Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
---|
01/07/2014 | US8624218 Non-volatile memory structure and method for fabricating the same |
01/07/2014 | US8624214 Semiconductor device having a resistance variable element and a manufacturing method thereof |
01/07/2014 | US8624210 Ozone plenum as UV shutter or tunable UV filter for cleaning semiconductor substrates |
01/07/2014 | US8624153 Laser processing method and device |
01/07/2014 | US8624152 Negative coefficient thermal expansion engineered particles for composite fabrication |
01/07/2014 | US8624104 Heterojunction III-V solar cell performance |
01/07/2014 | US8624103 Nitride-based multi-junction solar cell modules and methods for making the same |
01/07/2014 | US8623773 Etchant for metal layer including copper or a copper alloy, method of manufacturing a display substrate using the same and display substrate |
01/07/2014 | US8623772 Method of forming patterns of semiconductor device |
01/07/2014 | US8623771 Method for fabricating micropattern of semiconductor device |
01/07/2014 | US8623770 Method for sidewall spacer line doubling using atomic layer deposition of a titanium oxide |
01/07/2014 | US8623769 Through hole forming method, nozzle plate and MEMS device |
01/07/2014 | US8623768 Methods for forming MEMS devices |
01/07/2014 | US8623767 Method for polishing aluminum/copper and titanium in damascene structures |
01/07/2014 | US8623766 Composition and method for polishing aluminum semiconductor substrates |
01/07/2014 | US8623765 Processed object processing apparatus, processed object processing method, pressure control method, processed object transfer method, and transfer apparatus |
01/07/2014 | US8623764 Composition and methods for forming metal films on semiconductor substrates using supercritical solvents |
01/07/2014 | US8623763 Protective layer for protecting TSV tips during thermo-compressive bonding |
01/07/2014 | US8623762 Semiconductor device and a method for making the semiconductor device |
01/07/2014 | US8623761 Method of forming a graphene cap for copper interconnect structures |
01/07/2014 | US8623760 Process for improving copper line cap formation |
01/07/2014 | US8623759 Method for manufacturing semiconductor device |
01/07/2014 | US8623758 Subtractive metal multi-layer barrier layer for interconnect structure |
01/07/2014 | US8623757 Producing a vertical transistor including reentrant profile |
01/07/2014 | US8623756 Reflow system and method for conductive connections |
01/07/2014 | US8623755 Self-aligned protection layer for copper post structure |
01/07/2014 | US8623754 Repairing anomalous stiff pillar bumps |
01/07/2014 | US8623753 Stackable protruding via package and method |
01/07/2014 | US8623752 Ohmic electrode for SiC semiconductor, method of manufacturing ohmic electrode for SiC semiconductor, semiconductor device, and method of manufacturing semiconductor device |
01/07/2014 | US8623751 Through-hole electrode substrate and method of manufacturing the same |
01/07/2014 | US8623750 Heat treatment method for promoting crystallization of high dielectric constant film |
01/07/2014 | US8623749 Reduction of stored charge in the base region of a bipolar transistor to improve switching speed |
01/07/2014 | US8623748 Method of forming a semiconductor structure |
01/07/2014 | US8623747 Silicon, aluminum oxide, aluminum nitride template for optoelectronic and power devices |
01/07/2014 | US8623745 Composition for forming gate insulating film for thin-film transistor |
01/07/2014 | US8623744 Die singulation method |
01/07/2014 | US8623743 Semiconductor chips having guard rings and methods of fabricating the same |
01/07/2014 | US8623742 Reduced STI loss for superior surface planarity of embedded stressors in densely packed semiconductor devices |
01/07/2014 | US8623741 Homogeneous porous low dielectric constant materials |
01/07/2014 | US8623740 Method of detaching semi-conductor layers at low temperature |
01/07/2014 | US8623739 Method of manufacturing semiconductor device using acid diffusion |
01/07/2014 | US8623738 Capacitor structure and fabrication method thereof |
01/07/2014 | US8623737 Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same |
01/07/2014 | US8623736 Memory devices with enhanced isolation of memory cells, systems including same and methods of forming same |
01/07/2014 | US8623735 Methods of forming semiconductor devices having capacitor and via contacts |
01/07/2014 | US8623734 Method to selectively grow phase change material inside a via hole |
01/07/2014 | US8623733 Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects |
01/07/2014 | US8623732 Methods of making laterally double diffused metal oxide semiconductor transistors having a reduced surface field structure |
01/07/2014 | US8623731 Methods of forming electrostatic discharge devices |
01/07/2014 | US8623730 Method for fabricating silicon-on-insulator transistor with self-aligned borderless source/drain contacts |
01/07/2014 | US8623729 Methods of fabricating semiconductor devices with silicon-germanium channels including hydrogen |
01/07/2014 | US8623728 Method for forming high germanium concentration SiGe stressor |
01/07/2014 | US8623727 Method for fabricating semiconductor device with buried gate |
01/07/2014 | US8623726 Method for filling a physical isolation trench and integrating a vertical channel array with a periphery circuit |
01/07/2014 | US8623725 Methods of forming capacitors |
01/07/2014 | US8623724 Method of manufacturing a semiconductor device including a capacitor electrically connected to a vertical pillar transistor |
01/07/2014 | US8623723 Method for manufacturing a semiconductor device with a bit line contact hole |
01/07/2014 | US8623722 Methods of making JFET devices with pin gate stacks |
01/07/2014 | US8623721 Silicide formation and associated devices |
01/07/2014 | US8623720 Method of fabricating a thin film transistor from amorphous silicon and organic light emitting diode display device having the thin film transistor |
01/07/2014 | US8623719 Method for forming and structure of a recessed source/drain strap for a MUGFET |
01/07/2014 | US8623718 Tilt implantation for forming FinFETs |
01/07/2014 | US8623717 Side-gate defined tunable nanoconstriction in double-gated graphene multilayers |
01/07/2014 | US8623716 Multi-gate semiconductor devices and methods of forming the same |
01/07/2014 | US8623715 Method for fabricating thin-film semiconductor device for display |
01/07/2014 | US8623714 Spacer protection and electrical connection for array device |
01/07/2014 | US8623713 Trench isolation structure |
01/07/2014 | US8623712 Bulk fin-field effect transistors with well defined isolation |
01/07/2014 | US8623711 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
01/07/2014 | US8623710 Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages |
01/07/2014 | US8623709 Methods of manufacture of top port surface mount silicon condenser microphone packages |
01/07/2014 | US8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof |
01/07/2014 | US8623707 Method of fabricating a semiconductor package with integrated substrate thermal slug |
01/07/2014 | US8623706 Microelectronic package with terminals on dielectric mass |
01/07/2014 | US8623705 Nanotube based vapor chamber for die level cooling |
01/07/2014 | US8623704 Adhesive/spacer island structure for multiple die package |
01/07/2014 | US8623703 Silicon device and silicon device manufacturing method |
01/07/2014 | US8623702 Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding |
01/07/2014 | US8623701 Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus |
01/07/2014 | US8623700 Inter-chip communication |
01/07/2014 | US8623699 Method of chip package build-up |
01/07/2014 | US8623698 Method for manufacturing semiconductor device |
01/07/2014 | US8623694 Methods of forming fast ion conductors and memory devices comprising diffused metal ions |
01/07/2014 | US8623693 Solar cell system manufacturing method |
01/07/2014 | US8623692 Method for manufacturing solar cell including etching |
01/07/2014 | US8623691 Solid state image pickup device and method of producing solid state image pickup device |
01/07/2014 | US8623690 X-Y address type solid state image pickup device and method of producing the same |
01/07/2014 | US8623689 Package process of backside illumination image sensor |
01/07/2014 | US8623688 Solar cell and method for manufacturing such a solar cell |
01/07/2014 | US8623687 Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures |
01/07/2014 | US8623686 Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same |
01/07/2014 | US8623683 Method of fabricating a nitride semiconductor light emitting device |
01/07/2014 | US8623682 Method for manufacturing high efficiency light-emitting diodes |
01/07/2014 | US8623681 Thin film transistor substrate, method for manufacturing the same, and liquid crystal display panel |
01/07/2014 | US8623680 LED chip package structure using sedimentation and method for making the same |
01/07/2014 | US8623679 Organic EL display unit, method of manufacturing the same, and solution used in method |
01/07/2014 | US8623678 Method for manufacturing LED |
01/07/2014 | US8623677 Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration |
01/07/2014 | US8623675 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device |
01/07/2014 | US8623674 Method of manufacturing liquid ejection head substrate |