Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2004
05/19/2004EP0846191A4 Plasma device and method utilizing azimuthally and axially uniform electric field
05/19/2004EP0826231A4 Integrated semiconductor wafer processing system
05/19/2004EP0764352B1 Microelectronic contacts and assemblies
05/19/2004DE4333989B4 Verfahren zur Herstellung eines Kondensators in einem Halbleiterspeicherbauelement A method for manufacturing a capacitor in a semiconductor memory device
05/19/2004DE20319848U1 Appliance for cleaning both surfaces of semiconductor wafers and disc workpieces sweeps both surfaces with brush modules moving vertically and horizontally and also rotating sponge brushes
05/19/2004DE19821092B4 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
05/19/2004DE10350137A1 Halbleitereinrichtung Semiconductor device
05/19/2004DE10348870A1 Ein Verfahren und eine Schaltung zum Steuern des Durchbrennens von Schmelzelementen A method and a circuit for controlling the burning of fuse elements
05/19/2004DE10339915A1 Entwicklungsverfahren, Substratbehandlungsverfahren und Substratsbehandlungseinrichtung Development process, substrate processing method and substrate processing apparatus
05/19/2004DE10261343A1 Verfahren zur Konstruktion einer Halbleitervorrichtung A process for the construction of a semiconductor device
05/19/2004DE10252556B3 Production of an electronic component having external contact elements comprises preparing a metal plate having several component positions, forming recesses in one upper side of the plate, and further processing
05/19/2004DE10251650A1 Behälter zum Aufbewahren und Transportieren von empfindlichen plättchenförmigen Gegenständen A container for storing and transporting photosensitive plate-like objects
05/19/2004DE10250984A1 Feldeffekttransistor sowie Verfahren zu seiner Herstellung Field effect transistor, and methods for its preparation
05/19/2004DE10250915A1 Deposition of material on silicon carbide substrate wafer, comprises preparing wafer with growth- and thermal radiation absorption surfaces, then heating wafer for MOVPE deposition
05/19/2004DE10250902A1 Production of semiconductor structural element used in production of integrated circuits comprises preparing substrate with a layer, covering substrate with second material layer, implanting ions, and further processing
05/19/2004DE10250899A1 Verfahren zum Entfernen von Seitenwandabstandselementen eines Halbleiterelements unter Anwendung eines verbesserten Ablöseprozesses A process for removing sidewall spacers of a semiconductor element using an improved release process
05/19/2004DE10250888A1 Halbleiterelement mit verbesserten Dotierprofilen und ein Verfahren zur Herstellung der Dotierprofile eines Halbleiterelements Semiconductor element with improved doping profiles and a method for producing the doping profiles of a semiconductor element
05/19/2004DE10250872A1 Semiconductor structure production with gate stacks on substrate, comprises application of gate stacks, sidewall oxide and mask, followed by contact doping
05/19/2004DE10250868A1 Vertikal integriertes Bauelement, Bauelement-Anordnung und Verfahren zum Herstellen eines vertikal integrierten Bauelements Vertically integrated component, component arrangement and method for manufacturing a vertically integrated component
05/19/2004DE10250840A1 Single-crystal silicon-on-insulator field effect transistor production, includes ion implantation to produce localized defects, and tempering to form oxide clusters
05/19/2004DE10250834A1 Speicherzelle, Speicherzellen-Anordnung, Strukturier-Anordnung und Verfahren zum Herstellen einer Speicherzelle Memory cell, memory cell arrangement, texturing arrangement and method for manufacturing a memory cell
05/19/2004DE10250829A1 Nichtflüchtige Speicherzelle, Speicherzellen-Anordnung und Verfahren zum Herstellen einer nichtflüchtigen Speicherzelle A non-volatile memory cell, memory cell arrangement and method of manufacturing a non-volatile memory cell
05/19/2004DE10250823A1 Carrier disc and process for simultaneous two sided processing of workpieces such as silicon wafers has smooth steel body with plastic coated openings
05/19/2004DE10250621A1 Process for producing encapsulated chips, involves separates chipping with contacts from a wafer and spray coating to encapsulate and applying wiring structure
05/19/2004DE10250611A1 Verfahren zur Herstellung eines Nickelsilizidgebietes in einem dotierten Silizium enthaltenden Halbleiterbereich A method for producing a Nickelsilizidgebietes in a doped silicon-containing semiconductor region
05/19/2004DE10250538A1 Electronic component with two or more semiconductor chips, has circuit carrier flush with active surface of chips, forming fine wiring plane with contact terminals at edges
05/19/2004DE10250364A1 Filling irregularities and intermediate cavities during surface structuring on semiconductor, employs flow-fill process using filler of low dielectric constant
05/19/2004DE10250357A1 Ferroelektrische Speicherzelle A ferroelectric memory cell
05/19/2004DE10250353A1 Einrichtung zur Detektion von übereinander mit einem bestimmten Abstand angeordneten Substraten Means for detecting one above the other with a certain distance disposed substrates
05/19/2004DE10249569A1 Work-tool head for fixing electrical conductor on contact surface of substrate e.g. for microprocessors, uses converter for converting linear oscillations into radial oscillations
05/19/2004DE10153315B4 Halbleiterbauelement Semiconductor device
05/19/2004DE10029919B4 Umsetzverfahren für programmierbare elektronische Bauelemente und hiermit korrespondierende Umsetzeinrichtung Conversion method for programmable electronic components and corresponding thereto converting
05/19/2004CN2617031Y Apparatus for injecting self-cleaning ion into system cavity
05/19/2004CN2617030Y Silicon and silicon vacuum bonding device
05/19/2004CN1498520A Method of manufacturing electronic part and electronic part obtained by the method
05/19/2004CN1498424A Semiconductor memory device and its manufacturing method
05/19/2004CN1498420A Mask sheet for assembling semiconductor device and method for assembling semiconductor device
05/19/2004CN1498419A Semiconductor chip pickup device
05/19/2004CN1498418A System and method of providing mask defect printablity analysis
05/19/2004CN1498417A Method for assembling components and antenna in radio frequency identification devices
05/19/2004CN1498415A Infrared end-point detecting system
05/19/2004CN1498361A Polymers and photoresist compositions
05/19/2004CN1498360A Polymers blends and their use in photoresist compositions for microlithography
05/19/2004CN1498328A Method and system for treating exhaust gas
05/19/2004CN1498285A Method for depositing coating having relatively high dielectric constant onto substrate
05/19/2004CN1498064A Forming method of welding convex point
05/19/2004CN1498063A Manufacturing method of circuit device
05/19/2004CN1498057A Induction coupling plasma generating equipment containing zigzag coil antenna
05/19/2004CN1498056A Radiation source, photoetching equipment and device manufacturing method
05/19/2004CN1497957A Solid-state camera element and its manufacturing method
05/19/2004CN1497826A Simple boost device of level shift circuit including allowable low breakdown voltage
05/19/2004CN1497816A Protective circuit for battery charging
05/19/2004CN1497743A Device with nitrides system heterogenous structure and its manufacturing method
05/19/2004CN1497740A 半导体装置 Semiconductor device
05/19/2004CN1497739A Semiconductor device and its manufacturing method
05/19/2004CN1497738A Semiconductor device and its manufacturing method
05/19/2004CN1497737A Semiconductor device and its manufacturing method
05/19/2004CN1497736A Semiconductor device and its manufacturing method
05/19/2004CN1497735A Ferroelectric memory transistor and its forming method
05/19/2004CN1497734A 双极型晶体管 Bipolar transistor
05/19/2004CN1497729A Integrated circuit self-testing method based on electric programmed three-D memory
05/19/2004CN1497727A Semiconductor device and its manufacturing method
05/19/2004CN1497724A Semiconductor device and its production method
05/19/2004CN1497723A Semiconductor integrated circuit and its manufactring method
05/19/2004CN1497722A Switching circuit device
05/19/2004CN1497721A Parameter generating circuit for deciding main block priority and method for generating parameter
05/19/2004CN1497720A Packing semiconductor device
05/19/2004CN1497719A Semiconductor device and its manufacturing method
05/19/2004CN1497717A Circuit device and its manufacturing method
05/19/2004CN1497713A Semiconductor device and its manufacturing method
05/19/2004CN1497712A Circuit device and its manufacturing method
05/19/2004CN1497708A Manufacturing method of semiconductor device and manufactured semiconductor device
05/19/2004CN1497707A Method and system for solving timing violation passibility in integrated circuit entity design
05/19/2004CN1497706A Manufacturing method of thin layer. for integrated circuit
05/19/2004CN1497704A Design and manufacturing method of semiconductor memory assembly
05/19/2004CN1497703A Cutting/die-connecting film, method of fixing chip parts and semiconductor equipment
05/19/2004CN1497702A Manufacturing method of imbedded distributing structure
05/19/2004CN1497701A Semiconductor device and metod for manufacturing semiconductor device by metal mosaic process
05/19/2004CN1497700A Semiconductor device and its making method
05/19/2004CN1497699A Pattern copy mask, manufacturing method of semiconductor device and program for making mask pattern
05/19/2004CN1497698A Fault analytical method
05/19/2004CN1497697A Checking method of semiconductor chip
05/19/2004CN1497696A Method and device for testing chip surface
05/19/2004CN1497695A Graphic measuring method, manufacturing method of semiconductor device using it and graphic measuring device
05/19/2004CN1497694A Method for determining optimum bonding parameter when bonding by lead bonding apparatus
05/19/2004CN1497693A Belt for carrying automatic welding
05/19/2004CN1497692A Manufacturing method of circuit device
05/19/2004CN1497691A Manufacturing method of circuit device
05/19/2004CN1497690A Manufacturing method of circuit device
05/19/2004CN1497689A Chip on film semiconductor device and its manufacturing method
05/19/2004CN1497688A Manufacturing method of circuit device
05/19/2004CN1497687A Manufacturing method of circuit device
05/19/2004CN1497686A Method for producing aluminium nitride chip
05/19/2004CN1497685A Method for manufacturing thin film transistor using double or multiple grid
05/19/2004CN1497684A Method of illuminating laser, laser illuminating system and manufacturing method of semiconductor device
05/19/2004CN1497683A Semiconductor with dielectric film comprising porous structure and manufacturing method thereof
05/19/2004CN1497682A 等离子体处理方法 The plasma processing method
05/19/2004CN1497681A Grinding method of using slurry containing resin particle of organic membrane on semiconductor substrate
05/19/2004CN1497680A Semiconductor chip with asymmetric edge contour and manufacturing method thereof
05/19/2004CN1497679A Manufacturing method of semiconductor device