| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2014 | DE112011104976T5 Gasphasenabschneidungsvorrichtung und Gasphasenabschneidungsverfahren Gasphasenabschneidungsvorrichtung and Gasphasenabschneidungsverfahren |
| 01/23/2014 | DE112011103249B4 Halbleitereinheit mit Gate-Stapel und ein Verfahren zu deren Herstellung sowie die Verwendung einer Gate-Stapel-Struktur in einer Halbleitereinheit Semiconductor device with gate stack and a method for their preparation and the use of a gate stack structure in a semiconductor device |
| 01/23/2014 | DE10350036B4 Verfahren zum Vereinzeln von Halbleiterchips und entsprechende Halbleiterchipanordnung A method for separating semiconductor chips and semiconductor chip assembly corresponding |
| 01/23/2014 | DE10310552B4 Feldeffekttransistor und Halbleiterchip mit diesem Feldeffekttransistor Field effect transistor and the semiconductor chip with the field effect transistor |
| 01/23/2014 | DE10259292B4 Verfahren zum Herstellen eines gleichmäßigen Kontaktes und damit hergestellter gleichmäßiger Kontakt A method for producing a uniform contact and thus made uniform contact |
| 01/23/2014 | DE102013214196A1 Halbleiterbauelement Semiconductor device |
| 01/23/2014 | DE102013107787A1 Chipbaugruppe und verfahren zum herstellen einer chipbaugruppe Chip package and method of fabricating a chip package |
| 01/23/2014 | DE102013107632A1 Verfahren zum Herstellen von Halbleitervorrichtungen mittels Ionenimplantation und Halbleitervorrichtung A method of manufacturing semiconductor devices by ion implantation and semiconductor device |
| 01/23/2014 | DE102013107593A1 Eingebetteter ic-baustein und verfahren zur herstellung eines eingebetteten ic-bausteins Embedded IC module and process for the preparation of an embedded IC module |
| 01/23/2014 | DE102013107164A1 Halbleiterpackages mit mehreren Leadframes und Verfahren zu ihrer Herstellung Semiconductor packages including a plurality of lead frames and methods for their preparation |
| 01/23/2014 | DE102013107123A1 Ladungskompensations-Halbleitervorrichtung Charge compensation semiconductor device |
| 01/23/2014 | DE102013104867A1 III-V-Verbindungshalbleiter-Vorrichtung, die Metallkontakt aufweist, und Verfahren zu ihrer Herstellung III-V compound semiconductor device having metal contact, and methods for their preparation |
| 01/23/2014 | DE102013100029B3 Contact structure of semiconductor device e.g. MOSFET mounted in e.g. integrated circuit (IC), has metal layers that are formed above dielectric layer, to cover opening of dielectric layer |
| 01/23/2014 | DE102012221452A1 Vorrichtung zum Separieren von Wafern An apparatus for separating wafers |
| 01/23/2014 | DE102012217471A1 Chip mit einer füllstruktur Chip with a dummy |
| 01/23/2014 | DE102012204085B4 Halbleitervorrichtung mit Wärmeverteiler und Lotlage und Verfahren zum Herstellen einer solchen A semiconductor device comprising heat spreader and brazing filler metal sheet and method for producing such |
| 01/23/2014 | DE102012111786A1 Hybrid-Verbindungsaufbau und Verfahren zur Herstellung desselben Of the same hybrid connection setup and process for preparing |
| 01/23/2014 | DE102012106607A1 Method for sealing solar modules e.g. electrical functioning unencapsulated solar modules, in industrial environment, involves dimensioning length of semi-finished product by cross-cutting, where semi-finished product is sealed |
| 01/23/2014 | DE102012106414A1 Arrangement for preventing damage to electronic component on circuit substrate, has light source which is switched on/off in viewing microscope, if electrostatic discharge (ESD) bracelet is electrically connected to switching device |
| 01/23/2014 | DE102010041917B4 Schaltungsanordnung und Verfahren zu deren Herstellung Circuit arrangement and method for their preparation |
| 01/23/2014 | DE102010028460B4 Verfahren zum Herstellen eines Halbleiterbauelements mit einer reduzierten Defektrate in Kontakten, das Austauschgateelektrodenstrukturen unter Anwendung einer Zwischendeckschicht aufweist Includes method for producing a semiconductor device having a reduced defect rate in contacts, the replacement gate electrode structures using an intermediate coating layer |
| 01/23/2014 | DE102009030958B4 Halbleiteranordnung mit einem Verbindungselement und Verfahren zur Herstellung einer solchen A semiconductor device comprising a connecting element and methods for producing such |
| 01/23/2014 | DE102007004616B4 Halbleitervorrichtung mit Super-Junction-Struktur und Verfahren zur Herstellung derselben A semiconductor device having super junction structure and method of manufacturing the same |
| 01/22/2014 | EP2688121A2 Organic layer deposition apparatus, method of manufacturing organic light-emitting display apparatus by using the same, and organic light-emitting display apparatus manufactured by the method |
| 01/22/2014 | EP2688116A1 Ferroelectric thin film and method for producing same |
| 01/22/2014 | EP2688105A2 High electron mobility transistors and methods of manufacturing the same |
| 01/22/2014 | EP2688104A1 Semiconductor device |
| 01/22/2014 | EP2688102A1 Semiconductor device and manufacturing method therefor |
| 01/22/2014 | EP2688093A1 Method of and apparatus for self-assembly of components on a substrate |
| 01/22/2014 | EP2688092A1 Semiconductor die with a through silicon via and corresponding manufacturing process |
| 01/22/2014 | EP2688091A1 Method for producing a cavity by anisotropically removing material from a substrate |
| 01/22/2014 | EP2688090A1 Substrate processing system, method of confirmation of its state of use, and method of prevention of illicit use |
| 01/22/2014 | EP2688089A1 Method for selective growth of highly doped group IV-Sn semiconductor materials |
| 01/22/2014 | EP2687589A2 Copper passivating post-chemical mechanical polishing cleaning composition and method of use |
| 01/22/2014 | EP2686888A1 Mechanically stable device based on nano/micro wires and having improved optical properties and process for producing it |
| 01/22/2014 | EP2686882A1 Memory cell having closed curve structure |
| 01/22/2014 | EP2686881A1 Semiconductor structure having an integrated double-wall capacitor for embedded dynamic random access memory (edram) and method to form the same |
| 01/22/2014 | EP2686878A1 Silicon on insulator structures having high resistivity regions in the handle wafer and methods for producing such structures |
| 01/22/2014 | EP2686877A2 Method and apparatus for plasma dicing a semi-conductor wafer |
| 01/22/2014 | EP2686876A1 Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
| 01/22/2014 | EP2686875A2 Methods of forming at least one conductive element, methods of forming a semiconductor structure, methods of forming a memory cell and related semiconductor structures |
| 01/22/2014 | EP2686874A2 Oxide removal from semiconductor surfaces |
| 01/22/2014 | EP2686873A1 Composite semiconductor substrate, semiconductor device, and manufacturing method |
| 01/22/2014 | EP1266402B1 Semiconductor element and method for producing the same |
| 01/22/2014 | CN203406280U Three-dimensionally packaged SDRAM memory with capacity of 512M x 8bit |
| 01/22/2014 | CN203406275U Accurate locating pasting device |
| 01/22/2014 | CN203406274U Transmission guide device for capacitor pieces |
| 01/22/2014 | CN203406273U LED holding device |
| 01/22/2014 | CN203406272U Simple bending device used for flexible substrate packaging |
| 01/22/2014 | CN203404383U Inflatable?seat and?air valve structure thereof |
| 01/22/2014 | CN203403037U Light cover conveying box |
| 01/22/2014 | CN1900819B Photomask blank, photomask and fabrication method thereof |
| 01/22/2014 | CN103534811A Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2014 | CN103534810A Semiconductor device and method for producing same |
| 01/22/2014 | CN103534809A Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2014 | CN103534807A Semiconductor structure having an integrated double-wall capacitor for embedded dynamic random access memory (EDRAM) and method to form the same |
| 01/22/2014 | CN103534800A Process for forming a crack in a material |
| 01/22/2014 | CN103534799A Apparatus and methods for positioning a substrate using capacitive sensors |
| 01/22/2014 | CN103534798A Overhead transport carriage |
| 01/22/2014 | CN103534797A Wire bonding device and bonding method |
| 01/22/2014 | CN103534796A Semiconductor device and method for manufacturing semiconductor device |
| 01/22/2014 | CN103534795A Component manufacturing method and component |
| 01/22/2014 | CN103534794A Device packaging with substrates having embedded lines and metal defined pads |
| 01/22/2014 | CN103534793A Select devices |
| 01/22/2014 | CN103534792A Process for producing semiconductor device and semiconductor device |
| 01/22/2014 | CN103534791A Method for manufacturing semiconductor epitaxial wafer, semiconductor epitaxial wafer, and method for manufacturing solid-state image pickup element |
| 01/22/2014 | CN103534790A Cmp pad conditioner, and method for producing the cmp pad conditioner |
| 01/22/2014 | CN103534789A Al alloy film for semiconductor devices |
| 01/22/2014 | CN103534788A Substrate-replacement method |
| 01/22/2014 | CN103534787A Substrate-replacement device |
| 01/22/2014 | CN103534786A Oxide removal from semiconductor surfaces |
| 01/22/2014 | CN103534646A Positive photosensitive siloxane composition |
| 01/22/2014 | CN103534382A In2o3-sno2-zno sputtering target |
| 01/22/2014 | CN103534196A Method for achieving smooth side walls after bosch etch process |
| 01/22/2014 | CN103534064A Method for adjusting position of polishing head in heightwise direction, and method for polishing workpiece |
| 01/22/2014 | CN103531726A Laser bonding method |
| 01/22/2014 | CN103531678A Method for removing GaN-based epitaxial layer on substrate |
| 01/22/2014 | CN103531677A Dual-welding-arm system for automatic LED (Light Emitting Diode) wafer sorting machine |
| 01/22/2014 | CN103531674A Method of manufacturing an led |
| 01/22/2014 | CN103531673A Method of manufacturing an led |
| 01/22/2014 | CN103531666A Method for processing reworked monocrystalline silicon wafer by physical metallurgy method |
| 01/22/2014 | CN103531642A Schottky device provided with groove terminal structures and preparation method thereof |
| 01/22/2014 | CN103531641A A thin-film transistor and a manufacturing method thereof |
| 01/22/2014 | CN103531640A Thin film transistor, array substrate, manufacturing method of array substrate and display device |
| 01/22/2014 | CN103531639A Thin film transistor, preparation method of thin film transistor, array substrate and display device |
| 01/22/2014 | CN103531635A Nanowire based vertical circular grating transistor and preparation method thereof |
| 01/22/2014 | CN103531633A Drain extended mos device for bulk finfet technology |
| 01/22/2014 | CN103531632A Semiconductor device including an edge area and method of manufacturing the semiconductor device |
| 01/22/2014 | CN103531631A Semiconductor device and driver circuit with a current carrying region and isolation structure interconnected through a resistor circuit, and method of manufacture thereof |
| 01/22/2014 | CN103531630A 高击穿电压ldmos器件 High breakdown voltage ldmos devices |
| 01/22/2014 | CN103531628A Groove Schottky MOS semiconductor device and preparation method thereof |
| 01/22/2014 | CN103531627A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/22/2014 | CN103531624A Stress-controlled HEMT |
| 01/22/2014 | CN103531623A Semiconductor nano-structure based transistor device and preparation method thereof |
| 01/22/2014 | CN103531622A High-voltage fast thyristor |
| 01/22/2014 | CN103531620A Insulated gate bipolar translator (IGBT) chip based on N-type injection layers and manufacturing method thereof |
| 01/22/2014 | CN103531619A Lateral insulated gate bipolar transistor structure with low parasitic bjt gain and stable threshold voltage |
| 01/22/2014 | CN103531618A Double-gate fin-type field effect transistor and manufacturing method thereof |
| 01/22/2014 | CN103531617A Schottky device provided with groove terminal structures and preparation method thereof |
| 01/22/2014 | CN103531616A Groove-type fast recovery diode and manufacturing method thereof |