Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/28/2014US8637397 Method for manufacturing a through hole electrode substrate
01/28/2014US8637396 Dielectric barrier deposition using oxygen containing precursor
01/28/2014US8637395 Methods for photo-patternable low-k (PPLK) integration with curing after pattern transfer
01/28/2014US8637394 Integrated circuit package system with flex bump
01/28/2014US8637393 Methods and structures for capping a structure with a protective coating
01/28/2014US8637392 Solder interconnect with non-wettable sidewall pillars and methods of manufacture
01/28/2014US8637391 Flip chip semiconductor assembly with variable volume solder bumps
01/28/2014US8637390 Metal gate structures and methods for forming thereof
01/28/2014US8637389 Resist feature and removable spacer pitch doubling patterning method for pillar structures
01/28/2014US8637388 Semiconductor device heat dissipation structure
01/28/2014US8637387 Layout design method and semiconductor integrated circuit
01/28/2014US8637386 Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same
01/28/2014US8637385 High voltage durability transistor and method for fabricating same
01/28/2014US8637384 FinFET parasitic capacitance reduction using air gap
01/28/2014US8637383 Strain relaxation using metal materials and related structures
01/28/2014US8637382 Layer transfer of films utilizing thermal flux regime for energy controlled cleaving
01/28/2014US8637381 High-k dielectric and silicon nitride box region
01/28/2014US8637380 Method of processing silicon and glass substrates using a laser peeling technique
01/28/2014US8637379 Device including a semiconductor chip and a carrier and fabrication method
01/28/2014US8637378 Semiconductor component and methods for producing a semiconductor component
01/28/2014US8637377 Capacitors and methods with praseodymium oxide insulators
01/28/2014US8637376 Method of manufacturing semiconductor device
01/28/2014US8637375 Method of manufacturing a tunnel transistor and IC comprising the same
01/28/2014US8637374 Method of fabricating self-aligned nanotube field effect transistor
01/28/2014US8637373 Transistors and methods of manufacturing the same
01/28/2014US8637372 Methods for fabricating a FINFET integrated circuit on a bulk silicon substrate
01/28/2014US8637371 Non-planar MOSFET structures with asymmetric recessed source drains and methods for making the same
01/28/2014US8637370 Integration of trench MOS with low voltage integrated circuits
01/28/2014US8637369 Method for manufacturing an integrated power device having gate structures within trenches
01/28/2014US8637368 Fabrication of MOS device with varying trench depth
01/28/2014US8637367 Method for producing an insulation layer between two electrodes
01/28/2014US8637366 Nonvolatile memory cell without a dielectric antifuse having high- and low-impedance states
01/28/2014US8637365 Spacer isolation in deep trench
01/28/2014US8637364 Semiconductor device and method of manufacturing the same
01/28/2014US8637363 Methods of manufacturing a semiconductor device having a node array
01/28/2014US8637361 Semiconductor nanostructures, semiconductor devices, and methods of making same
01/28/2014US8637360 Power devices with integrated protection devices: structures and methods
01/28/2014US8637359 Fin-last replacement metal gate FinFET process
01/28/2014US8637358 Field-effect-transistor with self-aligned diffusion contact
01/28/2014US8637357 CMOS Transistor with dual high-k gate dielectric and method of manufacture thereof
01/28/2014US8637356 Method of integrating a single nanowire into a nanocircuit
01/28/2014US8637355 Actuating transistor including single layer reentrant profile
01/28/2014US8637354 Semiconductor device and manufacturing method thereof
01/28/2014US8637353 Through silicon via repair
01/28/2014US8637352 Ball grid array to pin grid array conversion
01/28/2014US8637351 Methods for making micro needles and applications thereof
01/28/2014US8637350 Method of manufacturing chip-stacked semiconductor package
01/28/2014US8637349 Method and apparatus for integrated-circuit battery devices
01/28/2014US8637348 Semiconductor device and method for manufacturing the same
01/28/2014US8637347 Method for manufacturing semiconductor device
01/28/2014US8637342 Phase change memory with threshold switch select device
01/28/2014US8637341 Semiconductor module
01/28/2014US8637340 Patterning of silicon oxide layers using pulsed laser ablation
01/28/2014US8637339 Diode energy converter for chemical kinetic electron energy transfer
01/28/2014US8637336 Method for producing semiconductor wafer
01/28/2014US8637335 Photonic modulator with a semiconductor contact
01/28/2014US8637332 Micro-reflectors on a substrate for high-density LED array
01/28/2014US8637331 Transparent polarized light-emitting device
01/28/2014US8637329 Method for producing semiconductor optical integrated device
01/28/2014US8637328 Integrated circuit having doped semiconductor body and method
01/28/2014US8636873 Plasma processing apparatus and structure therein
01/28/2014US8636871 Plasma processing apparatus, plasma processing method and storage medium
01/28/2014US8636561 Polishing head and polishing apparatus
01/28/2014US8636458 Integrated post-exposure bake track
01/28/2014US8635972 Device for forming a film by deposition from a plasma
01/28/2014US8635971 Tunable uniformity in a plasma processing system
01/28/2014CA2572244C Methods of fabricating nitride-based transistors with a cap layer and a recessed gate
01/28/2014CA2395004C Solution processing
01/28/2014CA2394895C Forming interconnects
01/23/2014WO2014015272A1 High frequency filter for improved rf bias signal stability
01/23/2014WO2014015237A1 Organosilane precursors for ald/cvd silicon-containing film applications
01/23/2014WO2014014968A1 Integrated circuits having integrated acoustic communication links
01/23/2014WO2014014907A1 Method for high aspect ratio photoresist removal in pure reducing plasma
01/23/2014WO2014014878A1 Film deposition assisted by angular selective etch
01/23/2014WO2014014822A1 Two piece shutter disk assembly for a substrate process chamber
01/23/2014WO2014014811A1 Method of processing a device substrate
01/23/2014WO2014014809A1 Spacer shaper formation with conformal dielectric film for void free pre-metal dielectric layer gap fill
01/23/2014WO2014014802A1 Method of reducing formation of sige abnormal growths on polycrystalline electrodes for strained-channel pmos transistors
01/23/2014WO2014014751A1 Gst cmp slurries
01/23/2014WO2014014661A1 Sensors in carrier head of a cm p system
01/23/2014WO2014014652A1 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods
01/23/2014WO2014014646A1 Pedestal with multi-zone temperature control and multiple purge capabilities
01/23/2014WO2014014643A1 Methods of forming wire interconnect structures
01/23/2014WO2014014639A1 Semiconductor constructions, memory cells, memory arrays and methods of forming memory cells
01/23/2014WO2014014568A1 Symmetrical inductively coupled plasma source with coaxial rf feed and coaxial shielding
01/23/2014WO2014014566A1 Symmetrical inductively coupled plasma source with symmetrical flow chamber
01/23/2014WO2014014446A1 Endpointing for focused ion beam processing
01/23/2014WO2014014420A1 Masked etch-back method and process for fabrication of selective emitter silicon wafer solar cells
01/23/2014WO2014014418A1 Method and apparatus for the engagement of ic units
01/23/2014WO2014014178A1 Semiconductor light-emitting element, and production method, thin-film vapour-deposition device and thin-film vapour-deposition method for same
01/23/2014WO2014014125A1 Etching method, and method of producing semiconductor substrate product and semiconductor device using the same
01/23/2014WO2014014124A1 Etching method, and method of producing semiconductor substrate product and semiconductor device using the same, as well as kit for preparation of etching liquid
01/23/2014WO2014014117A1 Passivation film, coating material, solar-cell element, and silicon substrate with passivation film attached thereto
01/23/2014WO2014014116A1 Passivation film, coating material, solar-cell element, and silicon substrate with passivation film attached thereto
01/23/2014WO2014014115A1 Semiconductor substrate with passivation layer and method of manufacturing same
01/23/2014WO2014014114A1 Composition for forming passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell
01/23/2014WO2014014113A1 Solar cell element, production method therefor, and solar cell module
01/23/2014WO2014014112A1 Solar cell element, production method therefor, and solar cell module
01/23/2014WO2014014111A1 Solar cell element, production method for solar cell element, and solar cell module
01/23/2014WO2014014110A1 Composition for forming passivation layer, semiconductor substrate having passivation layer, production method for semiconductor substrate having passivation layer, solar cell element, production method for solar cell element, and solar cell