Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/16/2014US20140017900 Plasma etching apparatus and plasma etching method
01/16/2014US20140017899 Double patterning lithography techniques
01/16/2014US20140017898 Method of patterning a low-k dielectric film
01/16/2014US20140017897 Ultra high selectivity doped amorphous carbon strippable hardmask development and integration
01/16/2014US20140017896 Composition for forming pattern reversal film and method for forming reversal pattern
01/16/2014US20140017895 Method to reduce dielectric constant of a porous low-k film
01/16/2014US20140017894 Methods of Manufacturing Semiconductor Devices
01/16/2014US20140017893 Cmp polishing liquid and method for polishing substrate using the same
01/16/2014US20140017892 Compositions and methods for selective polishing of silicon nitride materials
01/16/2014US20140017891 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity
01/16/2014US20140017890 Replacement Contacts for All-Around Contacts
01/16/2014US20140017889 Method for forming fine pattern of semiconductor device using double spacer patterning technology
01/16/2014US20140017888 Salicide process
01/16/2014US20140017887 Semiconductor device and method of manufacturing the same
01/16/2014US20140017885 Method of manufacturing field effect type compound semiconductor device
01/16/2014US20140017884 Method for making Cu2-xSe nanoparticles and method for making deposited Cu2-xSe thin film by electrophoresis
01/16/2014US20140017883 Carbon Layer and Method of Manufacture
01/16/2014US20140017882 Method of coating water soluble mask for laser scribing and plasma etch
01/16/2014US20140017881 Laser scribing and plasma etch for high die break strength and clean sidewall
01/16/2014US20140017880 Laser, plasma etch, and backside grind process for wafer dicing
01/16/2014US20140017879 Uniform masking for wafer dicing using laser and plasma etch
01/16/2014US20140017878 Method of processing a device substrate
01/16/2014US20140017877 Method for permanently bonding wafers
01/16/2014US20140017876 System on a Chip with On-Chip RF Shield
01/16/2014US20140017875 Non-volatile semiconductor memory device and process of manufacturing the same
01/16/2014US20140017874 Semiconductor body with a buried material layer and method
01/16/2014US20140017872 Method for fabricating a metal-insulator-metal capacitor
01/16/2014US20140017870 Method for Inhibiting Programming Disturbance of Flash Memory
01/16/2014US20140017866 Method of Substantially Reducing the Formation of SiGe Abnormal Growths on Polycrystalline Electrodes for Strained-Channel PMOS Transistors
01/16/2014US20140017861 Laser crystallization apparatus and method
01/16/2014US20140017855 Method of manufacturing a ball grid array substrate or a semiconductor chip package
01/16/2014US20140017854 Chip package and fabrication method thereof
01/16/2014US20140017852 Methods for flip chip stacking
01/16/2014US20140017845 Method Of Forming A Photovoltaic Cell Module With A Cell Press
01/16/2014US20140017844 Integrated circuit switches, design structure and methods of fabricating the same
01/16/2014US20140017843 Semiconductor package and manufacturing method thereof
01/16/2014US20140017827 Apparatus and method for manufacturing a light-emitting device using a neutral particle beam
01/16/2014US20140017826 Semiconductor wafer evaluation method, semiconductor wafer evaluation device, and probe for semiconductor evaluation device
01/16/2014US20140017825 Ion implantation method and ion implantation apparatus
01/16/2014US20140017824 Polishing method
01/16/2014US20140017823 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
01/16/2014US20140017822 Method of manufacturing semiconductor device
01/16/2014US20140017041 Apparatus for testing a wafer
01/16/2014US20140017040 Article Storage Facility and Article Storage Method
01/16/2014US20140016110 Shear-Layer Chuck for Lithographic Apparatus
01/16/2014US20140015872 El display device, driving method thereof, and electronic equipment provided with the el display device
01/16/2014US20140015771 Touch screen panels and methods of fabricating the same
01/16/2014US20140015738 Light Emitting Device, Method of Driving a Light Emitting Device, Element Substrate, and Electronic Equipment
01/16/2014US20140015608 Compound semiconductor device, method for producing the same, power-supply unit, and high-frequency amplifier
01/16/2014US20140015598 Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages
01/16/2014US20140015564 Single event transient and upset mitigation for silicon-on-insulator cmos technology
01/16/2014US20140015150 Semiconductor device and manufacturing method of same
01/16/2014US20140015148 Semiconductor package and method of manufacturing the same
01/16/2014US20140015145 Multi-chip package and method of manufacturing the same
01/16/2014US20140015143 Methods of forming nano-scale pores, nano-scale electrical contacts, and memory devices including nano-scale electrical contacts, and related structures and devices
01/16/2014US20140015141 Backside Processing of Semiconductor Devices
01/16/2014US20140015140 Power module substrate, power module, and method for manufacturing power module substrate
01/16/2014US20140015139 Semiconductor device and method for manufacturing the same
01/16/2014US20140015138 Leakage Reducing Writeline Charge Protection Circuit
01/16/2014US20140015136 Ic device including package structure and method of forming the same
01/16/2014US20140015135 Self-aligned via interconnect using relaxed patterning exposure
01/16/2014US20140015132 Systems and Methods for Mechanical and Electrical Package Substrate Issue Mitigation
01/16/2014US20140015130 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
01/16/2014US20140015125 Semiconductor package and method of fabricating the same
01/16/2014US20140015124 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
01/16/2014US20140015123 Sensor package and method of forming same
01/16/2014US20140015122 Method of Forming Post Passivation Interconnects
01/16/2014US20140015115 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
01/16/2014US20140015114 Electronic device manufacturing method, electronic device, and chip assembly
01/16/2014US20140015111 Chip package and method for forming the same
01/16/2014US20140015109 Method of diced wafer transportation
01/16/2014US20140015108 Method of manufacturing single crystal ingot, and single crystal ingot and wafer manufactured thereby
01/16/2014US20140015107 Method to improve within wafer uniformity of cmp process
01/16/2014US20140015105 Semiconductor device and manufacturing method therefor
01/16/2014US20140015104 Methods for Introducing Carbon to a Semiconductor Structure and Structures Formed Thereby
01/16/2014US20140015097 Multi-Material Structures, Semiconductor Constructions and Methods of Forming Capacitors
01/16/2014US20140015092 Sealed shallow trench isolation region
01/16/2014US20140015091 Semiconductor device, method of manufacturing semiconductor device, and soi substrate
01/16/2014US20140015090 Bipolar transistor with high breakdown voltage
01/16/2014US20140015069 MEMS Devices, Packaged MEMS Devices, and Methods of Manufacture Thereof
01/16/2014US20140015068 Gate Structure, Semiconductor Device and Methods for Forming the Same
01/16/2014US20140015065 Cmos device and fabrication method
01/16/2014US20140015064 Cmos devices and fabrication method
01/16/2014US20140015063 Method for Forming Gate Structure, Method for Forming Semiconductor Device, and Semiconductor Device
01/16/2014US20140015062 Method for Forming Gate Structure, Method for Forming Semiconductor Device, and Semiconductor Device
01/16/2014US20140015061 Methods and structures for multiport memory devices
01/16/2014US20140015060 Stress enhanced cmos circuits and methods for their manufacture
01/16/2014US20140015057 Semiconductor device and method of manufacturing the same
01/16/2014US20140015056 Multi-gate mosfet and process thereof
01/16/2014US20140015055 Finfet structures and methods for fabricating the same
01/16/2014US20140015053 Self-protected metal-oxide-semiconductor field-effect transistor
01/16/2014US20140015050 Semiconductor device and manufacturing method thereof
01/16/2014US20140015048 FinFET with Trench Field Plate
01/16/2014US20140015047 Integrated Circuit Having a Vertical Power MOS Transistor
01/16/2014US20140015046 Current Sense Transistor with Embedding of Sense Transistor Cells
01/16/2014US20140015045 Apparatus and Method for Power MOS Transistor
01/16/2014US20140015039 Method of making an insulated gate semiconductor device having a shield electrode structure and structure therefor
01/16/2014US20140015038 Apparatus and Method for Power MOS Transistor
01/16/2014US20140015037 Novel Metal/Polysilicon Gate Trench Power Mosfet
01/16/2014US20140015031 Apparatus and Method for Memory Device