| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/26/2004 | EP1422014A1 Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method |
| 05/26/2004 | EP1421653A1 Laser lithography light source with beam delivery |
| 05/26/2004 | EP1421633A1 Transistor assembly and method for the production thereof |
| 05/26/2004 | EP1421631A1 A method to gaas based lasers and a gaas based laser |
| 05/26/2004 | EP1421630A2 Method of depositing an oxide layer on a substrate and a photovoltaic cell using said substrate |
| 05/26/2004 | EP1421621A2 Electrical discharge circuit |
| 05/26/2004 | EP1421619A2 Connecting the emitter contacts of a semiconductor device |
| 05/26/2004 | EP1421616A2 Method for fixing an electrical element and a module with an electrical element fixed thus |
| 05/26/2004 | EP1421615A2 Electronic devices and methods of manufacture |
| 05/26/2004 | EP1421614A2 Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads |
| 05/26/2004 | EP1421613A1 Method and apparatus for fabricating mercuric iodide polycrystalline films for digital radiography |
| 05/26/2004 | EP1421612A2 Dmos transistor |
| 05/26/2004 | EP1421611A2 Method of cleaning an inter-level dielectric interconnect |
| 05/26/2004 | EP1421610A1 Slurry composition for use in chemical mechanical polishing of metal wiring |
| 05/26/2004 | EP1421609A1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 05/26/2004 | EP1421608A1 Method and system for single ion implantation |
| 05/26/2004 | EP1421607A2 Improved process for deposition of semiconductor films |
| 05/26/2004 | EP1421606A1 Plasma enhanced atomic layer deposition (peald) equipment and method of forming a conducting thin film using the same thereof |
| 05/26/2004 | EP1421605A2 Method for semiconductor gate doping |
| 05/26/2004 | EP1421599A2 Suspended gas distribution manifold for plasma chamber |
| 05/26/2004 | EP1421598A1 Method and apparatus for tuning ion implanters |
| 05/26/2004 | EP1421453A2 Cmp process involving frequency analysis-based monitoring |
| 05/26/2004 | EP1421444A2 Patterning an integrated circuit using a reflective mask |
| 05/26/2004 | EP1421397A1 Delay fault test circuitry and related method |
| 05/26/2004 | EP1421396A2 Providing current control over wafer borne semiconductor devices using trenches |
| 05/26/2004 | EP1421025A1 Substituted donor atoms in silicon crystal for quantum computer |
| 05/26/2004 | EP1301948B1 Semiconductor element comprising a sequence of layers for converting acoustic or thermal signals and electrical voltage changes into each other and method for producing the same |
| 05/26/2004 | EP1275129A4 E-beam/microwave gas jet pecvd method and apparatus for depositing and/or surface modification of thin film materials |
| 05/26/2004 | EP1254401B1 Wafer manufacturing control |
| 05/26/2004 | EP1190209B1 Method and device for measuring the thickness of a layer |
| 05/26/2004 | EP1186019A4 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same |
| 05/26/2004 | EP1163550A4 Hydroxy-amino thermally cured undercoat for 193 nm lithography |
| 05/26/2004 | EP1141444A4 Novel composition for selective etching of oxides over metals |
| 05/26/2004 | EP1023771A4 Electrical impedance matching system and method |
| 05/26/2004 | EP0988407B1 Method for producing coated workpieces, which are coated with an epitactic layer |
| 05/26/2004 | EP0879113B1 Damage-free laser surface treatment method |
| 05/26/2004 | EP0859877B1 Flexible continuous cathode contact circuit for electrolytic plating of c4, tab microbumps, and ultra large scale interconnects |
| 05/26/2004 | CN2618187Y Thin film transistor liquid crystal displaying devices |
| 05/26/2004 | CN1500370A Device and control method for micro wave plasma processing |
| 05/26/2004 | CN1500292A Open bit line dram with vertical ultra-thin body transistors |
| 05/26/2004 | CN1500291A 互补型mis器件 Complementary mis devices |
| 05/26/2004 | CN1500290A Monitoring method of polishing state, monitor of polishing state, polishing appts, processed wafer, semiconductor device mfg. method, and semiconductor device |
| 05/26/2004 | CN1500289A Method for fabrication of high capacitance interpoly dielectric |
| 05/26/2004 | CN1500288A Method of forming strained silicon on insulator (SSDI) and structures formed thereby |
| 05/26/2004 | CN1500287A Method of forming enhanced transistor gate using E-beam radiation and integrated circuit including this transistor gate |
| 05/26/2004 | CN1500286A Appts. and method for creating ultra-clean mini-environment through localized air flow augentation |
| 05/26/2004 | CN1500285A Consecutive deposition system |
| 05/26/2004 | CN1500284A Hybrid scanning system and methods for ion implantation |
| 05/26/2004 | CN1500233A Lithographer comprising mobile lens and method for producing digital holograms in storage medium |
| 05/26/2004 | CN1500204A Method and appts. for endpoint detection using partial least squares |
| 05/26/2004 | CN1500130A Aqueous cleaning compsn. contg. copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate |
| 05/26/2004 | CN1500108A Polyimide copolymer and methods for preparing same |
| 05/26/2004 | CN1500099A Polycyclic fluorine-contg. polymers and photoresists for microlithography |
| 05/26/2004 | CN1500053A System for preventing improper insertion of foup door into foup |
| 05/26/2004 | CN1500042A Compliant pre-form interconnect |
| 05/26/2004 | CN1500030A Method and appts. for end point triggering with integrated steering |
| 05/26/2004 | CN1500029A Appts. and methods for aligning surface of active retainer ring with wafer surface for chemical mechanical polishing |
| 05/26/2004 | CN1500028A Device for controlling eveness of edge polishing |
| 05/26/2004 | CN1499915A Method of mounting electronic part on wiring board |
| 05/26/2004 | CN1499666A Circuit structure in semiconductor integrated circuit for high speed signal |
| 05/26/2004 | CN1499647A Semiconductor film, mfg. method of same, semiconductor device and mfg. method of same |
| 05/26/2004 | CN1499646A Semiconductor device and mfg. method for mfg. same |
| 05/26/2004 | CN1499644A Power semiconductor device |
| 05/26/2004 | CN1499642A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499640A 半导体器件 Semiconductor devices |
| 05/26/2004 | CN1499639A Semiconductor memory with effectively designed inner wiring |
| 05/26/2004 | CN1499638A 存储器宏及半导体集成电路 Memory macros and semiconductor integrated circuit |
| 05/26/2004 | CN1499637A Non-volatile semiconductor storage |
| 05/26/2004 | CN1499636A System combined semiconductor device |
| 05/26/2004 | CN1499635A Semiconductor device contg. insulated grid field transistor, and its mfg. method |
| 05/26/2004 | CN1499634A CMOS component and preparation method |
| 05/26/2004 | CN1499633A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499632A 多功能管脚电路 Multifunction pin circuit |
| 05/26/2004 | CN1499631A Circuit for testing time constant of integrated resistance-capacitance product inside chip |
| 05/26/2004 | CN1499630A Modularized device of stackable semiconductor package and preparing method |
| 05/26/2004 | CN1499629A 半导体装置 Semiconductor device |
| 05/26/2004 | CN1499628A Integrated circuit element with fuse structure including buffering layer, and mfg. method thereof |
| 05/26/2004 | CN1499627A Semiconductor device with fuse |
| 05/26/2004 | CN1499626A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499625A Soldering pad with dual copper inlaid interconnection wire and preparation method |
| 05/26/2004 | CN1499624A Semiconductor device with fraud structure |
| 05/26/2004 | CN1499623A Lead frame, resin sealed semiconductor device and its mfg. method |
| 05/26/2004 | CN1499622A Lead frame, its mfg. method and resin sealed semiconductor device and its mfg. method |
| 05/26/2004 | CN1499621A Semiconductor intergrated circuit device |
| 05/26/2004 | CN1499619A Moulded resin encapsulated power semiconductor device and its mfg. method |
| 05/26/2004 | CN1499617A Semiconductor device and its mfg. method |
| 05/26/2004 | CN1499616A Mfg. tech. of packaged interface substrate wafer having wholly metallized through hole |
| 05/26/2004 | CN1499615A Wiring substrate, circuit substrate, electrooptical device and its mfg. method, and electronic device |
| 05/26/2004 | CN1499612A Method of mfg. semiconductor device |
| 05/26/2004 | CN1499611A Improved isolating structure between units of vertical MOSPET DRAM and method thereof |
| 05/26/2004 | CN1499610A Semiconductor module possessing drain electrode with light adulteration and forming method |
| 05/26/2004 | CN1499609A Irregular metallization for built-in rear terminal structure |
| 05/26/2004 | CN1499608A 半导体装置 Semiconductor device |
| 05/26/2004 | CN1499607A Interconnection method of forming through lining |
| 05/26/2004 | CN1499606A Ultra-low effective dielectric constant interconnection structure and mfg. method thereof |
| 05/26/2004 | CN1499605A Method of forming isolation membrane in semiconductor device |
| 05/26/2004 | CN1499604A Procedure for producing isolation region with shallow groove possessing protection layer for rim angle |
| 05/26/2004 | CN1499603A Fuse wire possessing cover layer and forming method |
| 05/26/2004 | CN1499602A Collimator |
| 05/26/2004 | CN1499601A Evaluation method of semiconductor device, its mfg. method and design management system |