a buried contact
05/25/2004US6740913 MOS transistor using mechanical stress to control short channel effects
05/25/2004US6740912 Semiconductor device free of LLD regions
05/25/2004US6740910 Field-effect transistor, circuit configuration and method of fabricating a field-effect transistor
05/25/2004US6740909 Self aligned symmetric intrinsic process and device
05/25/2004US6740902 Semiconductor package for series-connected diodes
05/25/2004US6740901 Production of semiconductor integrated circuit
05/25/2004US6740896 Sensitivity adjusting method for pattern inspection apparatus
05/25/2004US6740895 Method and apparatus for emission lithography using patterned emitter
05/25/2004US6740893 Optical instrument, and device manufacturing method
05/25/2004US6740891 Lithographic apparatus, device manufacturing method, and device manufactured thereby
05/25/2004US6740856 Preformed heating element and method of making
05/25/2004US6740853 Multi-zone resistance heater
05/25/2004US6740842 Radio frequency power source for generating an inductively coupled plasma
05/25/2004US6740823 Solder bonding method, and electronic device and process for fabricating the same
05/25/2004US6740811 Electric terminal for an electronic device
05/25/2004US6740685 A thermosetting resin contains an acetylenic oligomer or polymer with multi-phenyl adamantane ring, and bonded with porogen which can decompose to form pore; use as dielectric substrate in microchips, circuit boards
05/25/2004US6740629 Comprises a component for rendering a water-insoluble compound containing a metal atom or its ion separated from a surface to be polished water-soluble
05/25/2004US6740605 Process for reducing hydrogen contamination in dielectric materials in memory devices
05/25/2004US6740604 Method of separating two layers of material from one another
05/25/2004US6740603 Control of Vmin transient voltage drift by maintaining a temperature less than or equal to 350° C. after the protective overcoat level
05/25/2004US6740602 Method of forming low-dielectric constant film on semiconductor substrate by plasma reaction using high-RF power
05/25/2004US6740601 HDP-CVD deposition process for filling high aspect ratio gaps
05/25/2004US6740598 Wiring layer dry etching method and semiconductor device manufacturing method
05/25/2004US6740597 Methods of removing at least some of a material from a semiconductor substrate
05/25/2004US6740596 Manufacturing method of active matrix substrate
05/25/2004US6740595 Etch process for recessing polysilicon in trench structures
05/25/2004US6740594 Method for removing carbon-containing polysilane from a semiconductor without stripping
05/25/2004US6740593 Semiconductor processing methods utilizing low concentrations of reactive etching components
05/25/2004US6740592 Shallow trench isolation scheme for border-less contact process
05/25/2004US6740591 Slurry and method for chemical mechanical polishing of copper
05/25/2004US6740590 Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writing
05/25/2004US6740589 Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the same
05/25/2004US6740588 Smooth metal semiconductor surface and method for making the same
05/25/2004US6740587 Semiconductor device having a metal silicide layer and method for manufacturing the same
05/25/2004US6740586 Vapor delivery system for solid precursors and method of using same
05/25/2004US6740585 Barrier formation using novel sputter deposition method with PVD, CVD, or ALD
05/25/2004US6740584 Semiconductor device and method of fabricating the same
05/25/2004US6740583 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry